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STR910FAM42X6T

STMicroelectronics

STR910FAM42X6T by STMicroelectronics

STR910FAM42X6T by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 2V and operates in -40 °C to 85°C. It features 80 terminals, ADC & DMA channels, making it ideal for industrial applications requiring robust connectivity. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,863 parts In-Stock

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4,863

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Vyrian

USA . 4,396 parts In-Stock

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4,396

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Anansix

USA . 1,291 parts In-Stock

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1,291

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 58 parts In-Stock

1+ parts

$65.769

100+ parts

-

1k+ parts

$59.192

10k+ parts

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58

$65.769

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$59.192

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MKK Technologies

India . 1,720 parts In-Stock

1+ parts

$123.674

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1,720

$123.674

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DigiPath Technology Company

USA . 1,720 parts In-Stock

1+ parts

$123.674

100+ parts

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1,720

$123.674

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Parana Technologies

USA . 2,192 parts In-Stock

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$78.637

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2,192

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$78.637

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Corphita

USA . 1,613 parts In-Stock

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1,613

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Overview

Unlock the power of innovation with the STR910FAM42X6T microcontroller from STMicroelectronics, a leader renowned for quality and reliability. This cutting-edge 32-bit device excels in diverse applications, from industrial automation to consumer electronics. With its impressive energy efficiency and robust performance in extreme temperatures, it ensures your designs thrive. Elevate your projects with unmatched versatility and seamless connectivity, empowering you to create smarter solutions effortlessly!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for smaller, more compact designs, making it ideal for space-constrained applications.

Maximum Supply Voltage: 2 V

Operating at a low maximum supply voltage enhances energy efficiency, contributing to battery longevity in portable devices.

Package Shape: SQUARE

The square package shape enables uniform distribution of heat and simplifies PCB layout.

Bit Size: 32

The 32-bit architecture provides enhanced performance and allows for more complex computations compared to 8 or 16-bit alternatives.

No. of Terminals: 80

A higher number of terminals increases the I/O capabilities of the microcontroller, allowing for more peripherals to be connected.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style ensures a low profile for installations where height is a constraint while providing fine pitch for better connections.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage allows for operation in low-power systems, which is crucial for energy-sensitive applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller is suitable for industrial and high-temperature environments.

Minimum Operating Temperature: -40 °C

An extended operating temperature range makes this product reliable for outdoor or extreme environment applications.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to process analog signals effectively, making it suitable for sensor-based applications.

DMA Channels: YES

Dedicated DMA channels enhance data transfer efficiency, reducing CPU load during data movements.

Terminal Position: QUAD

Quad terminal positions improve connectivity options and simplify board design.

ROM Words: 262144

A large ROM capacity allows for extensive program storage, essential for complex applications.

Maximum Seated Height: 1.6 mm

A low seated height ensures compatibility with ultra-thin designs.

Width: 12 mm

A compact width maximizes design flexibility and minimizes PCB space requirements.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

An array of built-in peripherals enhances functionality, reducing the need for external components.

Maximum Clock Frequency: 25 MHz

A 25 MHz clock frequency ensures fast processing speeds, which is critical for time-sensitive applications.

Length: 12 mm

Similar to width, a compact length contributes to efficient space usage in device design.

Temperature Grade: INDUSTRIAL

Industrial-grade components are more durable and reliable, making them suitable for demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for more efficient processing with reduced instruction sets, leading to better performance.

RAM Bytes: 98304

A significant amount of RAM allows for more complex data handling and processing during operation.

Technology: CMOS

CMOS technology ensures lower power consumption and better performance, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals ensure robust connections and facilitate easier soldering and assembly.

Analog To Digital Convertors: 8-Ch 10-Bit

With 8 channels and 10-bit resolution, this ADC can handle multiple signals, enhancing sensor integration capabilities.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V contributes to energy-efficient designs, especially in battery-powered devices.

PWM Channels: YES

Integrated PWM channels enable efficient control of motors and servos, making it versatile for robotics and control systems.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Diverse connectivity options ensure easy integration with various devices and protocols, expanding application possibilities.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in application development and deployment.

Terminal Pitch: 0.5 mm

A smaller terminal pitch helps achieve a higher component density on PCBs, optimizing space usage.

Speed: 96 rpm

This speed rating could relate to motor control, making it suitable for various control applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width indicates a balance between memory efficiency and processing capability.

No. of I/O Lines: 40

Having 40 I/O lines provides flexibility for connecting various components, making it highly versatile for development.

Technical Specifications

Microcontrollers STR910FAM42X6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQFP-G80

Length:

12 mm

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR910FAM42X6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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