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STGPL6NC60D

STMicroelectronics

STGPL6NC60D by STMicroelectronics

STGPL6NC60D from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600V, 14A collector current, and a fast turn-off time of 122ns. Ideal for high-temperature environments with a max operating temp of 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,925 parts In-Stock

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3,925

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Digiode

USA . 870 parts In-Stock

1+ parts

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870

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Anansix

USA . 622 parts In-Stock

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622

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,411 parts In-Stock

1+ parts

$1.336

100+ parts

-

1k+ parts

$1.202

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1,411

$1.336

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$1.202

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MKK Technologies

India . 2,063 parts In-Stock

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$2.512

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2,063

$2.512

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DigiPath Technology Company

USA . 2,063 parts In-Stock

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$2.512

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2,063

$2.512

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AZTECH Wire

Italy . 1,154 parts In-Stock

1+ parts

$14.590

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1,154

$14.590

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Ampacity Inc.

Singapore . 691 parts In-Stock

1+ parts

$65.050

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691

$65.050

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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A-Z Elektronik GmbH

Germany . 7,331 parts In-Stock

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7,331

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QUARKTWIN TECHNOLOGY LTD

USA . 2,106 parts In-Stock

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2,106

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Parana Technologies

USA . 1,084 parts In-Stock

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$1.597

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1,084

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$1.597

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Corphita

USA . 941 parts In-Stock

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941

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Perfect Parts

USA . 917 parts In-Stock

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917

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Overview

Unlock unparalleled performance with the STGPL6NC60D from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel Insulated Gate Bipolar Transistor (IGBT) is designed for optimal power control, ensuring efficiency and reliability in diverse applications. With its robust construction and superior thermal management, it seamlessly handles high voltages and currents, empowering your projects to achieve peak performance while reducing energy consumption. Trust STMicroelectronics for quality that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robust protection and reliability under various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel devices offer lower on-state resistance and higher efficiency, making them ideal for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and reduces component count, enhancing overall system efficiency.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is suitable for demanding applications such as inverters and motor drives.

Package Shape: RECTANGULAR

The rectangular package shape allows for effective heat dissipation, contributing to the overall thermal management of the device.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide excellent mechanical stability and ease of soldering, ensuring reliable connections in circuits.

Nominal Turn Off Time (toff): 122 ns

A fast turn-off time enhances switching performance, reducing losses in high-frequency applications.

No. of Terminals: 3

The three-terminal configuration facilitates easy integration into various circuits and simplifies design requirements.

Maximum Power Dissipation (Abs): 56 W

A maximum power dissipation of 56 W allows the IGBT to handle significant power without overheating, suitable for heavy-duty applications.

Package Style (Meter): FLANGE MOUNT

The flange mount style enhances mechanical support and thermal connectivity, essential for high-power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can perform reliably in harsh environments, extending its application range.

Maximum Collector-Emitter Voltage: 600 V

A collector-emitter voltage rating of 600 V makes this device suitable for medium voltage applications, enhancing versatility.

Transistor Element Material: SILICON

Silicon as the semiconductor material offers good thermal conductivity and efficiency for power electronics.

Maximum Gate-Emitter Voltage: 20 V

This high gate-emitter voltage allows for better driving capabilities, increasing overall control and performance in circuits.

Maximum Collector Current (IC): 14 A

A maximum collector current rating of 14 A enables the IGBT to manage significant load currents effectively.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A relatively low threshold voltage allows for ease of operation and ensures that the device can be driven efficiently.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and prevents corrosion, ensuring long-term reliability in electronic connections.

Terminal Position: SINGLE

The single terminal position simplifies PCB layout and integration into various applications.

Nominal Turn On Time (ton): 10.5 ns

A nominal turn-on time of 10.5 ns contributes to higher switching speeds, improving system efficiency in dynamic applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGPL6NC60D attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

122 ns

Nominal Turn On Time (ton):

10.5 ns

Trade Compliance

STGPL6NC60D Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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