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RHFAC16245K03V

STMicroelectronics

RHFAC16245K03V by STMicroelectronics

RHFAC16245K03V by STMicroelectronics is a dual 8-bit bus driver with a ceramic, metal-sealed package. It operates b/w -55 °C to 150 °C and supports supply voltages from 2V to 6V. Ideal for military applications, it meets MIL-PRF-38535 Class V standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,946 parts In-Stock

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2,946

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Anansix

USA . 2,560 parts In-Stock

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2,560

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Vyrian

USA . 2,212 parts In-Stock

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2,212

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 451 parts In-Stock

1+ parts

$5.886

100+ parts

-

1k+ parts

$5.651

10k+ parts

$5.651

451

$5.886

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$5.651

$5.651

IDEA Electronic Components Group

UK . 1,324 parts In-Stock

1+ parts

$27.524

100+ parts

-

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$24.771

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1,324

$27.524

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$24.771

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MKK Technologies

India . 70 parts In-Stock

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$51.756

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70

$51.756

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DigiPath Technology Company

USA . 70 parts In-Stock

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$51.756

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70

$51.756

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Parana Technologies

USA . 1,095 parts In-Stock

1+ parts

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$32.909

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1,095

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$32.909

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Corphita

USA . 768 parts In-Stock

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768

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Overview

Elevate your projects with the RHFAC16245K03V from STMicroelectronics—a robust Bus Driver & Transceiver designed for demanding applications. Crafted with military-grade precision, this reliable component ensures top-tier performance in extreme temperatures, making it perfect for aerospace, defense, and industrial systems. With proven STMicroelectronics quality, experience enhanced durability, energy efficiency, and seamless integration that empowers your innovations like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable package ensures excellent reliability and protection, making the product suitable for demanding environments.

Surface Mount: YES

The surface mount capability allows for compact designs and facilitates automated assembly, reducing production costs.

No. of Functions: 2

Having dual functionality enhances versatility, allowing the device to perform multiple roles, which can simplify design requirements.

Screening Level: MIL-PRF-38535 Class V

This high screening level signifies stringent quality and performance standards, ensuring reliability in military applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout space on PCBs, making it easier to integrate with other components.

No. of Bits: 8

An 8-bit configuration is ideal for a variety of digital applications, providing a balance between performance and complexity.

Nominal Supply Voltage / Vsup (V): 3

A nominal operating voltage of 3V is energy-efficient, extending battery life in portable applications.

No. of Terminals: 48

With 48 terminals, this device supports a wide range of connections, enhancing modularity and flexibility in design.

Package Style (Meter): FLATPACK

The flatpack style minimizes space requirements, ideal for applications with limited real estate on the circuit board.

Maximum Operating Temperature: 150 °C

This high-temperature tolerance makes the product suitable for extreme environments, ensuring performance reliability.

Minimum Operating Temperature: -55 °C

The ability to operate at -55 °C ensures usability in cold conditions, vital for military and aerospace applications.

Terminal Position: DUAL

Dual terminal positioning allows for versatile circuit designs and facilitates better layout options on PCBs.

No. of Ports: 2

Having 2 ports enables simultaneous data processing or communication, enhancing performance in multi-channel applications.

Maximum Seated Height: 2.72 mm

A low seated height supports compact designs and is ideal for integration in tight assembly spaces.

Width: 9.65 mm

The narrow width allows for efficient use of board space, supporting high-density designs.

Output Polarity: INVERTED

The inverted output can be advantageous in certain designs, allowing for more flexible interfacing with other components.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum of 2V ensures compatibility with low-power applications, enhancing energy efficiency.

Length: 15.75 mm

Optimized length aids in space-efficient design, making it easier to fit into compact electronic assemblies.

Temperature Grade: MILITARY

The military-grade designation guarantees high performance under extremes and rigorous testing, making it a trusted choice for critical applications.

Total Dose (V): 300k Rad(Si)

This high radiation tolerance is crucial for space and military applications, ensuring device reliability in radiation-rich environments.

Technology: CMOS

CMOS technology provides low power consumption and high efficiency, making this product suitable for modern electronic applications.

Terminal Form: FLAT

Flat terminal form aids in better surface contact and reduces inductance, contributing to enhanced signal integrity.

Packing Method: TR

The TR packing method is suitable for automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm is optimal for high-density PCB layouts, allowing for compact connectivity without sacrificing reliability.

Maximum Supply Voltage (Vsup): 6 V

The capacity to operate up to 6V offers flexibility for various power supply configurations, catering to a broader range of applications.

Technical Specifications

Bus Driver & Transceivers RHFAC16245K03V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Translation:

N/A

Width:

9.65 mm

Trade Compliance

RHFAC16245K03V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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