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AM5706BCBDJ

Texas Instruments

AM5706BCBDJ by Texas Instruments

AM5706BCBDJ by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and integrated cache. It operates at a max clock frequency of 38.4 MHz and is suitable for applications requiring low power mode and boundary scan capabilities.

Median Price

$37.935

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,176 parts In-Stock

1+ parts

$37.935

100+ parts

$33.720

1k+ parts

$24.794

10k+ parts

-

1,176

$37.935

$33.720

$24.794

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,172 parts In-Stock

1+ parts

$36.038

100+ parts

-

1k+ parts

-

10k+ parts

-

4,172

$36.038

-

-

-

Vyrian

USA . 3,422 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,422

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 897 parts In-Stock

1+ parts

$15.720

100+ parts

-

1k+ parts

-

10k+ parts

-

897

$15.720

-

-

-

Corphita

USA . 3,388 parts In-Stock

1+ parts

$34.142

100+ parts

-

1k+ parts

-

10k+ parts

-

3,388

$34.142

-

-

-

Parana Technologies

USA . 2,266 parts In-Stock

1+ parts

$50.330

100+ parts

-

1k+ parts

-

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2,266

$50.330

-

-

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DigiPath Technology Company

USA . 1,575 parts In-Stock

1+ parts

$55.419

100+ parts

$50.985

1k+ parts

-

10k+ parts

-

1,575

$55.419

$50.985

-

-

ChromeModa Solutions

Germany . 3,540 parts In-Stock

1+ parts

$56.550

100+ parts

$46.371

1k+ parts

-

10k+ parts

-

3,540

$56.550

$46.371

-

-

IDEA Electronic Components Group

UK . 1,599 parts In-Stock

1+ parts

$56.550

100+ parts

$53.722

1k+ parts

$50.895

10k+ parts

-

1,599

$56.550

$53.722

$50.895

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Northwest PG Solutions

USA . 1,020 parts In-Stock

1+ parts

-

100+ parts

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1,020

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Native Components

USA . 11 parts In-Stock

1+ parts

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11

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Overview

Experience unparalleled performance and reliability with the AM5706BCBDJ microprocessor by Texas Instruments. As a trusted industry leader, Texas Instruments delivers cutting-edge technology that exceeds expectations. Ideal for a wide range of applications, this microprocessor offers seamless integration, advanced features, and unmatched efficiency. Trust in Texas Instruments to provide superior quality and value, making the AM5706BCBDJ the perfect choice for all your microprocessing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and thermal stability, making the product reliable for long-term use.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing memory latency and increasing data access speeds.

Surface Mount: YES

Surface mount capability makes installation easier and saves space on the circuit board, making the product more efficient for compact devices.

Maximum Supply Voltage: 1.2 V

Operating within a maximum supply voltage of 1.2 V ensures efficient power consumption and prevents overheating, making the product energy-efficient.

Address Bus Width: 16

A wider address bus width of 16 enables the microprocessor to handle larger amounts of data and perform complex calculations, enhancing its processing capabilities.

Package Shape: SQUARE

The square package shape allows for easy mounting and alignment on the circuit board, contributing to a simpler and more efficient manufacturing process.

No. of Terminals: 538

Having a high number of terminals allows for greater connectivity and functionality, making the microprocessor suitable for a wide range of applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch design helps in minimizing signal interference, improving overall performance and reliability of the product.

Minimum Supply Voltage: 1.11 V

Operating within a minimum supply voltage of 1.11 V ensures stable performance under varying voltage conditions, enhancing the product's reliability.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90°C, the microprocessor can withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Being able to operate at a minimum temperature of 0°C ensures the microprocessor can function in cold environments without compromising performance.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin/silver/copper provides corrosion resistance and ensures reliable electrical connections, increasing the longevity of the product.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the installation process and enhances thermal dissipation, contributing to the overall efficiency of the product.

Maximum Seated Height: 1.298 mm

The low maximum seated height of 1.298 mm allows for a thinner profile, making the microprocessor suitable for slim devices and space-constrained applications.

Width: 17 mm

The width of 17 mm provides a compact form factor, allowing for easy integration into various devices while saving space on the circuit board.

Boundary Scan: YES

Having boundary scan capability enables efficient testing and debugging of the microprocessor, ensuring high reliability and ease of maintenance.

External Data Bus Width: 32

A wider external data bus width of 32 enables faster data transfer between the microprocessor and other components, enhancing overall performance.

Maximum Clock Frequency: 38.4 MHz

Operating at a maximum clock frequency of 38.4 MHz ensures fast data processing and response times, making the microprocessor suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microprocessor can undergo reflow soldering processes efficiently and reliably.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and bonding, contributing to the product's durability and reliability.

Length: 17 mm

The length of 17 mm complements the compact width of the microprocessor, providing a balanced form factor for optimal integration and space utilization.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with RISC architecture allows for efficient processing of instructions, enhancing the overall performance and speed of the product.

Technology: CMOS

Utilizing CMOS technology enables low power consumption and high-speed operation, making the microprocessor energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Having terminals in ball form simplifies the soldering process and enhances connectivity, ensuring reliable electrical connections and ease of installation.

Nominal Supply Voltage: 1.15 V

Operating at a nominal supply voltage of 1.15 V ensures stable performance and power efficiency, prolonging the lifespan of the microprocessor.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for close spacing of terminals, enhancing connectivity and signal integrity for improved overall performance.

Format: FIXED POINT

Utilizing fixed-point format simplifies data representation and arithmetic calculations, improving efficiency and accuracy in processing complex algorithms.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates the microprocessor's resilience to moisture-related damage during storage and handling, ensuring reliability in various environments.

Speed: 1000 rpm

Operating at a speed of 1000 rpm, the microprocessor can efficiently carry out instructions and data processing tasks, making it suitable for high-speed applications.

Low Power Mode: YES

The availability of a low-power mode enhances energy efficiency and extends battery life, making the microprocessor ideal for portable devices and IoT applications.

Technical Specifications

Microprocessors AM5706BCBDJ attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B538

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

538

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.298 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM5706BCBDJ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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