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STR912FAZ47H6T

STMicroelectronics

STR912FAZ47H6T by STMicroelectronics

STR912FAZ47H6T by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 2V and operates in -40 °C to 85°C. It features 144 terminals, supports multiple connectivity options like CAN and USB, making it ideal for industrial applications. With 2MB ROM and 98KB RAM, it efficiently handles complex tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,825 parts In-Stock

1+ parts

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10,825

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Digiode

USA . 1,759 parts In-Stock

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1,759

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Anansix

USA . 1,520 parts In-Stock

1+ parts

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1,520

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 820 parts In-Stock

1+ parts

$8.160

100+ parts

-

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820

$8.160

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IDEA Electronic Components Group

UK . 1,611 parts In-Stock

1+ parts

$54.776

100+ parts

-

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$49.298

10k+ parts

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1,611

$54.776

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$49.298

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MKK Technologies

India . 62 parts In-Stock

1+ parts

$103.002

100+ parts

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62

$103.002

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DigiPath Technology Company

USA . 62 parts In-Stock

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$103.002

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62

$103.002

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Microchip USA

USA . 494 parts In-Stock

1+ parts

$106.945

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494

$106.945

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QUARKTWIN TECHNOLOGY LTD

USA . 20,945 parts In-Stock

1+ parts

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20,945

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Corphita

USA . 2,506 parts In-Stock

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2,506

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Parana Technologies

USA . 2,222 parts In-Stock

1+ parts

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100+ parts

$65.493

1k+ parts

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2,222

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$65.493

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Overview

Elevate your designs with the STR912FAZ47H6T microcontroller from STMicroelectronics—a trusted leader in innovation and quality. This versatile 32-bit ARM7 chip is engineered for a wide range of applications, from industrial automation to consumer electronics. Its robust features, including advanced connectivity options and superior processing power, ensure reliability while optimizing performance. With an exceptional temperature range and low-profile design, it’s the perfect choice for demanding environments, offering unmatched value and versatility for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and facilitates automated assembly, making production faster and more efficient.

Maximum Supply Voltage: 2 V

A low maximum supply voltage ensures reduced power consumption, which is essential for battery-powered and energy-efficient applications.

Package Shape: SQUARE

The square package shape allows for uniform thermal distribution and efficient space utilization on PCBs.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle more data per cycle and supports advanced computing tasks.

Power Supplies: 1.8, 3/3.3 V

The versatility in supply voltage options makes this microcontroller compatible with a wide range of projects and power sources.

No. of Terminals: 144

A high number of terminals allows for increased connectivity options and peripheral interfacing, enhancing functionality.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style supports high-density mounting and enhances performance in space-constrained applications.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage ensures compatibility with low-power systems and maximizes battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this microcontroller reliable for use in demanding industrial environments.

CPU Family: ARM7

Built on the ARM7 architecture, this microcontroller benefits from proven performance and a robust ecosystem of software and development tools.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this microcontroller suitable for extreme environments and outdoor applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and protects against oxidation, ensuring reliable electrical connections.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, enabling the microcontroller to interact with various sensors.

DMA Channels: YES

DMA channels improve data transfer efficiency and performance by offloading data movement tasks from the CPU.

Terminal Position: BOTTOM

Bottom terminal positioning aids in effective thermal management and efficient PCB layout design.

ROM Words: 2,097,152

A large ROM capacity enables complex applications to be stored and executed directly on the microcontroller.

Maximum Seated Height: 1.7 mm

The low seated height allows for compact designs without sacrificing performance, making it ideal for modern electronic devices.

Width: 10 mm

The compact width helps in space-saving designs, making it easier to integrate into smaller circuit boards.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

The extensive peripheral set enhances system capabilities, improving integration with other components and systems.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz allows for adequate processing speed for a variety of applications.

Length: 10 mm

The small length complements its width, contributing to a compact and efficient design, suitable for tight spaces.

Temperature Grade: INDUSTRIAL

Industrial-grade specifications ensure reliability and performance in harsh environments, suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it provides a simplified instruction set for efficient processing and optimized performance.

RAM Bytes: 98,304

The substantial RAM allows for the execution of complex algorithms and multiple tasks, enhancing the microcontroller's usability.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller suitable for various applications.

Terminal Form: BALL

Ball terminal form enables effective heat dissipation and PCB mounting, improving overall performance and reliability.

Analog To Digital Converters: 8-Ch 10-Bit

Having an 8-channel 10-bit ADC allows for versatile analog input processing, essential for numerous sensor-based applications.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V maximizes energy efficiency, making it ideal for low-power embedded systems.

PWM Channels: YES

PWM channels allow for precise control of motors and other devices, enhancing its applications in automation and robotics.

Connectivity: CAN, ETHERNET, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Diverse connectivity options enable integration with a wide range of industrial and consumer devices, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Flash ROM enables easy reprogramming, allowing developers to update and improve their applications without hardware changes.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch supports high-density circuit layouts, making it ideal for modern electronic designs.

Speed: 96 rpm

A maximum speed of 96 rpm can facilitate high-speed applications, enhancing user experience and efficiency.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for compatibility with various software environments and programming languages, widening its application scope.

No. of I/O Lines: 80

With 80 I/O lines, this microcontroller supports extensive interfacing options, allowing for complex circuit designs.

Technical Specifications

Microcontrollers STR912FAZ47H6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

80

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, ETHERNET, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR912FAZ47H6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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