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STR910FW32X6

STMicroelectronics

STR910FW32X6 by STMicroelectronics

STR910FW32X6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 2V and operates in extreme temps from -40 °C to 85 °C. It features 80 I/O lines, ADC, and PWM channels, making it ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,878 parts In-Stock

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Digiode

USA . 1,572 parts In-Stock

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Anansix

USA . 1,241 parts In-Stock

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Zilex Electronics Inc.

Canada . 38 parts In-Stock

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Microchip USA

USA . 206 parts In-Stock

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$13.315

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206

$13.315

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AZTECH Wire

Italy . 579 parts In-Stock

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$21.130

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579

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IDEA Electronic Components Group

UK . 1,296 parts In-Stock

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$51.282

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$46.154

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$51.282

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$46.154

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MKK Technologies

India . 907 parts In-Stock

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$96.432

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907

$96.432

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DigiPath Technology Company

USA . 907 parts In-Stock

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$96.432

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$96.432

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QUARKTWIN TECHNOLOGY LTD

USA . 9,612 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,961 parts In-Stock

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Corphita

USA . 3,792 parts In-Stock

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Parana Technologies

USA . 2,158 parts In-Stock

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$61.315

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Kepictronics

USA . 1,000 parts In-Stock

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Overview

Elevate your projects with the STR910FW32X6 microcontroller from STMicroelectronics, a titan in innovation and quality. Designed for versatility, this 32-bit ARM7 powerhouse excels in diverse applications from industrial automation to consumer electronics. With impressive performance at low power consumption, it ensures reliability even in extreme conditions. Trust STMicroelectronics to deliver superior solutions that enhance efficiency, speed, and functionality, giving you a competitive edge.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material ensures reliable performance in various environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space.

Maximum Supply Voltage: 2 V

Low maximum supply voltage enhances power efficiency, making it suitable for battery-operated devices.

Address Bus Width: 16

A 16-bit address bus width allows for accessing a larger memory space, providing flexibility for application development.

Package Shape: SQUARE

Square package shape provides uniform surface mount characteristics for reliable assembly.

Bit Size: 32

32-bit architecture enhances processing power and performance for complex applications.

Power Supplies (V): 1.8, 3/3.3

Multiple supply voltage options enable compatibility with a wider range of devices and systems.

No. of Terminals: 128

A higher number of terminals allows for diverse peripheral connections and enhanced functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile package style is suitable for space-constrained applications and promotes ease of handling.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage improves overall power efficiency, suitable for energy-sensitive applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature indicates reliability in demanding industrial environments.

CPU Family: ARM7

Based on the popular ARM7 architecture, it benefits from extensive industry support and resources.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in extreme environments, making it suitable for industrial applications.

ADC Channels: YES

Integrated ADC channels provide the capability for sensing and data acquisition, enhancing versatility.

DMA Channels: YES

With DMA channels available, data transfer is efficient, allowing for better CPU utilization.

Terminal Position: QUAD

Quad terminal positioning aids in better soldering and electrical performance.

ROM Words: 256

256 ROM words provide adequate storage for firmware and basic applications.

Maximum Seated Height: 1.6 mm

Low profile height is advantageous for compact designs and tighter spaces.

Width: 14 mm

Compact width allows for dense PCB layouts, accommodating more components in limited space.

External Data Bus Width: 16

A 16-bit external data bus supports higher data throughput, beneficial for performance-intensive applications.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz supports moderately fast processing, suitable for many applications.

Length: 14 mm

Short length contributes to a compact design, allowing for integration in space-restricted devices.

Temperature Grade: INDUSTRIAL

Industrial grade ensures reliability and performance in challenging environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high efficiency and performance, suitable for a variety of applications.

RAM Bytes: 65536

64 KB of RAM provides ample memory for running applications and data processing.

Technology: CMOS

CMOS technology delivers low power consumption while maintaining high speed, ideal for portable applications.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint reliability and allows for easy PCB integration.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V optimizes power usage and thermal output.

PWM Channels: YES

PWM capabilities enable precise control in applications requiring motor control and signal modulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware.

Terminal Pitch: 0.4 mm

The fine terminal pitch supports compact layouts, accommodating more functionalities in smaller footprints.

Speed: 96 rpm

Supports speed of 96 rpm which can be suitable for specific applications, particularly in control systems.

No. of I/O Lines: 80

Having 80 I/O lines provides significant interfacing options for various peripherals and modules.

Technical Specifications

Microcontrollers STR910FW32X6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

16

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G128

Length:

14 mm

No. of I/O Lines:

80

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

256

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STR910FW32X6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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