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STR910FM32X6

STMicroelectronics

STR910FM32X6 by STMicroelectronics

STR910FM32X6 by STMicroelectronics is a 32-bit ARM7 microcontroller ideal for industrial applications. It operates at 1.65-2V, features 80 terminals, and supports ADC and PWM channels. With a max temp of 85 °C and flash ROM, it's perfect for robust environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,726 parts In-Stock

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8,726

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Anansix

USA . 2,437 parts In-Stock

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2,437

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Digiode

USA . 803 parts In-Stock

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803

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Distributors (Availability)

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AZTECH Wire

Italy . 741 parts In-Stock

1+ parts

$11.950

100+ parts

-

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741

$11.950

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Microchip USA

USA . 294 parts In-Stock

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$17.844

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294

$17.844

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IDEA Electronic Components Group

UK . 889 parts In-Stock

1+ parts

$73.966

100+ parts

-

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$66.570

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889

$73.966

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$66.570

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MKK Technologies

India . 1,534 parts In-Stock

1+ parts

$139.089

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1,534

$139.089

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DigiPath Technology Company

USA . 1,534 parts In-Stock

1+ parts

$139.089

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1,534

$139.089

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Kepictronics

USA . 9,900 parts In-Stock

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9,900

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Corphita

USA . 697 parts In-Stock

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Parana Technologies

USA . 468 parts In-Stock

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$88.438

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468

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$88.438

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Overview

Experience unmatched performance with the STR910FM32X6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for industrial applications, this low-power, 32-bit marvel offers robust reliability and efficiency. With features like advanced ADC and DMA channels, it empowers your projects to excel while optimizing space and energy. Trust in STMicroelectronics’ legacy of quality to elevate your designs and drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package ensures robust protection for the microcontroller, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for a compact design, saving space on PCBs, ideal for modern electronic applications.

Maximum Supply Voltage: 2 V

A low maximum supply voltage is conducive for energy-efficient applications, minimizing power consumption.

Package Shape: SQUARE

The square package shape allows for symmetrical placement on PCBs, facilitating even heat distribution and layout simplicity.

Bit Size: 32

The 32-bit architecture supports complex computations and high-performance applications, enhancing overall processing capability.

Power Supplies (V): 1.8, 3/3.3

Multiple voltage supply options increase versatility, enabling compatibility with a wide range of power systems.

No. of Terminals: 80

With 80 terminals, the microcontroller can support numerous peripherals and I/O operations, making it suitable for complex applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This packaging style optimizes layout density and improves performance by reducing lead inductance.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage facilitates battery-driven applications, enhancing energy efficiency and device longevity.

Maximum Operating Temperature: 85 °C

This high operational temperature rating ensures reliability and performance even in harsh environments.

CPU Family: ARM7

The ARM7 CPU family is known for efficient processing and low power consumption, making it ideal for embedded systems.

Minimum Operating Temperature: -40 °C

The temperature range allows this microcontroller to be used in extreme environmental conditions, suitable for industrial applications.

ADC Channels: YES

The presence of ADC channels enhances the ability to process analog signals, vital for sensor interfacing.

DMA Channels: YES

DMA channels improve data transfer efficiency, allowing faster operation without burdening the CPU.

Terminal Position: QUAD

Quad terminal positioning promotes better heat dissipation and eases soldering processes during assembly.

ROM Words: 256

The ROM capacity supports storage of essential firmware and boot code, crucial for embedded applications.

Maximum Seated Height: 1.6 mm

A low seated height enables compact device designs, improving overall system integration.

Width: 12 mm

This standard width allows easy integration into various PCB designs without requiring custom layouts.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz enables efficient processing and responsiveness in high-speed applications.

Length: 12 mm

Standard size dimensions facilitate compatibility with multiple PCB designs and layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures durability and functionality in demanding operations and environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for simpler instruction sets, translating into faster execution of tasks.

RAM Bytes: 65536

With 65,536 bytes of RAM, the microcontroller can handle complex applications with multiple concurrent tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing overall device reliability.

Terminal Form: GULL WING

Gull wing terminals offer easy soldering and enhanced mechanical stability, making assembly simple and reliable.

Nominal Supply Voltage: 1.8 V

A nominal voltage of 1.8 V makes this microcontroller highly compatible with low-power circuits.

PWM Channels: YES

The inclusion of PWM channels allows for efficient motor control and precise signal generation in applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware during the lifecycle of the product.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables a higher density of connections, maximizing the capabilities of compact designs.

Speed: 96 rpm

The high operational speed allows for efficient control of connected devices, enhancing performance.

No. of I/O Lines: 40

With 40 I/O lines, the microcontroller can interface with a variety of devices and peripherals, making it very versatile.

Technical Specifications

Microcontrollers STR910FM32X6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

256

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

STR910FM32X6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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