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LM4F111C4QR

Texas Instruments

LM4F111C4QR by Texas Instruments

LM4F111C4QR by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 25 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a wide temperature range (-40 to 85 °C) and low profile design (1.6 mm height).

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,272 parts In-Stock

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Digiode

USA . 2,172 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 668 parts In-Stock

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$17.679

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668

$17.679

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Parana Technologies

USA . 1,666 parts In-Stock

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$20.066

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$19.997

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DigiPath Technology Company

USA . 1,149 parts In-Stock

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$22.095

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$20.327

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$22.095

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ChromeModa Solutions

Germany . 1,282 parts In-Stock

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$22.546

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$18.488

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$22.546

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IDEA Electronic Components Group

UK . 626 parts In-Stock

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$22.546

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$21.419

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$20.291

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626

$22.546

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$20.291

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One Stop Electronics

USA . 1,530 parts In-Stock

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$31.000

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Corphita

USA . 2,860 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the LM4F111C4QR microcontroller by Texas Instruments. Designed with precision and reliability, this versatile component offers endless possibilities for innovation. Whether you're working on IoT devices, robotics, or consumer electronics, this microcontroller delivers exceptional performance and efficiency. Trust in Texas Instruments' reputation for quality and craftsmanship, and experience the value and benefits that the LM4F111C4QR brings to your projects. Elevate your designs with ease and confidence using this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that is commonly used in electronics, providing good protection for the microcontroller.

Surface Mount: YES

Easier and more efficient for automated assembly, saving time and cost during production.

Maximum Supply Voltage: 3.63 V

Allows for a higher voltage input, providing flexibility in power supply options.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board.

Bit Size: 32

32-bit architecture provides better performance and processing capabilities compared to lower bit sizes.

No. of Terminals: 64

Sufficient number of terminals for connecting various components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact package style that is suitable for applications where space is limited.

Minimum Supply Voltage: 2.97 V

Low minimum supply voltage allows for efficient power consumption and operation at lower voltages.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in very cold environments without any issues.

ADC Channels: YES

Ability to convert analog signals to digital signals, enabling interfacing with analog sensors and devices.

DMA Channels: YES

Support for Direct Memory Access enables fast and efficient data transfer without CPU intervention.

Terminal Position: QUAD

Quad terminal position allows for easy and organized connection layout on the PCB.

Maximum Seated Height: 1.6 mm

Low profile design suitable for compact and slim electronic devices.

Width: 10 mm

Compact width dimension suitable for space-constrained designs.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for fast processing and data throughput.

Length: 10 mm

Compact length dimension suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient and streamlined processing capabilities for embedded systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical connection and easy soldering on the PCB.

Nominal Supply Voltage: 3.3 V

Standard voltage supply suitable for most electronic applications.

PWM Channels: YES

Support for Pulse Width Modulation allows for precise control of output signals.

ROM Programmability: FLASH

Flash memory enables reprogrammability and flexibility in updating firmware or software.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB.

Speed: 80 rpm

Capable of processing data and instructions at a speed of 80 rotations per minute.

No. of I/O Lines: 49

Sufficient number of Input/Output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM4F111C4QR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

49

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F111C4QR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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