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LM4F110H5QRFIG

Texas Instruments

LM4F110H5QRFIG by Texas Instruments

LM4F110H5QRFIG by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, 32768 bytes of RAM, and 262144 ROM words. It operates at a max clock frequency of 25 MHz and has ADC and DMA channels for versatile applications in industrial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,325 parts In-Stock

1+ parts

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5,325

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Digiode

USA . 3,058 parts In-Stock

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3,058

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$14.674

100+ parts

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423

$14.674

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Parana Technologies

USA . 251 parts In-Stock

1+ parts

$23.292

100+ parts

-

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$23.931

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251

$23.292

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$23.931

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One Stop Electronics

USA . 971 parts In-Stock

1+ parts

$25.000

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971

$25.000

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DigiPath Technology Company

USA . 1,594 parts In-Stock

1+ parts

$25.648

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$23.596

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1,594

$25.648

$23.596

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IDEA Electronic Components Group

UK . 2,130 parts In-Stock

1+ parts

$26.171

100+ parts

$24.862

1k+ parts

$23.554

10k+ parts

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2,130

$26.171

$24.862

$23.554

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ChromeModa Solutions

Germany . 796 parts In-Stock

1+ parts

$26.171

100+ parts

$21.460

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796

$26.171

$21.460

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Corphita

USA . 4,449 parts In-Stock

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Overview

Experience the cutting-edge technology and reliability of Texas Instruments with the LM4F110H5QRFIG microcontroller. Ideal for a wide range of applications, this powerful 32-bit device offers high performance and versatility. With features like ADC and DMA channels, PWM capabilities, and a compact design, this microcontroller delivers exceptional value and benefits to customers. Trust in Texas Instruments for quality products that exceed expectations in industrial-grade environments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on the PCB, making it suitable for compact designs.

Bit Size: 32

With a 32-bit architecture, the microcontroller can process data and instructions faster and more efficiently compared to lower bit sizes.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages provides flexibility in system design and integration with various components.

No. of Terminals: 64

Having 64 terminals allows for a sufficient number of connections to external peripherals and components, enhancing the microcontroller's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style options offer versatility in mounting and placement, catering to different design requirements and constraints.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage ensures efficient power consumption and operation even in low power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for use in harsh environments and industrial applications where temperature fluctuations are common.

CPU Family: CORTEX-M4F

The use of CORTEX-M4F CPU family provides high performance, low power consumption, and advanced features for optimized processing capabilities.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature makes the microcontroller suitable for use in extreme cold conditions without impacting performance.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and signals, enabling a wider range of applications.

DMA Channels: YES

DMA channels help in efficient data transfer and processing without CPU involvement, improving overall performance and responsiveness.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections, reducing the risk of signal interference or disconnection.

ROM Words: 262144

With a large ROM capacity, the microcontroller can store a significant amount of program code and data, enhancing its versatility and functionality.

Maximum Seated Height: 1.6 mm

The low maximum seated height is beneficial for compact designs and space-constrained applications, enabling the microcontroller to be used in various form factors.

Width: 10 mm

The compact width dimension allows for efficient PCB layout and space optimization, especially in designs with limited board real estate.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency enables high-speed operation and processing, making the microcontroller suitable for applications requiring rapid data processing.

Length: 10 mm

The small length dimension contributes to the overall compact footprint of the microcontroller, facilitating integration into space-constrained designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the microcontroller can withstand demanding environmental conditions and maintain reliable performance in rugged settings.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the peripheral IC type ensures efficient and streamlined processing of instructions, leading to improved performance and power efficiency.

RAM Bytes: 32768

The ample RAM capacity allows for efficient data storage and processing, enhancing the microcontroller's performance in multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications, making it a suitable choice for energy-efficient designs.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections on the PCB, ensuring stable signal transmission and reducing the risk of signal degradation or loss.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures stable and efficient operation of the microcontroller, contributing to reliable performance in various operating conditions.

PWM Channels: YES

The presence of PWM channels allows the microcontroller to generate precise and adjustable pulse-width modulation signals, essential for motor control and analog signal generation.

ROM Programmability: FLASH

The flash ROM programmability enables easy and flexible firmware updates, allowing for quick and seamless modifications to the microcontroller's program code.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting and connection, making the microcontroller suitable for compact and intricately designed PCB layouts.

Speed: 80 rpm

With a maximum speed of 80 rpm, the microcontroller can deliver fast and responsive performance, ideal for applications requiring quick data processing and task execution.

No. of I/O Lines: 43

Having 43 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility and functionality.

Technical Specifications

Microcontrollers LM4F110H5QRFIG attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES AT 3.3 V I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

43

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F110H5QRFIG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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