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LM4F111C4QRFIG

Texas Instruments

LM4F111C4QRFIG by Texas Instruments

LM4F111C4QRFIG by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 64 terminals and 49 I/O lines. It operates b/w -40 to 85°C, with a clock frequency of up to 25 MHz. Ideal for industrial applications requiring ADC and DMA channels, PWM support, and FLASH ROM programmability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,325 parts In-Stock

1+ parts

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8,325

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Digiode

USA . 2,396 parts In-Stock

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2,396

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 795 parts In-Stock

1+ parts

$11.719

100+ parts

-

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795

$11.719

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One Stop Electronics

USA . 569 parts In-Stock

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$18.000

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-

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569

$18.000

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Parana Technologies

USA . 2,226 parts In-Stock

1+ parts

$62.943

100+ parts

$5,845.173

1k+ parts

$56.648

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2,226

$62.943

$5,845.173

$56.648

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DigiPath Technology Company

USA . 857 parts In-Stock

1+ parts

$69.308

100+ parts

$63.763

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-

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857

$69.308

$63.763

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ChromeModa Solutions

Germany . 4,033 parts In-Stock

1+ parts

$70.722

100+ parts

$57.992

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4,033

$70.722

$57.992

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IDEA Electronic Components Group

UK . 1,268 parts In-Stock

1+ parts

$70.722

100+ parts

$67.186

1k+ parts

$63.650

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1,268

$70.722

$67.186

$63.650

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Corphita

USA . 4,086 parts In-Stock

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4,086

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Overview

Discover the limitless possibilities with the LM4F111C4QRFIG microcontroller by Texas Instruments. Crafted with precision and expertise, this powerful device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller is designed to deliver seamless operation and exceptional results. Experience the value and benefits of cutting-edge technology with the LM4F111C4QRFIG, where quality meets innovation. Elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the microcontroller, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount technology makes it easier to integrate the microcontroller onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.63 V

Supports a higher supply voltage, offering flexibility in power supply options.

Bit Size: 32

32-bit architecture allows for more complex computations and higher performance compared to 8 or 16-bit microcontrollers.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, enabling compatibility with a range of power sources.

No. of Terminals: 64

Plenty of terminals for connecting peripherals and external components, facilitating versatile system design.

Minimum Operating Temperature: -40 °C

Capable of operating in harsh environments with low temperatures, making it suitable for a wide range of applications.

CPU Family: CORTEX-M4F

Utilizes Cortex-M4F architecture known for its high performance and energy efficiency, suitable for demanding tasks.

ROM Words: 65536

Large ROM capacity allows for storing program code and data, making it suitable for applications requiring extensive memory.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing efficiency and speed, making it ideal for real-time applications.

Technical Specifications

Microcontrollers LM4F111C4QRFIG attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

49

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F111C4QRFIG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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