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STR910FAZ42H6T

STMicroelectronics

STR910FAZ42H6T by STMicroelectronics

STR910FAZ42H6T by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 2V and operates in -40 °C to 85°C. It features 144 terminals, 8 ADC channels, and supports various connectivity options like CAN and UART. Ideal for industrial applications requiring robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,986 parts In-Stock

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2,986

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Anansix

USA . 2,651 parts In-Stock

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2,651

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Vyrian

USA . 181 parts In-Stock

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181

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 810 parts In-Stock

1+ parts

$35.586

100+ parts

-

1k+ parts

$32.027

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810

$35.586

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$32.027

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MKK Technologies

India . 2,359 parts In-Stock

1+ parts

$66.916

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2,359

$66.916

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DigiPath Technology Company

USA . 2,359 parts In-Stock

1+ parts

$66.916

100+ parts

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2,359

$66.916

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Corphita

USA . 4,118 parts In-Stock

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4,118

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Parana Technologies

USA . 1,787 parts In-Stock

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$42.548

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1,787

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$42.548

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Overview

Unlock unparalleled performance with the STR910FAZ42H6T microcontroller from STMicroelectronics, a leader in innovation and reliability. Designed for diverse applications, this compact powerhouse elevates your projects with advanced features like multiple connectivity options and robust processing capabilities. Experience enhanced efficiency, lower power consumption, and exceptional temperature resilience, ensuring your designs thrive in any environment. Invest in quality; choose STMicroelectronics for proven excellence!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact PCB designs and automated assembly processes, making this microcontroller a great choice for space-constrained applications.

Maximum Supply Voltage: 2 V

The low maximum supply voltage enhances the microcontroller's energy efficiency, making it suitable for battery-powered devices.

Package Shape: SQUARE

The square package shape optimizes space on the PCB and aids in effective thermal management during operation.

Bit Size: 32

A 32-bit architecture allows for processing of larger data types and higher precision, which is ideal for complex applications.

No. of Terminals: 144

A higher number of terminals allows for more I/O connections, enabling greater functionality and connectivity options in designs.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style supports high-performance designs and helps reduce the overall footprint of the microcontroller.

Minimum Supply Voltage: 1.65 V

The minimum supply voltage is low, contributing to its flexibility in various low-power applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for industrial applications that require higher thermal tolerance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this microcontroller ideal for harsh environmental conditions.

ADC Channels: YES

Integrated ADC channels provide analog-to-digital conversion, allowing for real-time monitoring of sensors and other analog signals.

DMA Channels: YES

Support for DMA channels enhances data transfer efficiency, leading to improved system performance and lower CPU load.

Terminal Position: BOTTOM

Bottom terminal position allows for easier fitting and soldering in various PCB designs.

ROM Words: 262144

A large ROM size enables the microcontroller to store substantial amounts of firmware and application code.

Maximum Seated Height: 1.7 mm

The low seated height aids in compact designs, making it fit well in space-constrained applications.

Width: 10 mm

A width of 10 mm contributes to efficient space utilization on PCBs.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

Rich peripheral set enhances functionality and versatility, enabling a broad range of applications.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz provides the processing speed necessary for demanding applications.

Length: 10 mm

A compact length of 10 mm is beneficial for fitting into small form factor designs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliability and performance under a wide range of conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller indicates efficient processing capabilities, leading to faster execution of tasks.

RAM Bytes: 98304

Adequate RAM size enables the microcontroller to handle complex computations and multi-tasking efficiently.

Technology: CMOS

CMOS technology enhances power efficiency and integration density, making the microcontroller suitable for low-power applications.

Terminal Form: BALL

Ball terminal form provides better performance in terms of soldering and electrical connectivity.

Analog To Digital Convertors: 8-Ch 10-Bit

The presence of 8-channel, 10-bit ADCs allows for simultaneous processing of multiple signals, beneficial for complex systems.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V further supports low-power operation, making it suitable for energy-sensitive applications.

PWM Channels: YES

Support for PWM channels facilitates control of motors and other actuators, enhancing its application scope.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Diverse connectivity options allow easy integration with various peripherals and communication protocols, making it versatile.

ROM Programmability: FLASH

Flash memory programmability allows for easy updates and modifications to firmware, improving the product's longevity.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm aids in achieving a compact design while maintaining reliable connections.

Speed: 96 rpm

This speed specification suggests capabilities related to controlling motors or processes, making it suitable for industrial applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width is adequate for the microcontroller to handle instruction sets efficiently.

No. of I/O Lines: 79

A high number of I/O lines allows for extensive interface options and user functionality in applications.

Technical Specifications

Microcontrollers STR910FAZ42H6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XBGA-B144

Length:

10 mm

No. of I/O Lines:

79

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

96 rpm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR910FAZ42H6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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