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RHFACT244K1

STMicroelectronics

RHFACT244K1 by STMicroelectronics

RHFACT244K1 by STMicroelectronics is an 8-bit bus driver with a ceramic, metal-sealed package. It operates b/w -55 °C and 150 °C, supporting a supply voltage of 4.5V to 5.5V. Ideal for high-temperature applications, it features unidirectional data flow and flatpack design.

Median Price

$333.080

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3 parts In-Stock

1+ parts

$333.080

100+ parts

$276.418

1k+ parts

-

10k+ parts

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3

$333.080

$276.418

-

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Arrow

USA . 6 parts In-Stock

1+ parts

-

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-

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6

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Verical

USA . 6 parts In-Stock

1+ parts

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6

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Chip1Stop

Japan . 6 parts In-Stock

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6

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,773 parts In-Stock

1+ parts

$259.255

100+ parts

-

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1,773

$259.255

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Vyrian

USA . 6,772 parts In-Stock

1+ parts

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6,772

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Anansix

USA . 1,066 parts In-Stock

1+ parts

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1,066

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,200 parts In-Stock

1+ parts

$6.460

100+ parts

-

1k+ parts

$6.201

10k+ parts

$6.201

1,200

$6.460

-

$6.201

$6.201

Advanced Electronics

New Zealand . 31 parts In-Stock

1+ parts

$12.882

100+ parts

$11.723

1k+ parts

$10.563

10k+ parts

-

31

$12.882

$11.723

$10.563

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IDEA Electronic Components Group

UK . 2,310 parts In-Stock

1+ parts

$24.117

100+ parts

-

1k+ parts

$21.705

10k+ parts

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2,310

$24.117

-

$21.705

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MKK Technologies

India . 894 parts In-Stock

1+ parts

$45.350

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894

$45.350

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DigiPath Technology Company

USA . 894 parts In-Stock

1+ parts

$45.350

100+ parts

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894

$45.350

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Corphita

USA . 3,642 parts In-Stock

1+ parts

$245.610

100+ parts

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3,642

$245.610

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Parana Technologies

USA . 1,399 parts In-Stock

1+ parts

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100+ parts

$28.835

1k+ parts

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1,399

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$28.835

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Component Stockers USA

USA . 13 parts In-Stock

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13

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Overview

Elevate your designs with the RHFACT244K1 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-quality bus driver & transceiver combines exceptional reliability and efficiency, perfect for robust applications in demanding environments. With its compact, ceramic-metal sealed package and wide temperature range, it ensures seamless performance while delivering significant cost and space savings. Transform your projects today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This robust packaging material enhances durability and heat resistance, making the product suitable for harsh environments.

Surface Mount: YES

The surface mount design allows for easy integration into modern PCBs, saving space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on circuit boards, making it easier to configure complex layouts.

No. of Bits: 8

An 8-bit configuration enables efficient data handling and processing for a range of applications, balancing performance and simplicity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this bus driver compatible with a wide range of digital circuits.

No. of Terminals: 20

With 20 terminals, this device provides ample connectivity options for versatile circuit designs.

Package Style (Meter): FLATPACK

The flatpack style contributes to a lower profile on the PCB, allowing for more compact assembly and improved thermal performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliability in demanding applications and environments.

Output Characteristics: 3-STATE

The 3-state output capability facilitates effective bus management, allowing multiple devices to share the same communication lines without interference.

Minimum Operating Temperature: -55 °C

This low minimum operating temperature qualifies the product for extreme cold applications, enhancing its versatility.

Terminal Position: DUAL

Dual-terminal positioning supports effective routing on the PCB, improving signal integrity and design flexibility.

No. of Ports: 2

Having two ports allows for easier connections in a multi-device setup, enhancing system expandability.

Maximum Seated Height: 2.21 mm

A low seated height makes it suitable for compact designs while maintaining low-profile requirements.

Width: 7.115 mm

A moderate width provides a balance between sufficient pin spacing and compact design, optimizing layout efficiency.

Minimum Supply Voltage (Vsup): 4.5 V

The minimal supply voltage requirement allows for compatibility with lower-voltage systems, promoting energy efficiency.

Length: 12.955 mm

The specified length offers a compact design while facilitating necessary connectivity between components.

Technology: CMOS

The advanced CMOS technology ensures low power consumption and high-speed operation, which is ideal for modern applications.

Terminal Form: FLAT

Flat terminals enhance soldering reliability and contribute to the overall stability of the component during operation.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27 mm is widely accepted, ensuring compatibility with many PCB designs and simplifying manufacturing.

Count Direction: UNIDIRECTIONAL

Unidirectional counting is useful in applications requiring controlled data flow, ensuring better signal management and performance.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage provides flexibility in power supply ranges, accommodating a variety of system requirements.

Technical Specifications

Bus Driver & Transceivers RHFACT244K1 attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Count Direction:

UNIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-CDFP-F20

Length:

12.955 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

2.21 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.115 mm

Trade Compliance

RHFACT244K1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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