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LM4F110B2QRFIG

Texas Instruments

LM4F110B2QRFIG by Texas Instruments

Texas Instruments LM4F110B2QRFIG is a 32-bit microcontroller with Cortex-M4F CPU family. It features 64 terminals, 12288 bytes of RAM, and operates at up to 25 MHz clock frequency. Ideal for industrial applications requiring ADC and DMA channels, with flash ROM programmability and 43 I/O lines for versatile connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,788 parts In-Stock

1+ parts

-

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7,788

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Digiode

USA . 2,712 parts In-Stock

1+ parts

-

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2,712

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 814 parts In-Stock

1+ parts

$5.002

100+ parts

-

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814

$5.002

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Parana Technologies

USA . 739 parts In-Stock

1+ parts

$26.710

100+ parts

$2,480.409

1k+ parts

$24.039

10k+ parts

-

739

$26.710

$2,480.409

$24.039

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One Stop Electronics

USA . 639 parts In-Stock

1+ parts

$29.000

100+ parts

-

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639

$29.000

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DigiPath Technology Company

USA . 104 parts In-Stock

1+ parts

$29.411

100+ parts

$27.058

1k+ parts

-

10k+ parts

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104

$29.411

$27.058

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ChromeModa Solutions

Germany . 5,680 parts In-Stock

1+ parts

$30.011

100+ parts

$24.609

1k+ parts

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5,680

$30.011

$24.609

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IDEA Electronic Components Group

UK . 1,594 parts In-Stock

1+ parts

$30.011

100+ parts

$28.510

1k+ parts

$27.010

10k+ parts

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1,594

$30.011

$28.510

$27.010

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Corphita

USA . 581 parts In-Stock

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581

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Overview

Unleash the power of innovation with the LM4F110B2QRFIG microcontroller by Texas Instruments. Crafted with precision and expertise, this cutting-edge device offers unmatched performance and reliability for a variety of applications. From smart appliances to industrial automation, this versatile microcontroller delivers seamless functionality and efficiency. Experience the next level of technology with the LM4F110B2QRFIG and elevate your projects to new heights. Innovate with confidence and unleash endless possibilities with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product, making it suitable for various environmental conditions.

Maximum Supply Voltage: 3.63 V

Allows for a higher supply voltage which can support demanding applications without risk of damaging the microcontroller.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex computations and data processing efficiently.

CPU Family: CORTEX-M4F

Utilizes an advanced Cortex-M4F processor which offers high performance and energy efficiency for embedded applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being based on a RISC architecture, the microcontroller can execute instructions quickly and efficiently, enhancing overall system performance.

Technical Specifications

Microcontrollers LM4F110B2QRFIG attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

43

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.5 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F110B2QRFIG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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