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STR910FAZ32H6T

STMicroelectronics

STR910FAZ32H6T by STMicroelectronics

STR910FAZ32H6T by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 2V and operates in -40 °C to 85°C. It features 144 terminals, supports multiple connectivity options like CAN and UART, making it ideal for industrial applications. With integrated ADC and DMA channels, it excels in data processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,801 parts In-Stock

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4,801

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Vyrian

USA . 2,143 parts In-Stock

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2,143

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Anansix

USA . 1,106 parts In-Stock

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1,106

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 881 parts In-Stock

1+ parts

$55.265

100+ parts

-

1k+ parts

$49.739

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881

$55.265

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$49.739

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MKK Technologies

India . 2,294 parts In-Stock

1+ parts

$103.923

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$103.923

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DigiPath Technology Company

USA . 2,294 parts In-Stock

1+ parts

$103.923

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2,294

$103.923

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Corphita

USA . 4,259 parts In-Stock

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4,259

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Parana Technologies

USA . 707 parts In-Stock

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$66.078

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707

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$66.078

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Overview

Unlock the potential of your next project with the STR910FAZ32H6T microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for versatility and reliability, this 32-bit ARM7 MCU offers exceptional performance across a range of applications including industrial automation, IoT devices, and consumer electronics. Experience superior quality, robust connectivity options, and energy efficiency that enhance product longevity and reduce costs—making it the ideal choice for innovative developers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable materials ensure reliability and protection for internal components.

Surface Mount: YES

Surface mount technology allows for smaller designs and easier integration into compact systems.

Maximum Supply Voltage: 2 V

Low voltage operation enhances energy efficiency, making it ideal for battery-powered applications.

Package Shape: SQUARE

Square form factor aids in space optimization on PCBs.

Bit Size: 32

A 32-bit architecture provides enhanced processing capabilities and allows for handling complex tasks.

Power Supplies (V): 1.8, 3/3.3

Versatile power supply options enable compatibility with various electronic designs.

No. of Terminals: 144

A high number of terminals allows for extensive connectivity options and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This style supports high-density designs, making it suitable for advanced applications.

Minimum Supply Voltage: 1.65 V

Supports low voltage operation, enhancing energy efficiency further.

Maximum Operating Temperature: 85 °C

High temperature threshold ensures reliable operation in demanding industrial environments.

CPU Family: ARM7

ARM7 architecture offers proven performance and a wide range of software support.

Minimum Operating Temperature: -40 °C

Operation in extreme cold conditions makes this product suitable for harsh environments.

ADC Channels: YES

Analog-to-Digital conversion capability enhances the control of analog signals.

DMA Channels: YES

Direct Memory Access support allows for efficient data handling, improving performance in data-intensive applications.

Terminal Position: BOTTOM

Bottom terminal position aids in compact placement of components on PCBs.

ROM Words: 262144

Generous ROM capacity allows for storing extensive programs and data.

Maximum Seated Height: 1.7 mm

Low profile design enables integration into space-constrained applications.

Width: 10 mm

Compact width facilitates space-efficient designs.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

Rich peripheral set enhances functionality, making it versatile for numerous applications.

Maximum Clock Frequency: 25 MHz

Adequate clock speed provides decent performance for most microcontroller applications.

Length: 10 mm

Compact length contributes to space-saving designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications ensures reliability in extreme conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and power consumption.

RAM Bytes: 65536

Sufficient RAM enables smooth operation of applications and multitasking.

Technology: CMOS

CMOS technology contributes to low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form supports efficient heat dissipation and reliability.

Analog To Digital Converters: 8-Ch 10-Bit

Multiple channels provide flexibility in managing various analog inputs.

Nominal Supply Voltage: 1.8 V

Operates at a nominal voltage that balances performance and energy efficiency.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of power to devices such as motors.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Comprehensive connectivity options enable seamless communication protocols for diverse applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in application development.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density interconnections for compact designs.

Speed: 96 rpm

Moderate speed specification indicates suitability for control applications.

On Chip Program ROM Width: 8

Enables compatibility with standard software architectures, facilitating software development.

No. of I/O Lines: 80

High I/O line count supports complex interfacing capabilities, increasing versatility.

Technical Specifications

Microcontrollers STR910FAZ32H6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B144

Length:

10 mm

No. of I/O Lines:

80

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR910FAZ32H6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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