Loading...

STR910FAM32X6T

STMicroelectronics

STR910FAM32X6T by STMicroelectronics

STR910FAM32X6T by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 2V and operates in -40 °C to 85°C. It features 80 terminals, supports multiple connectivity options like CAN and UART, and includes ADC channels for versatile applications. Ideal for industrial use, it offers robust performance with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,572

-

-

-

-

Digiode

USA . 2,859 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,859

-

-

-

-

Anansix

USA . 456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

456

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,258 parts In-Stock

1+ parts

$16.436

100+ parts

-

1k+ parts

$14.792

10k+ parts

-

2,258

$16.436

-

$14.792

-

MKK Technologies

India . 1,529 parts In-Stock

1+ parts

$30.906

100+ parts

-

1k+ parts

-

10k+ parts

-

1,529

$30.906

-

-

-

DigiPath Technology Company

USA . 1,529 parts In-Stock

1+ parts

$30.906

100+ parts

-

1k+ parts

-

10k+ parts

-

1,529

$30.906

-

-

-

Parana Technologies

USA . 2,325 parts In-Stock

1+ parts

-

100+ parts

$19.652

1k+ parts

-

10k+ parts

-

2,325

-

$19.652

-

-

Corphita

USA . 1,448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,448

-

-

-

-

Overview

Unlock the potential of your next project with the STR910FAM32X6T microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability and efficiency, this advanced 32-bit ARM7 chip excels across diverse applications—from industrial automation to consumer devices. With features like extensive connectivity options and robust performance under extreme conditions, it empowers engineers to create exceptional products that meet the highest standards of quality and durability. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and resistance to environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and ease of integration into modern PCBs, facilitating streamlined manufacturing.

Maximum Supply Voltage: 2 V

A maximum supply voltage of 2 V improves power efficiency, making it ideal for low-power applications.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, allowing for denser layouts.

Bit Size: 32

The 32-bit architecture provides a significant performance boost and greater processing capabilities for complex applications.

Power Supplies (V): 1.8, 3/3.3

The versatile supply voltage options enhance compatibility with various power sources, making integration easier.

No. of Terminals: 80

With 80 terminals, this microcontroller offers numerous connectivity options for peripherals and I/O operations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile, fine-pitch package style is suited for high-density applications, promoting efficient use of space.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage allows the microcontroller to operate effectively in battery-powered applications.

Maximum Operating Temperature: 85 °C

A wide operating temperature range ensures reliability in industrial and harsh environments.

CPU Family: ARM7

The ARM7 family provides robust performance and a well-supported development ecosystem, which enhances software development.

Minimum Operating Temperature: -40 °C

This microcontroller can operate in extremely cold conditions, making it suitable for outdoor or extreme environment applications.

ADC Channels: YES

Integrated ADC channels allow for direct sensor interfacing, simplifying design efforts for data acquisition.

DMA Channels: YES

DMA channels facilitate efficient data transfer, reducing CPU workload and improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning enables better space alignment on PCBs, making routing simpler.

ROM Words: 262144

A large ROM capacity allows for extensive program storage, giving developers room to implement complex functionalities.

Maximum Seated Height: 1.6 mm

A low seated height is beneficial for applications where space is critical, allowing for a flatter profile in designs.

Width: 12 mm

The compact width facilitates easy integration into smaller devices and keeps overall device dimensions manageable.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

Multiple integrated peripherals enhance functional capability, allowing for a comprehensive solution on a single chip.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz enables responsive performance, suitable for real-time applications.

Length: 12 mm

The short length contributes to compactness, making it suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures dependable performance in demanding conditions, extending the microcontroller's lifespan.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance per watt, ideal for power-sensitive projects and applications.

RAM Bytes: 65536

Sufficient RAM size supports complex computations and data processing, enhancing application performance.

Technology: CMOS

The CMOS technology provides low power consumption characteristics, extending battery life in portable applications.

Terminal Form: GULL WING

Gull wing terminals enhance the soldering process, ensuring reliable electrical connections.

Analog To Digital Convertors: 8-Ch 10-Bit

With 8-channel 10-bit ADCs, this microcontroller can interface with multiple analog sensors seamlessly.

Nominal Supply Voltage: 1.8 V

The nominal voltage is optimized for efficiency, balancing performance and power consumption effectively.

PWM Channels: YES

PWM channels enable precise control of motors and other devices, broadening application potentials.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Diverse connectivity options provide flexibility in interfacing with various communication protocols and peripherals.

ROM Programmability: FLASH

Flash programmability facilitates easy updates and modifications, enhancing project scalability and longevity.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch provides a compact arrangement suitable for modern high-density electronic designs.

Speed: 96 rpm

The motor control capability at 96 rpm allows for smooth operation in robotics and automation applications.

On Chip Program ROM Width: 8

8-bit program ROM width complements the microcontroller's architecture, supporting software development for various applications.

No. of I/O Lines: 40

A generous number of I/O lines allows for extensive interfacing options, accommodating diverse project requirements.

Technical Specifications

Microcontrollers STR910FAM32X6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR910FAM32X6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19