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STR910FAW42X6T

STMicroelectronics

STR910FAW42X6T by STMicroelectronics

STR910FAW42X6T by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 2V and operates in -40 °C to 85°C. It features 128 terminals, ADC, and DMA channels for efficient data processing. Ideal for industrial applications requiring robust connectivity options like CAN and UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,860 parts In-Stock

1+ parts

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2,860

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Anansix

USA . 2,437 parts In-Stock

1+ parts

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1k+ parts

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2,437

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Vyrian

USA . 1,083 parts In-Stock

1+ parts

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1,083

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,449 parts In-Stock

1+ parts

$17.807

100+ parts

-

1k+ parts

$16.026

10k+ parts

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1,449

$17.807

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$16.026

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MKK Technologies

India . 1,775 parts In-Stock

1+ parts

$33.484

100+ parts

-

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10k+ parts

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1,775

$33.484

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DigiPath Technology Company

USA . 1,775 parts In-Stock

1+ parts

$33.484

100+ parts

-

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10k+ parts

-

1,775

$33.484

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Corphita

USA . 3,401 parts In-Stock

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3,401

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Parana Technologies

USA . 2,352 parts In-Stock

1+ parts

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100+ parts

$21.290

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2,352

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$21.290

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Overview

Elevate your designs with the STR910FAW42X6T microcontroller by STMicroelectronics, where superior quality meets unmatched versatility. Engineered for demanding applications, this low-profile powerhouse thrives in industrial settings, offering robust performance from -40 °C to 85°C. With advanced connectivity options and integrated peripherals, it streamlines development while ensuring efficiency and reliability. Trust STMicroelectronics to deliver excellence that empowers innovation and accelerates your project success!

Feature Benefit Bullets

Surface Mount: YES

This microcontroller's surface mount design allows for compact board layouts, enabling the development of smaller electronic devices.

Maximum Supply Voltage: 2 V

With a maximum supply voltage of 2 V, this microcontroller is suitable for low-power applications, leading to energy savings and longer battery life.

Package Shape: SQUARE

The square package shape offers symmetry, making it easier to fit into tight spaces on PCB designs.

Bit Size: 32

A 32-bit architecture allows for more complex processing and higher performance, making it well-suited for advanced applications.

No. of Terminals: 128

With 128 terminals, this microcontroller provides flexibility for a wide range of peripheral connections and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile design enables a thinner overall profile for the device, facilitating space-constrained applications.

Minimum Supply Voltage: 1.65 V

A minimum supply voltage of 1.65 V allows for operation in energy-efficient environments, further enhancing battery life.

Maximum Operating Temperature: 85 °C

Operating reliably up to 85 °C makes this microcontroller suitable for industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C ensures reliable performance in extreme conditions, expanding its usability in various environments.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors for diverse applications, such as data acquisition.

DMA Channels: YES

Direct Memory Access capability allows for efficient data transfer without CPU intervention, enhancing overall processing efficiency.

Terminal Position: QUAD

Quad terminal positioning improves connection stability and supports multi-layer PCB designs.

ROM Words: 262144

A large ROM size allows for more complex firmware and applications to be stored directly on the chip.

Maximum Seated Height: 1.6 mm

The low seated height allows the microcontroller to fit into compact designs, crucial for portable devices.

Width: 14 mm

The 14 mm width is standard for many PCB designs, facilitating integration and compatibility with existing components.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

A rich set of peripherals enhances functionality, enabling tasks such as real-time clock management and watchdog timer implementation.

Maximum Clock Frequency: 25 MHz

With a clock frequency of 25 MHz, this microcontroller can handle demanding processing tasks, making it versatile for various applications.

Length: 14 mm

The 14 mm length allows for a compact footprint, which is essential for space-constrained electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this microcontroller can withstand harsher conditions, ensuring durability and reliability in critical applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Its RISC architecture offers efficient computation and speed, making it ideal for applications that require quick processing.

RAM Bytes: 98304

Adequate RAM size supports complex operations and multitasking, providing flexibility for application development.

Technology: CMOS

CMOS technology provides low power consumption while maintaining high performance, suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing leads are easier to solder and ensure better electrical connectivity, which is important for high-reliability applications.

Analog To Digital Converters: 8-Ch 10-Bit

The presence of 8-channel 10-bit ADCs allows for versatile analog signal processing, catering to a range of sensors and applications.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V optimizes power usage, making it a great choice for low-power designs.

PWM Channels: YES

Support for PWM channels makes it ideal for applications requiring motor control and signal modulation.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

A wide range of connectivity options facilitates easy integration with different devices and simplifies communication protocols.

ROM Programmability: FLASH

Flash ROM allows for easy updates and reprogramming of firmware, enhancing the microcontroller's adaptability in various projects.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch is fine enough for dense layouts yet widely supported in PCB designs.

Speed: 96 rpm

The 96 rpm specification indicates the potential for wheel or motor control applications, highlighting versatility in various implementations.

On Chip Program ROM Width: 8

An 8-bit program ROM width optimizes data access and processing speed, beneficial for performance-critical applications.

No. of I/O Lines: 80

80 I/O lines provide extensive interfacing options with external components, enhancing overall application capabilities.

Technical Specifications

Microcontrollers STR910FAW42X6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQFP-G128

Length:

14 mm

No. of I/O Lines:

80

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR910FAW42X6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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