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LM4F110C4QRFIG

Texas Instruments

LM4F110C4QRFIG by Texas Instruments

LM4F110C4QRFIG by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 25 MHz. It features a Cortex-M4F CPU family, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,172 parts In-Stock

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5,172

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Digiode

USA . 2,142 parts In-Stock

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2,142

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 752 parts In-Stock

1+ parts

$8.167

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752

$8.167

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Parana Technologies

USA . 1,458 parts In-Stock

1+ parts

$23.933

100+ parts

$2,222.541

1k+ parts

$21.540

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1,458

$23.933

$2,222.541

$21.540

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DigiPath Technology Company

USA . 2,160 parts In-Stock

1+ parts

$26.353

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2,160

$26.353

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ChromeModa Solutions

Germany . 2,725 parts In-Stock

1+ parts

$26.891

100+ parts

$22.051

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2,725

$26.891

$22.051

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IDEA Electronic Components Group

UK . 449 parts In-Stock

1+ parts

$26.891

100+ parts

$25.546

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$24.202

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449

$26.891

$25.546

$24.202

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One Stop Electronics

USA . 1,346 parts In-Stock

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$32.000

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1,346

$32.000

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Corphita

USA . 3,874 parts In-Stock

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3,874

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Overview

Experience the cutting-edge technology of Texas Instruments with the LM4F110C4QRFIG microcontroller. With its advanced features and high-quality manufacturing, this device is perfect for a wide range of applications in various industries. From streamlined workflows to enhanced performance, this microcontroller offers unmatched value and benefits to customers. Don't settle for anything less than the best - choose Texas Instruments for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Maximum Supply Voltage: 3.63 V

Allows for a wide range of input voltages, providing flexibility in different applications.

Bit Size: 32

Offers a high level of data processing capability, suitable for various complex tasks.

No. of Terminals: 64

Provides ample connectivity options for peripherals and external devices.

CPU Family: CORTEX-M4F

High-performance Cortex-M4F architecture ensures efficient processing and performance.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, expanding the device's functionality.

RAM Bytes: 24576

Ample RAM capacity for storing and processing data, facilitating smooth operation.

Speed: 80 rpm

Suitable for real-time applications that require fast processing and response times.

Technical Specifications

Microcontrollers LM4F110C4QRFIG attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

43

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F110C4QRFIG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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