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STGB5H60DF

STMicroelectronics

STGB5H60DF by STMicroelectronics

STGB5H60DF from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max VCEsat of 1.95V, supports up to 600V collector-emitter voltage, and operates in temperatures from -55 °C to 175 °C. Its compact surface mount design ensures versatility in various electronic systems.

Median Price

$5.470

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 1,870 parts In-Stock

1+ parts

-

100+ parts

$2.350

1k+ parts

$0.938

10k+ parts

$0.867

1,870

-

$2.350

$0.938

$0.867

Chip1Stop

Japan . 1,870 parts In-Stock

1+ parts

-

100+ parts

$8.590

1k+ parts

$7.750

10k+ parts

-

1,870

-

$8.590

$7.750

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,262 parts In-Stock

1+ parts

-

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-

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-

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7,262

-

-

-

-

Digiode

USA . 4,759 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,759

-

-

-

-

Rapid Electronics

USA . 1,870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

1,870

-

-

-

-

Anansix

USA . 132 parts In-Stock

1+ parts

-

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-

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-

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132

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 717 parts In-Stock

1+ parts

$1.520

100+ parts

-

1k+ parts

$1.368

10k+ parts

-

717

$1.520

-

$1.368

-

MKK Technologies

India . 1,014 parts In-Stock

1+ parts

$2.858

100+ parts

-

1k+ parts

-

10k+ parts

-

1,014

$2.858

-

-

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DigiPath Technology Company

USA . 1,014 parts In-Stock

1+ parts

$2.858

100+ parts

-

1k+ parts

-

10k+ parts

-

1,014

$2.858

-

-

-

Microchip USA

USA . 2,089 parts In-Stock

1+ parts

$4.212

100+ parts

-

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-

10k+ parts

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2,089

$4.212

-

-

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AZTECH Wire

Italy . 297 parts In-Stock

1+ parts

$21.890

100+ parts

-

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-

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297

$21.890

-

-

-

RC Electronics

USA . 3,370 parts In-Stock

1+ parts

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3,370

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-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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-

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

-

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Corphita

USA . 1,749 parts In-Stock

1+ parts

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1,749

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Parana Technologies

USA . 1,427 parts In-Stock

1+ parts

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100+ parts

$1.817

1k+ parts

-

10k+ parts

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1,427

-

$1.817

-

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Overview

Unlock the power of efficiency with the STGB5H60DF from STMicroelectronics! This top-tier insulated gate bipolar transistor (IGBT) excels in power control applications, delivering unmatched quality and reliability. With ST's renowned expertise and commitment to innovation, you're assured of superior performance that enhances your designs. Ideal for various sectors, this versatile component not only optimizes energy use but also supports higher thermal management, ensuring long-lasting value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, ensuring reliable performance in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer lower conduction losses, making this product efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design, making this IGBT suitable for applications like switching and rectification.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is ideal for high-efficiency applications in industrial and automotive sectors.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly, enhancing reliability and reducing space requirements.

Maximum VCEsat: 1.95 V

A low maximum VCEsat reduces power loss during operation, making this IGBT energy-efficient in high-performance applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates better PCB layout and efficient thermal management in compact spaces.

Terminal Form: GULL WING

Gull wing terminals provide optimal soldering conditions, ensuring robust connections and reliability in circuit integration.

Nominal Turn Off Time (toff): 280 ns

A fast turn-off time enhances the switching frequency capabilities of the IGBT, making it suitable for high-speed applications.

No. of Terminals: 2

Having just two terminals simplifies the design and connection of devices without unnecessary complexity.

Maximum Power Dissipation (Abs): 88 W

High power dissipation capability allows this IGBT to handle substantial amounts of power, making it reliable for demanding applications.

Package Style (Meter): SMALL OUTLINE

A small outline package reduces the overall footprint on boards, enabling more efficient use of space in compact electronic devices.

Maximum Operating Temperature: 175 °C

The ability to operate at high temperatures expands the range of applications in harsh environments without compromising performance.

Maximum Collector-Emitter Voltage: 600 V

A high collector-emitter voltage rating allows this IGBT to be utilized in high-voltage applications, enhancing its versatility.

Transistor Element Material: SILICON

Silicon as a material offers good electrical properties and thermal stability, ensuring reliable operation across various environments.

Maximum Gate-Emitter Voltage: 20 V

The robust gate-emitter voltage rating provides flexibility in circuit design, allowing for compatibility with various control signals.

Minimum Operating Temperature: -55 °C

Withstanding low temperatures expands potential applications in extreme environments, enhancing reliability in diverse conditions.

Maximum Collector Current (IC): 10 A

A high collector current capability enables the IGBT to handle significant loads, making it suitable for demanding power applications.

Maximum Gate-Emitter Threshold Voltage: 6.9 V

A moderate threshold voltage helps in reducing power consumption in gate driving circuits, enhancing overall efficiency.

Terminal Position: SINGLE

Single terminal position aids in straightforward integration into designs, simplifying both manufacturing and maintenance processes.

Case Connection: COLLECTOR

Collector case connection ensures effective heat dissipation, which is vital for maintaining the integrity of the device during operation.

Nominal Turn On Time (ton): 39 ns

A fast turn-on time supports higher switching frequencies, ideal for applications where quick response times are critical.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGB5H60DF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Additional Features:

BULK: 1000

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.9 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

280 ns

Nominal Turn On Time (ton):

39 ns

Maximum VCEsat:

1.95 V

Trade Compliance

STGB5H60DF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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