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STR910FAW34X6T

STMicroelectronics

STR910FAW34X6T by STMicroelectronics

STR910FAW34X6T by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 2V and operates in -40 °C to 85°C. It features 128 terminals, ADC/DMA channels, and supports various connectivity options like CAN and UART. Ideal for industrial applications requiring robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,121 parts In-Stock

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3,121

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Vyrian

USA . 1,230 parts In-Stock

1+ parts

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1,230

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Anansix

USA . 605 parts In-Stock

1+ parts

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605

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,091 parts In-Stock

1+ parts

$14.839

100+ parts

-

1k+ parts

$13.355

10k+ parts

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1,091

$14.839

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$13.355

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MKK Technologies

India . 1,613 parts In-Stock

1+ parts

$27.903

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1,613

$27.903

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DigiPath Technology Company

USA . 1,613 parts In-Stock

1+ parts

$27.903

100+ parts

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1,613

$27.903

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Corphita

USA . 3,314 parts In-Stock

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3,314

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Parana Technologies

USA . 1,670 parts In-Stock

1+ parts

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$17.742

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1,670

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$17.742

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Overview

Unlock unparalleled performance with the STR910FAW34X6T microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for a wide range of applications, its low power consumption and robust functionality make it ideal for industrial automation, smart sensors, and IoT devices. Experience seamless integration, superior reliability, and exceptional support from a trusted manufacturer, ensuring your projects achieve groundbreaking success. Elevate your designs today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient space utilization in compact applications.

Maximum Supply Voltage: 2 V

A low maximum supply voltage is beneficial for power-sensitive applications, extending battery life.

Package Shape: SQUARE

The square package shape can facilitate efficient PCB layout and thermal management.

Bit Size: 32

A 32-bit architecture offers higher processing capabilities and is ideal for complex applications.

No. of Terminals: 128

With 128 terminals, this microcontroller provides ample connections for peripherals and I/O.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design enhances compatibility with space-constrained environments.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage supports operation in various low-power scenarios.

Maximum Operating Temperature: 85 °C

The high temperature tolerance ensures reliable performance in industrial applications.

Minimum Operating Temperature: -40 °C

Its wide temperature range makes it suitable for harsh environmental conditions.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, enhancing functionality.

DMA Channels: YES

DMA support improves data transfer speeds, reducing CPU load and increasing system efficiency.

Terminal Position: QUAD

Quad terminal positioning enables easier routing and layout for PCB designs.

ROM Words: 524288

A substantial ROM capacity allows for extensive program storage and features.

Maximum Seated Height: 1.6 mm

A low seated height contributes to overall compactness and design flexibility.

Width: 14 mm

A standard width is suitable for a wide range of mounting scenarios.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

Multiple built-in peripherals provide versatility for various applications without extra components.

Maximum Clock Frequency: 25 MHz

A higher clock frequency enhances computational speed, suitable for time-critical applications.

Length: 14 mm

Standard length simplifies placement on PCBs and compatibility with existing designs.

Temperature Grade: INDUSTRIAL

Industrial-grade specifications ensure reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient instruction execution, delivering improved performance.

RAM Bytes: 65536

A generous amount of RAM allows for robust data handling and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for portable applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly processes.

Analog To Digital Converters: 8-Ch 10-Bit

8-channel ADCs enable flexible and precise analog signal processing for various sensors.

Nominal Supply Voltage: 1.8 V

Operating at a nominal voltage of 1.8 V enhances power efficiency, particularly for battery-powered devices.

PWM Channels: YES

PWM capability allows for precise control of actuators and motors in various applications.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Diverse communication interfaces provide flexibility in connecting with various devices and protocols.

ROM Programmability: FLASH

Flash ROM enables easy program updates and flexibility in software development.

Terminal Pitch: 0.4 mm

The small terminal pitch is advantageous for high-density PCB designs.

Speed: 96 rpm

A speed rating of 96 rpm is suitable for a range of moderate-speed applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width aids in accommodating a variety of programming tasks.

No. of I/O Lines: 80

80 I/O lines provide extensive interfacing possibilities for sensors, actuators, and other components.

Technical Specifications

Microcontrollers STR910FAW34X6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQFP-G128

Length:

14 mm

No. of I/O Lines:

80

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR910FAW34X6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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