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LM4F110B2QR

Texas Instruments

LM4F110B2QR by Texas Instruments

LM4F110B2QR by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 25 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a max clock frequency of 25 MHz. With a package style of flatpack and low profile, it offers versatile performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,443 parts In-Stock

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Digiode

USA . 3,102 parts In-Stock

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3,102

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Distributors (Availability)

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AZTECH Wire

Italy . 692 parts In-Stock

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$8.365

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692

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One Stop Electronics

USA . 133 parts In-Stock

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$11.000

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Parana Technologies

USA . 559 parts In-Stock

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$43.817

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DigiPath Technology Company

USA . 1,743 parts In-Stock

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$48.248

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ChromeModa Solutions

Germany . 6,660 parts In-Stock

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$49.233

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$40.371

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$49.233

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IDEA Electronic Components Group

UK . 50 parts In-Stock

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$49.233

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$46.771

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$44.310

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$49.233

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Corphita

USA . 1,662 parts In-Stock

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Overview

Unlock endless possibilities with the LM4F110B2QR microcontroller from Texas Instruments. Built with top-notch quality and precision, this device offers unparalleled performance in a wide range of applications. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, this microcontroller delivers reliable functionality and efficiency. Trust in Texas Instruments' reputation for excellence and let the LM4F110B2QR take your project to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for smaller and lighter designs, making the product ideal for compact electronic devices.

Maximum Supply Voltage: 3.63 V

Operating within a safe voltage range ensures the longevity and reliability of the product.

Package Shape: SQUARE

A square package shape provides more efficient use of space on a circuit board.

Bit Size: 32

A 32-bit architecture allows for high-performance computing and processing capabilities.

No. of Terminals: 64

Having a sufficient number of terminals allows for versatile connectivity options in various applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style enables a compact design and efficient heat dissipation, making the product suitable for space-constrained environments.

Minimum Supply Voltage: 2.97 V

Operating within a low supply voltage range helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the product to be used in extreme cold environments.

ADC Channels: YES

Having analog-to-digital converter channels enables the product to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer speeds and efficiency, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and enhances signal integrity in the product.

Maximum Seated Height: 1.6 mm

A low seated height allows for a slim and compact design, suitable for space-constrained applications.

Width: 10 mm

A compact width facilitates easy integration into small electronic devices.

Maximum Clock Frequency: 25 MHz

A high maximum clock frequency enables fast processing speeds and responsiveness in the product.

Length: 10 mm

A compact length makes the product suitable for small form factor designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specifications ensure reliability in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with Reduced Instruction Set Computing (RISC) architecture offers efficient and fast processing capabilities.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

The Gull Wing terminal form enables easy soldering and secure connections on the PCB.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V is common in many electronic systems, ensuring compatibility.

PWM Channels: YES

Having Pulse-Width Modulation (PWM) channels allows for precise control of analog signals, making the product versatile.

ROM Programmability: FLASH

Flash ROM programmability provides flexibility for firmware updates and customization.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for high-density packing of terminals on a PCB, saving space.

Speed: 80 rpm

With a speed of 80 rpm, the product can efficiently process instructions and data.

No. of I/O Lines: 43

Having 43 I/O lines provides ample interfacing options for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LM4F110B2QR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

43

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F110B2QR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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