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LM4F110E5QR

Texas Instruments

LM4F110E5QR by Texas Instruments

LM4F110E5QR by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 25 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a max clock frequency of 25 MHz. With a low profile package style and GULL WING terminal form, it offers versatile performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,907 parts In-Stock

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1,907

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Digiode

USA . 927 parts In-Stock

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927

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Distributors (Availability)

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AZTECH Wire

Italy . 444 parts In-Stock

1+ parts

$10.726

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444

$10.726

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One Stop Electronics

USA . 911 parts In-Stock

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$35.000

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911

$35.000

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Parana Technologies

USA . 763 parts In-Stock

1+ parts

$66.384

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763

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IDEA Electronic Components Group

UK . 1,954 parts In-Stock

1+ parts

$74.589

100+ parts

$70.860

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$67.130

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1,954

$74.589

$70.860

$67.130

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ChromeModa Solutions

Germany . 1,659 parts In-Stock

1+ parts

$74.589

100+ parts

$61.163

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1,659

$74.589

$61.163

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DigiPath Technology Company

USA . 2,296 parts In-Stock

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$67.249

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2,296

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$67.249

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Corphita

USA . 567 parts In-Stock

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Overview

Discover the LM4F110E5QR microcontroller by Texas Instruments, a top-quality solution for a wide range of applications. With advanced technology and innovative design, Texas Instruments delivers reliable products that meet the highest industry standards. Perfect for various industrial uses, this microcontroller offers unmatched performance, efficiency, and versatility. Unlock endless possibilities with the LM4F110E5QR and experience the exceptional value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures the product is long-lasting and can withstand various environmental conditions.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and performance.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables precise analog signal measurements.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency allows for fast processing speeds and efficient operation.

ROM Programmability: FLASH

The Flash ROM programmability allows for convenient and flexible programming of the microcontroller.

Technical Specifications

Microcontrollers LM4F110E5QR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

43

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F110E5QR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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