Loading...

STR912FAW47X6T

STMicroelectronics

STR912FAW47X6T by STMicroelectronics

STR912FAW47X6T by STMicroelectronics is a 32-bit ARM7 microcontroller with 128 terminals, operating at up to 25 MHz. It features 8-Ch 10-Bit ADC channels, CAN, Ethernet, USB connectivity, and on-chip Flash ROM for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,784

-

-

-

-

Digiode

USA . 4,804 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,804

-

-

-

-

Anansix

USA . 1,459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,459

-

-

-

-

Chip Stock

USA . 305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

305

-

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 513 parts In-Stock

1+ parts

$18.810

100+ parts

-

1k+ parts

-

10k+ parts

-

513

$18.810

-

-

-

Ampacity Inc.

Singapore . 789 parts In-Stock

1+ parts

$23.000

100+ parts

-

1k+ parts

-

10k+ parts

-

789

$23.000

-

-

-

IDEA Electronic Components Group

UK . 255 parts In-Stock

1+ parts

$23.011

100+ parts

-

1k+ parts

$20.710

10k+ parts

-

255

$23.011

-

$20.710

-

Semicontronic

India . 1,448 parts In-Stock

1+ parts

$25.000

100+ parts

$24.375

1k+ parts

$24.250

10k+ parts

-

1,448

$25.000

$24.375

$24.250

-

MKK Technologies

India . 11 parts In-Stock

1+ parts

$43.271

100+ parts

-

1k+ parts

-

10k+ parts

-

11

$43.271

-

-

-

DigiPath Technology Company

USA . 11 parts In-Stock

1+ parts

$43.271

100+ parts

-

1k+ parts

-

10k+ parts

-

11

$43.271

-

-

-

Microchip USA

USA . 240 parts In-Stock

1+ parts

$632.401

100+ parts

-

1k+ parts

-

10k+ parts

-

240

$632.401

-

-

-

Argo Parts USA

USA . 4,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,910

-

-

-

-

Corphita

USA . 4,874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,874

-

-

-

-

Continental Prestige Electronics

USA . 4,463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,463

-

-

-

-

Lixinc

USA . 1,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,927

-

-

-

-

S.R.D Solutions

India . 823 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

823

-

-

-

-

Parana Technologies

USA . 664 parts In-Stock

1+ parts

-

100+ parts

$27.513

1k+ parts

-

10k+ parts

-

664

-

$27.513

-

-

A-Z Elektronik GmbH

Germany . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

600

-

-

-

-

Kepictronics

USA . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

400

-

-

-

-

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Discover the power and reliability of the STR912FAW47X6T microcontroller from STMicroelectronics, a leading manufacturer in the industry. This versatile device is perfect for a wide range of applications, offering advanced features and cutting-edge technology. With its high-quality construction and impressive performance, this microcontroller delivers exceptional value to customers seeking top-notch solutions for their projects. Experience the benefits of seamless connectivity, efficient power management, and innovative design with the STR912FAW47X6T, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for compact and portable devices.

Surface Mount: YES

Simplifies assembly process and allows for smaller PCB footprint.

Maximum Supply Voltage: 2 V

Efficient power management and low power consumption.

Bit Size: 32

High processing power for advanced applications.

Power Supplies (V): 1.8,3/3.3

Compatible with various voltage requirements for versatile use.

No. of Terminals: 128

Plenty of connectivity options for interfacing with other components.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature fluctuations.

CPU Family: ARM7

Reliable and efficient ARM architecture for optimal performance.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold conditions for outdoor or refrigeration applications.

ADC Channels: YES

Analog to digital conversion capabilities for sensor interfacing and data acquisition.

DMA Channels: YES

Direct Memory Access for high-speed data transfer without CPU intervention.

ROM Words: 2097152

Large memory capacity for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient instruction execution and streamlined processing.

RAM Bytes: 98304

Sufficient random access memory for temporary data storage and multitasking.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADC channels with high resolution for accurate analog signal processing.

Connectivity: CAN, ETHERNET, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Versatile communication interfaces for connecting to various devices and networks.

Technical Specifications

Microcontrollers STR912FAW47X6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

80

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, ETHERNET, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR912FAW47X6T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19