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STR910FM32X6T

STMicroelectronics

STR910FM32X6T by STMicroelectronics

STR910FM32X6T by STMicroelectronics is a 32-bit ARM7 microcontroller with 80 terminals, 65536 bytes of RAM, and 256 ROM words. It operates b/w -40 °C to 85°C, suitable for industrial applications. With a speed of 96 rpm, it is ideal for embedded systems requiring high processing power in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,195 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,195

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Anansix

USA . 2,465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,465

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Vyrian

USA . 1,367 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,367

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,210 parts In-Stock

1+ parts

$19.933

100+ parts

-

1k+ parts

$17.939

10k+ parts

-

1,210

$19.933

-

$17.939

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MKK Technologies

India . 256 parts In-Stock

1+ parts

$37.482

100+ parts

-

1k+ parts

-

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256

$37.482

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DigiPath Technology Company

USA . 256 parts In-Stock

1+ parts

$37.482

100+ parts

-

1k+ parts

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10k+ parts

-

256

$37.482

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Corphita

USA . 1,351 parts In-Stock

1+ parts

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1,351

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Parana Technologies

USA . 212 parts In-Stock

1+ parts

-

100+ parts

$23.833

1k+ parts

-

10k+ parts

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212

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$23.833

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Overview

Elevate your electronic designs with the STR910FM32X6T microcontroller from STMicroelectronics. Crafted with precision and expertise, this high-quality product offers unparalleled performance and reliability for a wide range of applications. With its cutting-edge technology and advanced features, customers can expect seamless integration, improved efficiency, and enhanced functionality in their projects. Trust in STMicroelectronics to deliver top-of-the-line microcontrollers that provide exceptional value and superior benefits to meet all your design needs. Experience innovation at its best with the STR910FM32X6T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and making production more efficient.

Package Shape: SQUARE

The square shape of the package allows for easier placement and alignment on the circuit board.

Bit Size: 32

32-bit processing capability enables faster and more complex operations, making the product suitable for high-performance applications.

Power Supplies (V): 1.8,3/3.3

Support for multiple voltage options provides flexibility in design and compatibility with different power sources.

No. of Terminals: 80

Having 80 terminals allows for more connections and functionalities, making it suitable for a variety of applications.

Package Style (Meter): FLATPACK

The flatpack style of the package makes it easier to mount and secure on the circuit board, enhancing the overall stability of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions without overheating or malfunctioning.

CPU Family: ARM7

The ARM7 CPU family is known for its efficiency and performance, making this microcontroller suitable for high-speed processing tasks.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures that the microcontroller can function reliably even in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals provides good conductivity and corrosion resistance, ensuring stable connections and long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for easier soldering and connection to the circuit board, making installation more straightforward.

ROM Words: 256

Having 256 ROM words provides sufficient memory for storing program instructions and data, making the microcontroller versatile for different applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and stability in harsh industrial environments, making this microcontroller suitable for industrial applications.

RAM Bytes: 65536

With 65536 bytes of RAM, this microcontroller can handle extensive data processing and storage requirements, making it suitable for memory-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high performance, making this microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easier soldering, enhancing the durability and reliability of the microcontroller.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates or changes to the program code, enhancing flexibility and versatility.

Terminal Pitch: 0.5 mm

Having a small terminal pitch of 0.5mm enables high-density mounting, saving space on the circuit board and allowing for compact designs.

Speed: 96 rpm

With a speed of 96 rpm, this microcontroller can process instructions and data quickly, making it suitable for applications that require fast response times.

Technical Specifications

Microcontrollers STR910FM32X6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

ARM7

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

256

ROM Programmability:

FLASH

Speed:

96 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STR910FM32X6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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