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LM4F111E5QR

Texas Instruments

LM4F111E5QR by Texas Instruments

LM4F111E5QR by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 25 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a max clock frequency of 25 MHz. With a package style of flatpack and low profile, it offers ROM programmability via flash memory and operates within an industrial temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,250 parts In-Stock

1+ parts

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2,250

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Digiode

USA . 1,347 parts In-Stock

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1,347

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 856 parts In-Stock

1+ parts

$7.206

100+ parts

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856

$7.206

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One Stop Electronics

USA . 435 parts In-Stock

1+ parts

$29.000

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435

$29.000

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Parana Technologies

USA . 2 parts In-Stock

1+ parts

$52.190

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2

$52.190

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DigiPath Technology Company

USA . 1,733 parts In-Stock

1+ parts

$57.467

100+ parts

$52.870

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1,733

$57.467

$52.870

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ChromeModa Solutions

Germany . 3,301 parts In-Stock

1+ parts

$58.640

100+ parts

$48.085

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3,301

$58.640

$48.085

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IDEA Electronic Components Group

UK . 540 parts In-Stock

1+ parts

$58.640

100+ parts

$55.708

1k+ parts

$52.776

10k+ parts

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540

$58.640

$55.708

$52.776

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Corphita

USA . 4,459 parts In-Stock

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4,459

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Overview

Discover the LM4F111E5QR by Texas Instruments, a top-quality microcontroller designed to exceed your expectations. With a reputable manufacturer like Texas Instruments behind it, you can trust in the reliability and performance of this product. Ideal for a wide range of applications, from industrial automation to consumer electronics, this microcontroller offers unmatched value and benefits. Unlock endless possibilities with its advanced features and innovative design. Elevate your projects with the LM4F111E5QR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring reliable performance in various conditions.

Surface Mount: YES

Surface mount technology makes it easier to integrate this microcontroller into compact designs and circuit boards.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage allows for versatility in power sources, accommodating different voltage requirements.

Package Shape: SQUARE

The square shape of the package helps in efficient placement and mounting on the circuit board, saving space.

Bit Size: 32

A 32-bit microcontroller offers enhanced processing power and capabilities compared to lower-bit versions, suitable for complex tasks.

No. of Terminals: 64

With 64 terminals, this microcontroller can support a wide range of input and output connections, facilitating connectivity with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The fine pitch and low-profile design of the package style enable compact and space-saving installations, ideal for small-scale applications.

Minimum Supply Voltage: 2.97 V

The low minimum supply voltage allows for efficient power consumption and operation at lower voltage levels, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in a variety of environmental conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables this microcontroller to function effectively in extreme cold environments, increasing its versatility.

ADC Channels: YES

The presence of ADC (Analog-to-Digital Converter) channels allows for the conversion of analog signals to digital data, essential for interfacing with analog sensors and devices.

DMA Channels: YES

Integrated DMA (Direct Memory Access) channels enhance data transfer efficiency and speed, reducing the workload on the CPU and improving overall system performance.

Terminal Position: QUAD

The quad terminal position provides a convenient layout for easy connection and maintenance, simplifying the assembly process.

Maximum Seated Height: 1.6 mm

The low seated height of the microcontroller package ensures compatibility with slim and compact designs, facilitating space-constrained installations.

Width: 10 mm

The compact width of the microcontroller makes it suitable for small-scale applications and tight spaces, offering flexibility in design layouts.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency allows for fast data processing and response times, making this microcontroller suitable for high-speed applications.

Length: 10 mm

The small length of the microcontroller package contributes to its compact form factor, ideal for space-limited designs and applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable operation in harsh industrial environments, making this microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient and streamlined processing capabilities, enhancing overall performance and responsiveness.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable operation, making this microcontroller energy-efficient and durable.

Terminal Form: GULL WING

The gull-wing terminal form enables easy soldering and secure connection to the circuit board, ensuring reliable signal transmission and electrical connections.

Nominal Supply Voltage: 3.3 V

The consistent nominal supply voltage ensures stable and reliable operation, preventing voltage fluctuations and ensuring consistent performance.

PWM Channels: YES

The presence of PWM (Pulse Width Modulation) channels enables precise control of output signals, essential for applications requiring variable speed or intensity control.

ROM Programmability: FLASH

Using flash memory for ROM programmability allows for easy and quick reprogramming of the microcontroller, enhancing flexibility and adaptability to changing requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm facilitates close arrangement of terminals, enabling high-density mounting and compact designs.

Speed: 80 rpm

With a speed of 80 rpm, this microcontroller can perform tasks and processes efficiently, meeting the demand for responsive and high-speed operations.

No. of I/O Lines: 49

Having 49 I/O (Input/Output) lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the versatility of this microcontroller.

Technical Specifications

Microcontrollers LM4F111E5QR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

49

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F111E5QR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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