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STR910FAW32X6

STMicroelectronics

STR910FAW32X6 by STMicroelectronics

STR910FAW32X6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 2V and operates b/w -40 °C to 85°C. It features 128 terminals, supports multiple connectivity options like CAN and UART, and includes ADC channels for versatile applications. Ideal for industrial use, it combines low power consumption with robust performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 18,300 parts In-Stock

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18,300

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Vyrian

USA . 9,138 parts In-Stock

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9,138

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Anansix

USA . 2,818 parts In-Stock

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2,818

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Digiode

USA . 751 parts In-Stock

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751

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Zilex Electronics Inc.

Canada . 15 parts In-Stock

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15

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Microfarads

USA . 8 parts In-Stock

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8

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Distributors (Availability)

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Microchip USA

USA . 382 parts In-Stock

1+ parts

$20.387

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-

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382

$20.387

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AZTECH Wire

Italy . 152 parts In-Stock

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$21.230

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152

$21.230

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IDEA Electronic Components Group

UK . 24 parts In-Stock

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$24.581

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$22.123

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24

$24.581

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$22.123

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MKK Technologies

India . 286 parts In-Stock

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$46.224

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286

$46.224

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DigiPath Technology Company

USA . 286 parts In-Stock

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$46.224

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286

$46.224

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Kepictronics

USA . 22,250 parts In-Stock

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22,250

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A-Z Elektronik GmbH

Germany . 5,807 parts In-Stock

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5,807

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Parana Technologies

USA . 1,800 parts In-Stock

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$29.391

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$29.391

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Perfect Parts

USA . 1,288 parts In-Stock

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1,288

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Corphita

USA . 1,225 parts In-Stock

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1,225

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Overview

Elevate your next project with the STR910FAW32X6 Microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. This compact 32-bit powerhouse is designed for efficiency and reliability across various applications—from industrial automation to consumer electronics. With superior performance, low power consumption, and robust connectivity options, it empowers developers to create cutting-edge designs that meet today’s demands while ensuring long-term value and unparalleled support from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction offers durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology enables compact design and efficient use of board space, facilitating easier integration into modern electronic devices.

Maximum Supply Voltage: 2 V

This low maximum supply voltage allows for energy-efficient operations, making it ideal for battery-powered applications.

Package Shape: SQUARE

A square package shape optimizes space on the PCB, allowing for a more versatile layout in electronic designs.

Bit Size: 32

With a 32-bit architecture, this microcontroller supports complex calculations and larger amounts of data, enhancing processing capabilities.

Power Supplies (V): 3/3.3

The ability to operate at 3 or 3.3 volts provides compatibility with a wide range of power systems.

No. of Terminals: 128

A higher number of terminals allows for more connections and interfaces, which broadens the scope of application.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is designed to conserve space and support high-density mounting, ideal for modern electronics.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage enables operation in low-power scenarios, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Withstanding higher temperatures makes this microcontroller suitable for industrial environments and demanding applications.

CPU Family: ARM7

The ARM7 family provides efficient processing, with a well-established ecosystem and support for powerful applications.

Minimum Operating Temperature: -40 °C

Extreme operating temperature range ensures reliability in harsh conditions, making it suited for outdoor and industrial use.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and reduces issues related to oxidation, enhancing durability in manufacturing.

ADC Channels: YES

Availability of ADC channels allows for the conversion of analog signals to digital, expanding application possibilities in sensor interfacing.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning facilitates better soldering, improving reliability and connection quality on the PCB.

ROM Words: 262144

Large ROM capacity allows for extensive program storage, accommodating complex applications and multitasking.

Maximum Seated Height: 1.6 mm

A low seated height contributes to a flat profile, making it suitable for space-constrained applications.

Width: 14 mm

Compact width enhances the microcontroller's adaptability for various designs while optimizing PCB layout.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

Integrated peripherals provide versatile functionality for real-time applications, enhancing overall feature set.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz enables faster processing and quick response times, ideal for real-time systems.

Maximum Time At Peak Reflow Temperature (s): 30

Designed to withstand reflow soldering processes efficiently, ensuring reliability in manufacturing.

Peak Reflow Temperature (°C): 250

High resistance to peak temperature improves durability during assembly, mitigating assembly-related failures.

Length: 14 mm

Compact length supports integration in small electronic devices without compromising performance.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed for high reliability in continuous operation, ensuring dependable performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides a streamlined instruction set, enabling efficient execution of various applications.

RAM Bytes: 65536

With sufficient RAM, complex algorithms and data can be processed efficiently, supporting sophisticated applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing leads enhance mechanical strength and solderability, ensuring a stable connection to the PCB.

Analog To Digital Converters: 8-Ch 10-Bit

Multiple 10-bit ADC channels allow for concurrent signal sampling, facilitating detailed analysis in real-time applications.

Nominal Supply Voltage: 1.8 V

A nominal voltage of 1.8 volts optimizes power efficiency while maintaining performance across various applications.

PWM Channels: YES

PWM capability supports a variety of motor control and signal modulation applications, enhancing versatility.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Rich connectivity options provide extensive interfacing capabilities, allowing integration in diverse application environments.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, ensuring longevity and adaptability.

Terminal Pitch: 0.4 mm

A tight terminal pitch permits high-density designs, supporting modern miniaturization trends in electronics.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates a moderate sensitivity to moisture, offering guidance on handling and storage for reliability.

Speed: 96 rpm

Speed capabilities enrich control applications, allowing for refined manipulation in robotic and automation systems.

On Chip Program ROM Width: 8

The 8-bit program ROM width enhances compatibility with various coding standards and applications.

No. of I/O Lines: 80

A significant number of I/O lines provides flexibility for interfacing with multiple peripherals and sensors in various projects.

Technical Specifications

Microcontrollers STR910FAW32X6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3)

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR910FAW32X6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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