Loading...

STR910FAM44X6T

STMicroelectronics

STR910FAM44X6T by STMicroelectronics

STR910FAM44X6T by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 2V and operates in -40 °C to 85°C. It features 80 terminals, ADC & DMA channels, making it ideal for industrial applications requiring robust connectivity. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,526

-

-

-

-

Anansix

USA . 1,168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,168

-

-

-

-

Digiode

USA . 395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

395

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 359 parts In-Stock

1+ parts

$61.183

100+ parts

-

1k+ parts

$55.064

10k+ parts

-

359

$61.183

-

$55.064

-

MKK Technologies

India . 1,861 parts In-Stock

1+ parts

$115.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,861

$115.050

-

-

-

DigiPath Technology Company

USA . 1,861 parts In-Stock

1+ parts

$115.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,861

$115.050

-

-

-

Corphita

USA . 1,917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,917

-

-

-

-

Parana Technologies

USA . 577 parts In-Stock

1+ parts

-

100+ parts

$73.153

1k+ parts

-

10k+ parts

-

577

-

$73.153

-

-

Overview

Unlock the potential of your next project with the STR910FAM44X6T microcontroller from STMicroelectronics. Renowned for its reliability and innovative technology, STMicroelectronics delivers unparalleled performance in a compact design, ideal for industrial applications. With features like versatile connectivity options and robust temperature resilience, this microcontroller ensures exceptional efficiency and longevity, empowering customers to create smarter solutions with confidence.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact installation on PCBs, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 2 V

With a low maximum supply voltage, this microcontroller is ideal for low-power applications, enhancing battery life in portable devices.

Package Shape: SQUARE

The square package shape provides a symmetrical layout that optimizes space utilization and improves thermal performance.

Bit Size: 32

A 32-bit architecture allows for higher processing power and more efficient handling of complex computations.

No. of Terminals: 80

Having 80 terminals provides flexibility in interfacing with a variety of peripherals and I/O devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style enables easy integration into high-density boards while maintaining a low profile to save space.

Minimum Supply Voltage: 1.65 V

Operating at a low minimum supply voltage makes this microcontroller energy-efficient, ideal for battery-operated devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature rating makes this microcontroller suitable for demanding industrial environments.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this microcontroller ensures reliable performance in extreme environmental conditions.

ADC Channels: YES

The inclusion of ADC channels supports analog signal processing, making it perfect for sensor applications.

DMA Channels: YES

DMA support allows for efficient data transfers without burdening the CPU, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal orientation simplifies PCB layout and assembly, saving time and costs in manufacturing.

ROM Words: 524288

This large ROM capacity allows for extensive programmability, making it well-suited for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height contributes to a compact design, making it ideal for modern slim devices.

Width: 12 mm

A standardized width of 12 mm fits common PCB footprints, simplifying integration into hardware.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

Rich peripheral support enhances versatility, facilitating various applications such as real-time tasks and device monitoring.

Maximum Clock Frequency: 25 MHz

The 25 MHz clock frequency ensures fast processing speeds, suitable for real-time applications.

Length: 12 mm

Like its width, this standard length helps in compatibility and ease of design within existing layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade classification ensures durability and reliability in harsher operational environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture improves execution efficiency, enhancing performance in computation-heavy tasks.

RAM Bytes: 98304

Substantial RAM size allows for complex data processing and storage of temporary variables during operations.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it an excellent choice for portable devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and provides mechanical stability on the PCB.

Analog To Digital Converters: 8-Ch 10-Bit

This capability to handle 8 channels of 10-bit resolution ADC enables accurate analog signal measurement for diverse applications.

Nominal Supply Voltage: 1.8 V

Operating at a nominal voltage of 1.8 V enhances power efficiency, crucial for battery-operated systems.

PWM Channels: YES

With built-in PWM channels, control of motors and other devices is simplified, promoting applications in automation.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Extensive connectivity options make this microcontroller suitable for diverse applications requiring multiple communication protocols.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, making it ideal for applications needing frequent updates.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for more terminals in a compact design, maximizing I/O capabilities.

Speed: 96 rpm

Operating at 96 rpm indicates the capability for moderate-speed applications, suitable for various industrial and consumer products.

On Chip Program ROM Width: 8

The 8-bit program ROM width supports efficient coding and extensive functionality within a compact space.

No. of I/O Lines: 40

With 40 I/O lines, this microcontroller can interface with multiple peripherals, enhancing application versatility.

Technical Specifications

Microcontrollers STR910FAM44X6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQFP-G80

Length:

12 mm

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR910FAM44X6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20