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STR910FAZ32H6

STMicroelectronics

STR910FAZ32H6 by STMicroelectronics

STR910FAZ32H6 by STMicroelectronics is a 32-bit ARM7 microcontroller with 144 terminals, operating at up to 25 MHz. It features 8-Ch 10-Bit ADC channels, CAN and UART connectivity, and on-chip FLASH ROM for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,745 parts In-Stock

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4,745

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Digiode

USA . 3,880 parts In-Stock

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3,880

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Anansix

USA . 942 parts In-Stock

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942

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Distributors (Availability)

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AZTECH Wire

Italy . 528 parts In-Stock

1+ parts

$12.290

100+ parts

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528

$12.290

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Microchip USA

USA . 420 parts In-Stock

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$20.478

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420

$20.478

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$43.924

100+ parts

$39.971

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$36.018

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1,000

$43.924

$39.971

$36.018

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IDEA Electronic Components Group

UK . 1,738 parts In-Stock

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$44.939

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$40.445

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1,738

$44.939

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$40.445

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MKK Technologies

India . 237 parts In-Stock

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$84.505

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237

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DigiPath Technology Company

USA . 237 parts In-Stock

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$84.505

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237

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Component Stockers USA

USA . 670 parts In-Stock

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$99.990

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670

$99.990

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Corphita

USA . 3,175 parts In-Stock

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Parana Technologies

USA . 1,316 parts In-Stock

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$53.732

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$53.732

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Perfect Parts

USA . 1,236 parts In-Stock

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Overview

Discover the cutting-edge technology of the STR910FAZ32H6 microcontroller by STMicroelectronics. Designed with precision in mind, this top-of-the-line product offers unparalleled quality and reliability. Perfect for a wide range of applications, this microcontroller provides advanced features and capabilities that will take your projects to the next level. Unlock endless possibilities and experience seamless performance with the STR910FAZ32H6. Elevate your designs and bring your ideas to life with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable.

Surface Mount: YES

Surface mount capability makes it easy to integrate this microcontroller onto PCBs.

Maximum Supply Voltage: 2 V

Operating at a maximum supply voltage of 2V helps in reducing power consumption.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB.

Bit Size: 32

A 32-bit architecture provides high processing power and performance.

Power Supplies (V): 3/3.3

Multiple power supply options allow for flexibility in different operating environments.

No. of Terminals: 144

The high number of terminals enables connectivity to a wide range of external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style offers high density integration and reliability in compact spaces.

Minimum Supply Voltage: 1.65 V

Operating at a low minimum supply voltage increases energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes it suitable for industrial applications.

CPU Family: ARM7

The ARM7 CPU family is known for its robust performance and reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in harsh environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance.

ADC Channels: YES

The presence of ADC channels allows for analog input signal conversion.

DMA Channels: YES

DMA channels enhance data transfer efficiency and optimize performance.

Terminal Position: BOTTOM

The bottom terminal position is convenient for PCB layout and assembly.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program data.

Maximum Seated Height: 1.7 mm

A low maximum seated height enables compact device designs.

Width: 10 mm

The compact width allows for space-efficient PCB integration.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

The presence of multiple peripherals enhances the microcontroller's functionality and versatility.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency supports swift data processing operations.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand peak reflow temperatures for a considerable amount of time, ensuring reliability during soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance is suitable for lead-free soldering processes.

Length: 10 mm

The compact length facilitates space-efficient PCB layout designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller enhances processing speed and efficiency.

RAM Bytes: 65536

The ample RAM capacity allows for efficient data storage and manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

The terminal form provides reliable connections for robust performance.

Analog To Digital Convertors: 8-Ch 10-Bit

The presence of 8-channel 10-bit ADCs enables accurate analog signal conversion.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V ensures energy efficiency.

PWM Channels: YES

PWM channels facilitate precise control of connected devices.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Multiple connectivity options enable seamless communication with external peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization.

Terminal Pitch: 0.8 mm

A small terminal pitch enables high-density PCB layout designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard assembly processes.

Speed: 96 rpm

The high-speed capability enables fast data processing and response times.

On Chip Program ROM Width: 8

The 8-word width of the on-chip program ROM provides sufficient storage capacity.

No. of I/O Lines: 80

The high number of I/O lines offers extensive connectivity options for external devices.

Technical Specifications

Microcontrollers STR910FAZ32H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR910FAZ32H6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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