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STGB3HF60HD

STMicroelectronics

STGB3HF60HD by STMicroelectronics

STGB3HF60HD from STMicroelectronics is an N-channel IGBT designed for power control applications. It features a max VCEsat of 2.95V, 600V collector-emitter voltage, and operates at temperatures up to 150 °C. Its compact surface mount design ensures efficient performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,237 parts In-Stock

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5,237

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Anansix

USA . 1,136 parts In-Stock

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1,136

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Digiode

USA . 463 parts In-Stock

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463

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 244 parts In-Stock

1+ parts

$1.654

100+ parts

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$1.489

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244

$1.654

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$1.489

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MKK Technologies

India . 1,520 parts In-Stock

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$3.111

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1,520

$3.111

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DigiPath Technology Company

USA . 1,520 parts In-Stock

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$3.111

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1,520

$3.111

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AZTECH Wire

Italy . 923 parts In-Stock

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$19.410

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923

$19.410

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QUARKTWIN TECHNOLOGY LTD

USA . 2,262 parts In-Stock

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Corphita

USA . 1,335 parts In-Stock

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Parana Technologies

USA . 601 parts In-Stock

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$1.978

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601

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$1.978

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Overview

Unlock the power of advanced technology with the STGB3HF60HD by STMicroelectronics! This high-performance IGBT ensures unmatched efficiency and reliability in power control applications, making it perfect for everything from renewable energy systems to industrial automation. With a robust design and superior thermal performance, STMicroelectronics guarantees quality you can trust. Elevate your projects and experience the benefits of cutting-edge innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides excellent durability and thermal resistance, making this IGBT suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration is known for its efficiency and high-speed performance, making this IGBT ideal for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances performance in power control scenarios by providing reverse protection.

Transistor Application: POWER CONTROL

Designed for power control applications, this IGBT delivers reliable and efficient performance in various power regulation tasks.

Surface Mount: YES

Surface mount capability allows for easier integration into compact circuit designs, minimizing space and facilitating automated assembly.

Maximum VCEsat: 2.95 V

A low VCEsat indicates reduced power loss during operation, enhancing overall system efficiency and thermal management.

Package Shape: RECTANGULAR

The rectangular package shape aids in effective layout design on printed circuit boards, optimizing space utilization.

Terminal Form: GULL WING

Gull wing terminals ensure reliable soldering connections, improving the mechanical stability and electrical performance of the product.

Nominal Turn Off Time (toff): 140 ns

Fast turn-off time contributes to rapid switching capabilities, allowing for higher frequency applications and precise control.

No. of Terminals: 2

The two-terminal design simplifies application and integration into various circuits while maintaining effective functionality.

Maximum Power Dissipation (Abs): 38 W

A high power dissipation capability ensures that this IGBT can handle demanding applications without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, helping to minimize the overall footprint of the design.

Maximum Operating Temperature: 150 °C

High operating temperature range allows for reliable performance in harsh environments, extending the lifespan of the device.

Maximum Collector-Emitter Voltage: 600 V

With a high voltage rating, this IGBT can be utilized in high-power applications, enhancing its versatility across various fields.

Transistor Element Material: SILICON

Silicon material provides a good balance of performance, cost, and reliability, making it the standard choice for IGBT applications.

Maximum Gate-Emitter Voltage: 20 V

A high gate-emitter voltage rating allows for flexibility in gate driving methods, contributing to improved performance.

Minimum Operating Temperature: -55 °C

The wide temperature range makes this IGBT suitable for use in extreme conditions, ensuring functionality across diverse environments.

Maximum Collector Current (IC): 7.5 A

A high collector current capability ensures that this device can handle substantial loads in power control applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

The threshold voltage allows for efficient turn-on characteristics, ensuring lower power consumption in gate driving circuits.

Terminal Position: SINGLE

Single terminal positioning simplifies PCB layout and assembly, ensuring easier manufacturing and design processes.

Case Connection: COLLECTOR

The collector connection enhances the reliability and performance of the IGBT in power control applications.

Nominal Turn On Time (ton): 15 ns

A very fast turn-on time ensures rapid switching capability, enhancing device performance and efficiency in fast circuit applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGB3HF60HD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

140 ns

Nominal Turn On Time (ton):

15 ns

Maximum VCEsat:

2.95 V

Trade Compliance

STGB3HF60HD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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