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LM4F110H5QRFIGR

Texas Instruments

LM4F110H5QRFIGR by Texas Instruments

LM4F110H5QRFIGR by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 25 MHz, making it suitable for industrial applications requiring high-speed processing and control. With features like ADC and DMA channels, this Cortex-M4F CPU family device offers versatile functionality in a compact package ideal for embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,339 parts In-Stock

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Digiode

USA . 4,174 parts In-Stock

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4,174

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Distributors (Availability)

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AZTECH Wire

Italy . 680 parts In-Stock

1+ parts

$8.130

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680

$8.130

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One Stop Electronics

USA . 423 parts In-Stock

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$13.000

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Parana Technologies

USA . 1,609 parts In-Stock

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$47.166

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ChromeModa Solutions

Germany . 5,789 parts In-Stock

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$52.996

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$43.457

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5,789

$52.996

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IDEA Electronic Components Group

UK . 1,504 parts In-Stock

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$52.996

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$50.346

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$47.696

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1,504

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$47.696

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Corphita

USA . 4,604 parts In-Stock

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DigiPath Technology Company

USA . 192 parts In-Stock

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$47.781

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the LM4F110H5QRFIGR microcontroller. This powerful device boasts a 32-bit CPU family, Cortex-M4F, providing exceptional performance for a wide range of applications. With features like ADC and DMA channels, PWM channels, and a generous amount of RAM, this microcontroller offers unparalleled value and versatility. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Elevate your projects with the LM4F110H5QRFIGR microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material is durable and provides good protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount design allows for easy and compact integration onto PCBs, saving space and making the product suitable for smaller applications.

Maximum Supply Voltage: 1.32 V

Operates efficiently with a maximum supply voltage of 1.32V, ensuring stable performance without any risk of overvoltage damage.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex computations and data processing with speed and accuracy.

Power Supplies (V): 1.2,3.3

Supports multiple power supplies at 1.2V and 3.3V, offering flexibility for different voltage requirements in various applications.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with external devices and peripherals.

Maximum Clock Frequency: 25 MHz

Operates at a maximum clock frequency of 25MHz, allowing for fast execution of instructions and efficient multitasking capabilities.

ADC Channels: YES

Built-in ADC channels enable analog signal processing, making the microcontroller suitable for sensor interface and data acquisition applications.

ROM Words: 262144

With a ROM capacity of 262144 words, the microcontroller can store a large amount of program code and data for complex operations.

RAM Bytes: 32768

Offers 32768 bytes of RAM for data storage and temporary variable usage, allowing for efficient data manipulation and processing.

Technical Specifications

Microcontrollers LM4F110H5QRFIGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES AT 3.3 V I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

43

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F110H5QRFIGR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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