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STGF30H65DFB2

STMicroelectronics

STGF30H65DFB2 by STMicroelectronics

STGF30H65DFB2 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max VCEsat of 2.1V, supports up to 50A collector current, and operates at temperatures from -55 °C to 175 °C. Ideal for high-performance switching in industrial systems.

Median Price

$1.250

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 5 parts In-Stock

1+ parts

$1.250

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$1.250

-

-

-

Element14

Singapore . 5 parts In-Stock

1+ parts

$1.770

100+ parts

$1.500

1k+ parts

$1.360

10k+ parts

-

5

$1.770

$1.500

$1.360

-

Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.880

1k+ parts

$0.830

10k+ parts

$0.795

1,000

-

$0.880

$0.830

$0.795

Avnet

USA . 950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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950

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,154

-

-

-

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Digiode

USA . 2,448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,448

-

-

-

-

IBS Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.151

1k+ parts

$1.085

10k+ parts

$1.040

1,000

-

$1.151

$1.085

$1.040

Anansix

USA . 445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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445

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 175 parts In-Stock

1+ parts

$1.497

100+ parts

-

1k+ parts

$1.347

10k+ parts

-

175

$1.497

-

$1.347

-

MKK Technologies

India . 1,869 parts In-Stock

1+ parts

$2.815

100+ parts

-

1k+ parts

-

10k+ parts

-

1,869

$2.815

-

-

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DigiPath Technology Company

USA . 1,869 parts In-Stock

1+ parts

$2.815

100+ parts

-

1k+ parts

-

10k+ parts

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1,869

$2.815

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Microchip USA

USA . 2,634 parts In-Stock

1+ parts

$8.220

100+ parts

-

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10k+ parts

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2,634

$8.220

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-

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Parana Technologies

USA . 1,195 parts In-Stock

1+ parts

-

100+ parts

$1.790

1k+ parts

-

10k+ parts

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1,195

-

$1.790

-

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Corphita

USA . 382 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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382

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-

-

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Overview

Unlock exceptional performance with the STGF30H65DFB2 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel IGBT ensures efficient power control for diverse applications, boasting reliability and robust construction. With its low saturation voltage and rapid switching capabilities, it enhances energy efficiency and system responsiveness. Choose STMicroelectronics for quality you can trust, elevating your projects to new heights of performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides excellent protection against environmental factors, enhancing durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel configuration is known for its efficiency and higher electron mobility, making it suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode increases versatility, allowing for applications requiring both switching and rectification without needing an external component.

Transistor Application: POWER CONTROL

Designed for power control, this IGBT is ideal for applications such as motor drives and power inverters, providing effective regulation and efficiency.

Maximum VCEsat: 2.1 V

A low VCEsat value contributes to lower power losses during operation, thereby improving overall efficiency and thermal performance.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into circuit designs and optimizes thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and make soldering easier, enhancing reliability in various applications.

Nominal Turn Off Time (toff): 184 ns

A relatively quick turn-off time allows for high-speed operation, making it suitable for pulse-width modulation and fast switching applications.

No. of Terminals: 3

With three terminals, this IGBT offers a straightforward connection scheme that simplifies circuit design and integration.

Maximum Power Dissipation (Abs): 50 W

A high maximum power dissipation rating indicates the capability to handle significant power loads while maintaining performance integrity.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures effective heat dissipation and robust mounting solutions, crucial for high-power applications.

Maximum Operating Temperature: 175 °C

A high operating temperature threshold enables this IGBT to function effectively in demanding environments without thermal failure.

Maximum Collector-Emitter Voltage: 650 V

A 650 V rating allows this device to be used in a wide range of applications, from power supplies to industrial equipment.

Transistor Element Material: SILICON

Silicon as a base material ensures reliability and performance at higher temperatures, making it suitable for industrial applications.

Maximum Gate-Emitter Voltage: 20 V

A gate-emitter voltage limit of 20 V enables efficient control and ensures compatibility with standard driving circuits.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature makes this IGBT suitable for application in extreme environments, such as aerospace and military.

Maximum Collector Current (IC): 50 A

The ability to handle up to 50 A allows for substantial current flow, making this IGBT ideal for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

A lower threshold voltage improves the switching performance and allows for better control in various applications.

Terminal Position: SINGLE

Single terminal position simplifies the layout and design process for PCB applications, thereby reducing space and complexity.

Case Connection: ISOLATED

An isolated case connection helps prevent undesired current paths and enhances safety measures in high-voltage applications.

Nominal Turn On Time (ton): 27.5 ns

Fast turn-on time contributes to improved switching frequency and efficiency, suitable for high-performance applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGF30H65DFB2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

184 ns

Nominal Turn On Time (ton):

27.5 ns

Maximum VCEsat:

2.1 V

Trade Compliance

STGF30H65DFB2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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