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STR910FW32X6T

STMicroelectronics

STR910FW32X6T by STMicroelectronics

STR910FW32X6T by STMicroelectronics is a 32-bit ARM7 microcontroller with 128 terminals, 256 ROM words, and 65536 RAM bytes. It operates b/w -40 to 85 °C, has power supplies of 1.8V and 3/3.3V, and features flash ROM programmability. This microcontroller is commonly used in industrial applications requiring high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,270 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,270

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Vyrian

USA . 1,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,020

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-

-

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Digiode

USA . 184 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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184

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,188 parts In-Stock

1+ parts

$68.175

100+ parts

-

1k+ parts

$61.357

10k+ parts

-

2,188

$68.175

-

$61.357

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MKK Technologies

India . 1,839 parts In-Stock

1+ parts

$128.198

100+ parts

-

1k+ parts

-

10k+ parts

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1,839

$128.198

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DigiPath Technology Company

USA . 1,839 parts In-Stock

1+ parts

$128.198

100+ parts

-

1k+ parts

-

10k+ parts

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1,839

$128.198

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-

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Corphita

USA . 276 parts In-Stock

1+ parts

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276

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Parana Technologies

USA . 38 parts In-Stock

1+ parts

-

100+ parts

$81.513

1k+ parts

-

10k+ parts

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38

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$81.513

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Overview

Discover the cutting-edge technology of the STR910FW32X6T microcontroller by STMicroelectronics, a leader in semiconductor innovation. This powerful 32-bit device offers unparalleled performance and versatility for a wide range of applications. With its industrial-grade temperature tolerance and flash ROM programmability, this microcontroller is perfect for demanding environments where reliability is key. Experience the exceptional quality and value that STMicroelectronics brings to every product, and unlock a world of possibilities with the STR910FW32X6T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, saving space and reducing production costs.

Bit Size: 32

32-bit processing capability provides faster and more efficient data processing for complex applications.

Power Supplies (V): 1.8,3/3.3

Multiple voltage options allow for flexibility in power supply design and compatibility with various electronic systems.

No. of Terminals: 128

High number of terminals enable connectivity to multiple external components and peripherals for enhanced functionality.

Package Style (Meter): FLATPACK

Flatpack packaging style ensures efficient heat dissipation and compact form factor, suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance makes the microcontroller suitable for industrial environments with demanding temperature conditions.

CPU Family: ARM7

ARM7 CPU family offers a balance between performance and power efficiency, making it a popular choice for a wide range of applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the microcontroller to operate in extreme cold environments without performance degradation.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and durability, ensuring reliable electrical connections during PCB assembly.

ROM Words: 256

256-ROM words offer sufficient non-volatile memory storage for program code and data storage.

Temperature Grade: INDUSTRIAL

Industrial temperature-grade construction ensures reliable operation in harsh industrial environments with minimal risk of failure.

RAM Bytes: 65536

Extensive RAM capacity of 65536 bytes allows for efficient data processing and storage, essential for running multiple tasks simultaneously.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, contributing to energy efficiency and system reliability.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy PCB mounting and rework, ensuring efficient assembly and maintenance processes.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and fast reprogramming of the microcontroller without requiring specialized equipment.

Terminal Pitch: 0.4 mm

Narrow terminal pitch of 0.4mm enables high-density PCB layout design, saving space and optimizing the overall product size.

Speed: 96 rpm

High processing speed of 96 rpm ensures quick response times and efficient operation in demanding real-time applications.

Technical Specifications

Microcontrollers STR910FW32X6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

ARM7

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

256

ROM Programmability:

FLASH

Speed:

96 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

STR910FW32X6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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