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STR911FAM32X6T

STMicroelectronics

STR911FAM32X6T by STMicroelectronics

STR911FAM32X6T by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 2V and operates in -40 °C to 85°C. It features 80 terminals, ADC channels, and supports various connectivity options like CAN and USB. Ideal for industrial applications requiring robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,844 parts In-Stock

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4,844

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Vyrian

USA . 1,814 parts In-Stock

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1,814

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Anansix

USA . 911 parts In-Stock

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911

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 557 parts In-Stock

1+ parts

$16.405

100+ parts

-

1k+ parts

$14.765

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557

$16.405

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$14.765

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MKK Technologies

India . 610 parts In-Stock

1+ parts

$30.849

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610

$30.849

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DigiPath Technology Company

USA . 610 parts In-Stock

1+ parts

$30.849

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610

$30.849

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Corphita

USA . 1,887 parts In-Stock

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1,887

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Parana Technologies

USA . 190 parts In-Stock

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$19.615

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190

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$19.615

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Overview

Unlock your innovation potential with the STR911FAM32X6T microcontroller from STMicroelectronics. Renowned for superior quality and reliability, this versatile microcontroller excels in demanding applications, offering exceptional performance in automotive, industrial, and consumer electronics. With its low power consumption and robust features, it empowers creators to design smart, efficient solutions that stand out in today's competitive landscape. Experience unmatched value and elevate your projects to new heights!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for a compact design and facilitates automated assembly, making it ideal for modern electronic devices.

Maximum Supply Voltage: 2 V

The low maximum supply voltage enhances energy efficiency, suitable for battery-powered applications.

Package Shape: SQUARE

A square package shape aids in symmetry and efficient layout options on PCBs.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex operations and larger data types efficiently.

No. of Terminals: 80

An ample number of terminals allows for extensive I/O connectivity and flexibility in design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style enables space-saving deployment and is favorable for high-density applications.

Minimum Supply Voltage: 1.65 V

A broad operating voltage range allows for compatibility with various power sources.

Maximum Operating Temperature: 85 °C

The high maximum temperature rating makes it suitable for industrial applications where heat is a factor.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold temperatures is critical for outdoor and harsh environment applications.

ADC Channels: YES

Having ADC channels allows for interfacing with analog sensors, expanding application fields.

DMA Channels: YES

DMA support enhances data transfer efficiency, allowing the CPU to focus on other tasks.

Terminal Position: QUAD

The quad terminal position improves soldering reliability and reduces footprint on the PCB.

ROM Words: 262144

A significant amount of program memory allows for complex and feature-rich applications.

Maximum Seated Height: 1.6 mm

The low profile design is ideal for applications constrained by height.

Width: 12 mm

A compact width enables efficient space utilization on printed circuit boards.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

The integrated peripherals enhance functionality and reduce external component count.

Maximum Clock Frequency: 25 MHz

This clock speed provides adequate processing power for a wide range of applications.

Length: 12 mm

Compact length allows for flexibility in device design and layout.

Temperature Grade: INDUSTRIAL

This grade signifies reliability in demanding environments, suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes instruction execution, improving performance and efficiency.

RAM Bytes: 65536

Adequate RAM size supports data-intensive applications and efficient program execution.

Technology: CMOS

CMOS technology offers low power consumption, which is essential for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide a reliable connection that's easy to solder, enhancing manufacturability.

Analog To Digital Converters: 8-Ch 10-Bit

Multiple ADC channels allow for simultaneous sampling from a variety of sensors.

Nominal Supply Voltage: 1.8 V

A nominal voltage of 1.8 V ensures compatibility with modern low-power components.

PWM Channels: YES

PWM channels offer the ability to control motors and other devices requiring variable power.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Robust connectivity options support multiple communication protocols, making it versatile for various applications.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications to the firmware after deployment.

Terminal Pitch: 0.5 mm

A fine pitch allows for high-density arrangements on PCBs, making it ideal for compact devices.

Speed: 96 rpm

Support for a speed of 96 rpm is suitable for motor control applications.

On Chip Program ROM Width: 8

An 8-bit ROM width facilitates compatibility with standard data, ensuring ease of integration.

No. of I/O Lines: 40

Having 40 I/O lines provides significant flexibility for connecting various peripherals and components.

Technical Specifications

Microcontrollers STR911FAM32X6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQFP-G80

Length:

12 mm

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR911FAM32X6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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