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RHFAC16245K04V

STMicroelectronics

RHFAC16245K04V by STMicroelectronics

RHFAC16245K04V by STMicroelectronics is a dual 8-bit bus driver with a ceramic, metal-sealed package, ideal for military applications. It operates b/w -55 °C to 150 °C and supports supply voltages from 2V to 6V. This robust device ensures reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,146 parts In-Stock

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4,146

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Anansix

USA . 2,675 parts In-Stock

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2,675

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Vyrian

USA . 1,440 parts In-Stock

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1,440

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 293 parts In-Stock

1+ parts

$8.204

100+ parts

-

1k+ parts

$7.876

10k+ parts

$7.876

293

$8.204

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$7.876

$7.876

IDEA Electronic Components Group

UK . 2,162 parts In-Stock

1+ parts

$18.214

100+ parts

-

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$16.393

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2,162

$18.214

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$16.393

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MKK Technologies

India . 1,464 parts In-Stock

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$34.251

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1,464

$34.251

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DigiPath Technology Company

USA . 1,464 parts In-Stock

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$34.251

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1,464

$34.251

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Corphita

USA . 1,917 parts In-Stock

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1,917

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Parana Technologies

USA . 1,843 parts In-Stock

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$21.778

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1,843

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$21.778

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Overview

Unlock superior performance with the RHFAC16245K04V from STMicroelectronics, a robust solution designed for demanding applications. Crafted with military-grade reliability, this bus driver & transceiver excels in harsh environments, ensuring optimal functionality even in extreme temperatures. With its durable ceramic and metal-sealed packaging, you gain unmatched longevity and stability. Elevate your projects with confidence, knowing that quality and innovation are at your fingertips!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The robust ceramic and metal-sealed construction ensures durability and resistance to environmental stress, making it suitable for high-reliability applications.

Surface Mount: YES

Surface mount technology allows for efficient manufacturing processes and compact designs, which is essential for modern electronic applications.

No. of Functions: 2

Having multiple functions increases versatility, allowing the chip to serve various roles, thus reducing the need for additional components.

Screening Level: MIL-PRF-38535 Class V

This screening level indicates a high level of reliability and performance, making it suitable for mission-critical military and aerospace applications.

Package Shape: RECTANGULAR

The rectangular shape is optimal for efficient space utilization on PCBs, facilitating design integration.

No. of Bits: 8

An 8-bit architecture allows for sufficient data handling capabilities, balancing performance with power consumption.

Nominal Supply Voltage / Vsup: 3 V

Low nominal supply voltage contributes to energy efficiency, reducing operating costs and extending the lifespan of the device.

No. of Terminals: 48

A high number of terminals enhances connectivity options, improving integration with other system components.

Package Style (Meter): FLATPACK

Flatpack packages offer a low profile, which is advantageous for space-constrained applications.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures makes this component suitable for harsh environments, such as automotive or industrial applications.

Minimum Operating Temperature: -55 °C

With a wide temperature range, this part can function effectively in extreme conditions, ensuring reliability in diverse applications.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit design, allowing for easier layout adjustments.

No. of Ports: 2

Multiple ports allow simultaneous communication channels, enhancing data throughput and efficiency.

Maximum Seated Height: 2.72 mm

A low seated height supports compact design requirements, making it ideal for modern electronics that prioritize space.

Width: 9.65 mm

The modest width is conducive to high-density circuit designs, providing more layout options.

Output Polarity: INVERTED

Inverted output polarity can be useful in specific applications that require this configuration, providing further design flexibility.

Minimum Supply Voltage (Vsup): 2 V

The capability to operate at a low minimum supply voltage enhances energy efficiency and compatibility with battery-powered devices.

Length: 15.75 mm

The specific length dimension supports space-efficient layouts, particularly in compact embedded systems.

Temperature Grade: MILITARY

Designed for military specifications, ensuring sturdy performance in challenging environments, thus guaranteeing reliability for critical systems.

Total Dose (V): 300k Rad(Si)

A total radiation dose capability of 300k Rad(Si) signifies robustness against radiation, making it suitable for space and nuclear applications.

Technology: CMOS

Using CMOS technology allows for low power consumption and high-speed operation, crucial for modern digital applications.

Terminal Form: FLAT

Flat terminals ensure good electrical contact and are compatible with various PCB mounting techniques, contributing to reliable performance.

Packing Method: TR

The TR packing method promotes efficient handling and storage, enabling streamlined manufacturing processes.

Terminal Pitch: 0.635 mm

A 0.635 mm terminal pitch facilitates dense arrangements on PCBs, optimizing layout space for more components.

Maximum Supply Voltage (Vsup): 6 V

The capability to operate at a maximum supply voltage of 6 V enhances flexibility for various applications, accommodating a range of system requirements.

Technical Specifications

Bus Driver & Transceivers RHFAC16245K04V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Translation:

N/A

Width:

9.65 mm

Trade Compliance

RHFAC16245K04V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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