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LM4F110E5QRFIG

Texas Instruments

LM4F110E5QRFIG by Texas Instruments

LM4F110E5QRFIG by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 32768 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 25 MHz, suitable for industrial applications requiring up to 43 I/O lines and PWM channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,808 parts In-Stock

1+ parts

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5,808

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Digiode

USA . 4,887 parts In-Stock

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4,887

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$13.934

100+ parts

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559

$13.934

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One Stop Electronics

USA . 224 parts In-Stock

1+ parts

$19.000

100+ parts

-

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224

$19.000

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Parana Technologies

USA . 158 parts In-Stock

1+ parts

$36.811

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-

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158

$36.811

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DigiPath Technology Company

USA . 608 parts In-Stock

1+ parts

$40.534

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608

$40.534

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ChromeModa Solutions

Germany . 5,552 parts In-Stock

1+ parts

$41.361

100+ parts

$33.916

1k+ parts

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5,552

$41.361

$33.916

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IDEA Electronic Components Group

UK . 2,270 parts In-Stock

1+ parts

$41.361

100+ parts

$39.293

1k+ parts

$37.225

10k+ parts

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2,270

$41.361

$39.293

$37.225

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Corphita

USA . 2,483 parts In-Stock

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2,483

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Overview

Unleash the power of innovation with the LM4F110E5QRFIG by Texas Instruments, a top-of-the-line microcontroller offering unparalleled performance and reliability. Crafted by industry leader Texas Instruments, this versatile device is perfect for a wide range of applications, from consumer electronics to industrial automation. With advanced features such as ADC channels and PWM capabilities, customers can expect seamless integration and optimal functionality. Experience the future of technology with the LM4F110E5QRFIG and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material helps protect the microcontroller from external damage, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 1.32 V

Efficient power consumption at a low voltage, reducing energy costs and minimizing heat dissipation.

Package Shape: SQUARE

Compact shape that utilizes space efficiently on the PCB, ideal for applications with limited space.

Bit Size: 32

High bit size allows for more complex processing tasks, making this microcontroller suitable for demanding applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply options provides flexibility in designing power circuits for various applications.

No. of Terminals: 64

Sufficient number of terminals for connecting input/output devices, peripherals, and power sources, enabling versatile functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Multiple package styles offer compatibility with different assembly methods, making integration into existing systems easier.

Minimum Supply Voltage: 1.08 V

Operates effectively at a low voltage, providing energy-efficient performance for battery-powered devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions, suitable for industrial use.

CPU Family: CORTEX-M4F

Advanced CPU architecture provides high processing power and performance efficiency, ideal for compute-intensive applications.

Minimum Operating Temperature: -40 °C

Designed to withstand extreme cold temperatures, ensuring reliable operation in harsh environments.

ADC Channels: YES

Integrated ADC channels enable analog signal acquisition, making this microcontroller suitable for sensor-based applications.

DMA Channels: YES

Support for DMA channels improves data transfer efficiency, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal configuration simplifies PCB layout and connections, reducing design complexity and assembly time.

ROM Words: 32768

Sufficient ROM capacity for storing program code and data, enabling the microcontroller to execute complex tasks efficiently.

Maximum Seated Height: 1.6 mm

Low profile design saves space on the PCB, making it suitable for compact electronic devices.

Width: 10 mm

Compact width dimension allows for space-efficient PCB layout, ideal for applications with size constraints.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast data processing, making this microcontroller suitable for real-time applications.

Length: 10 mm

Compact length dimension saves space on the PCB, enabling the use of this microcontroller in small form factor devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture with integrated peripherals offers efficient performance and functionality for various applications.

RAM Bytes: 32768

Generous RAM capacity for data storage and processing, supporting multitasking and efficiency in complex applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall reliability of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering during assembly, improving manufacturing efficiency.

Nominal Supply Voltage: 1.2 V

Stable and reliable supply voltage ensures consistent performance across different operating conditions.

PWM Channels: YES

Support for PWM channels enables precise control of digital signals, essential for applications such as motor control and LED dimming.

ROM Programmability: FLASH

Flash programmable ROM allows for flexible storage and modification of program code, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB, suitable for compact electronic designs with tight space constraints.

Speed: 80 rpm

Operating speed of 80 rpm ensures fast data processing and response time, making this microcontroller ideal for high-speed applications.

No. of I/O Lines: 43

Sufficient number of I/O lines for connecting external devices and interfaces, allowing for versatile connectivity options in various applications.

Technical Specifications

Microcontrollers LM4F110E5QRFIG attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES AT 3.3 V I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

43

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F110E5QRFIG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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