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LM4F110B2QRFIGR

Texas Instruments

LM4F110B2QRFIGR by Texas Instruments

LM4F110B2QRFIGR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 43 I/O lines and 12288 bytes of RAM. It operates b/w -40 to 85°C, has a max clock frequency of 25 MHz, and features ADC and DMA channels for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,584 parts In-Stock

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8,584

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Digiode

USA . 4,894 parts In-Stock

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4,894

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Distributors (Availability)

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One Stop Electronics

USA . 1,036 parts In-Stock

1+ parts

$4.000

100+ parts

-

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1,036

$4.000

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$13.751

100+ parts

$13.614

1k+ parts

$13.064

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2,000

$13.751

$13.614

$13.064

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AZTECH Wire

Italy . 452 parts In-Stock

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$14.822

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452

$14.822

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Parana Technologies

USA . 1,660 parts In-Stock

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$74.159

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1,660

$74.159

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DigiPath Technology Company

USA . 1,496 parts In-Stock

1+ parts

$81.658

100+ parts

$75.126

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1,496

$81.658

$75.126

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ChromeModa Solutions

Germany . 5,324 parts In-Stock

1+ parts

$83.325

100+ parts

$68.326

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5,324

$83.325

$68.326

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IDEA Electronic Components Group

UK . 221 parts In-Stock

1+ parts

$83.325

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$79.159

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$74.992

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221

$83.325

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$74.992

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Corphita

USA . 4,433 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments LM4F110B2QRFIGR microcontroller. Crafted by a renowned manufacturer, this device promises unparalleled quality and reliability. Ideal for a wide range of applications, from robotics to IoT devices, this microcontroller boasts a 32-bit architecture and advanced features like ADC and DMA channels. With a maximum clock frequency of 25 MHz and a compact design, the LM4F110B2QRFIGR offers exceptional performance in a small package. Experience seamless integration and high-speed processing with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers due to its durability and cost-effectiveness.

Maximum Supply Voltage: 3.63 V

Allows for a higher supply voltage, which can result in increased performance and functionality.

Bit Size: 32

A 32-bit architecture provides faster processing speeds and higher data precision compared to lower bit sizes.

Power Supplies (V): 1.2,3.3

Offers flexibility in power supply options, allowing for compatibility with a variety of systems.

No. of Terminals: 64

Provides ample connections for interfacing with peripherals and external components.

Minimum Operating Temperature: -40 °C

Can operate effectively in extreme cold environments, making it suitable for a wide range of applications.

ADC Channels: YES

Includes Analog-to-Digital Converter channels, allowing for accurate measurement and conversion of analog signals.

RAM Bytes: 12288

With a large RAM size, the microcontroller can handle more data and run complex programs efficiently.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming and updating of the microcontroller's firmware.

No. of I/O Lines: 43

Sufficient I/O lines for interfacing with external devices and sensors, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers LM4F110B2QRFIGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

43

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F110B2QRFIGR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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