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LM4F111B2QR

Texas Instruments

LM4F111B2QR by Texas Instruments

LM4F111B2QR by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max clock frequency of 25 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a temperature range of -40 to 85°C. The package style is flatpack with low profile and fine pitch, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,219 parts In-Stock

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8,219

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Digiode

USA . 4,894 parts In-Stock

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4,894

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Distributors (Availability)

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AZTECH Wire

Italy . 406 parts In-Stock

1+ parts

$12.391

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406

$12.391

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One Stop Electronics

USA . 765 parts In-Stock

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$24.000

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765

$24.000

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Parana Technologies

USA . 326 parts In-Stock

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$72.918

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326

$72.918

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IDEA Electronic Components Group

UK . 1,764 parts In-Stock

1+ parts

$81.930

100+ parts

$77.834

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$73.737

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1,764

$81.930

$77.834

$73.737

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ChromeModa Solutions

Germany . 1,076 parts In-Stock

1+ parts

$81.930

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$67.183

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1,076

$81.930

$67.183

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Corphita

USA . 3,163 parts In-Stock

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3,163

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DigiPath Technology Company

USA . 1,861 parts In-Stock

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$73.868

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1,861

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Overview

Unlock the power of cutting-edge technology with the LM4F111B2QR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are perfect for a wide range of applications. Whether you're working on robotics, automation, or IoT projects, this product offers unmatched value, benefits, and advantages. With its advanced features and reliable performance, the LM4F111B2QR is sure to meet and exceed your expectations. Experience innovation at its finest with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.32 V

Provides a safe operating range for the microcontroller, protecting it from potential damage due to overvoltage.

Package Shape: SQUARE

Square packages are space-efficient and easier to handle during manufacturing and installation.

Bit Size: 32

Offers a good balance of processing power and energy efficiency for various applications.

No. of Terminals: 64

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style allows for a compact design and efficient use of PCB real estate.

Minimum Supply Voltage: 1.08 V

Ensures the microcontroller can operate reliably even at lower voltage levels, making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments where heat may be a concern.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold conditions, expanding its usability in various environments.

ADC Channels: YES

Integrated ADC channels enable analog data conversion, adding versatility to the microcontroller's capabilities.

DMA Channels: YES

DMA channels improve data transfer efficiency and offload the CPU, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position allows for easy PCB layout and routing, simplifying the design process.

Maximum Seated Height: 1.6 mm

Low profile design helps in reducing the overall size of the product, which is beneficial for space-constrained applications.

Width: 10 mm

Compact width dimension further contributes to the space-saving design of the microcontroller.

Maximum Clock Frequency: 25 MHz

High clock frequency offers fast processing speeds, making the microcontroller suitable for applications requiring quick data processing.

Length: 10 mm

Compact length dimension contributes to the overall small footprint of the microcontroller.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution, enhancing the microcontroller's processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals are suitable for surface mount applications, facilitating easy and secure soldering during assembly.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

PWM channels provide precise control over output signals, making the microcontroller ideal for applications requiring adjustable output voltages.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the microcontroller's firmware, ensuring flexibility and adaptability.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting, making the microcontroller suitable for compact designs with numerous components.

Speed: 80 rpm

With a speed of 80 rpm, the microcontroller can efficiently process data and execute instructions at a rapid pace.

No. of I/O Lines: 49

Sufficient I/O lines provide flexibility for interfacing with external devices and peripherals, expanding the microcontroller's functionality.

Technical Specifications

Microcontrollers LM4F111B2QR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

49

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F111B2QR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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