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RHFAC16244K04V

STMicroelectronics

RHFAC16244K04V by STMicroelectronics

RHFAC16244K04V by STMicroelectronics is a dual 8-bit bus driver with a ceramic, metal-sealed package. It operates b/w -55 °C to 150 °C and supports supply voltages from 2V to 6V. Ideal for military applications, it meets MIL-PRF-38535 Class V standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,662 parts In-Stock

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4,662

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Vyrian

USA . 2,570 parts In-Stock

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2,570

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Anansix

USA . 1,789 parts In-Stock

1+ parts

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1,789

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 43 parts In-Stock

1+ parts

$2.641

100+ parts

-

1k+ parts

$2.535

10k+ parts

$2.535

43

$2.641

-

$2.535

$2.535

IDEA Electronic Components Group

UK . 703 parts In-Stock

1+ parts

$14.412

100+ parts

-

1k+ parts

$12.971

10k+ parts

-

703

$14.412

-

$12.971

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MKK Technologies

India . 1,511 parts In-Stock

1+ parts

$27.100

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1,511

$27.100

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DigiPath Technology Company

USA . 1,511 parts In-Stock

1+ parts

$27.100

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1,511

$27.100

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Component Stockers USA

USA . 669 parts In-Stock

1+ parts

$99.990

100+ parts

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669

$99.990

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Corphita

USA . 3,762 parts In-Stock

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3,762

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Parana Technologies

USA . 804 parts In-Stock

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$17.232

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804

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$17.232

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Overview

Unlock unparalleled performance with the RHFAC16244K04V from STMicroelectronics, a leader in semiconductor innovation. This robust bus driver and transceiver is engineered for reliability, boasting a military-grade design that thrives in extreme conditions—from -55 °C to 150 °C. Perfect for aerospace, defense, and industrial applications, it ensures seamless data transfer while minimizing power consumption. Elevate your projects with ST's commitment to quality and excellence—experience the difference today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The robust ceramic and metal-sealed co-fired package ensures excellent durability and reliability in harsh environments, making this product ideal for military and aerospace applications.

Surface Mount: YES

The surface mount capability supports modern PCB designs, allowing for smaller and more efficient circuit assemblies.

No. of Functions: 2

With two functions integrated into one package, this device provides versatility and reduces the need for multiple components, saving space and cost.

Screening Level: MIL-PRF-38535 Class V

This screening level denotes high reliability and stringent testing, ensuring performance in critical applications, crucial for military standards.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout on circuit boards, optimizing space utilization and enhancing design flexibility.

No. of Bits: 8

An 8-bit architecture enables efficient data processing while maintaining simplicity and compatibility with a wide range of applications.

Nominal Supply Voltage / Vsup (V): 3

Designed to operate at a nominal supply voltage of 3V, this device is energy-efficient, benefiting battery-powered applications.

No. of Terminals: 14

With 14 terminals, this product provides sufficient connectivity options, making it adaptable to various circuit configurations.

Package Style (Meter): FLATPACK

The flatpack style minimizes height while maximizing surface area for mounting, thereby enhancing integration into compact designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C allows this device to function reliably in extreme heat conditions often found in military applications.

Minimum Operating Temperature: -55 °C

The ability to operate down to -55 °C ensures reliable functionality in cold environments, making it suitable for a variety of outdoor and extreme conditions.

Terminal Position: DUAL

The dual terminal position provides flexibility in design and installation, facilitating easier routing on PCBs.

No. of Ports: 2

With two ports, this device supports dual communication paths, enhancing data transfer capabilities and operational efficiency.

Maximum Seated Height: 2.72 mm

A low seated height of 2.72 mm allows for low-profile designs, which is critical in space-constrained applications.

Width: 6.345 mm

The narrow width of 6.345 mm contributes to space-saving designs, making it easier to fit into compact electronics.

Output Polarity: TRUE

True output polarity ensures compatibility with various electronic components, simplifying design integration.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage of 2V confirms the device's capacity to function effectively in low-power applications.

Length: 9.5 mm

The length of 9.5 mm strikes a good balance between performance and size, allowing for a compact footprint without sacrificing functionality.

Temperature Grade: MILITARY

The military temperature grade signifies compliance with rigorous military standards, ensuring reliability in demanding conditions.

Total Dose (V): 300k Rad(Si)

A total dose capacity of 300k Rad(Si) makes this product highly resistant to radiation, suited for use in space and defense applications.

Technology: CMOS

CMOS technology provides low power consumption and high speed, which enhances performance while conserving energy.

Terminal Form: FLAT

Flat terminal form enhances the mounting process and ensures better contact integrity and solderability.

Packing Method: TR

The TR packing method simplifies inventory management and facilitates better handling during assembly.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with standard PCB layouts, enhancing versatility in design.

Maximum Supply Voltage (Vsup): 6 V

The ability to operate up to 6V expands the range of applications this device can support, ensuring flexibility in design choices.

Technical Specifications

Bus Driver & Transceivers RHFAC16244K04V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-CDFP-F14

Length:

9.5 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL14,.25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Translation:

N/A

Width:

6.345 mm

Trade Compliance

RHFAC16244K04V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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