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RHFAC16374K01V

STMicroelectronics

RHFAC16374K01V by STMicroelectronics

STMicroelectronics' RHFAC16374K01V is a 16-bit bus driver with 48 terminals, operating b/w -55 °C to 150°C. It features a flatpack style package, CMOS technology, and dual terminal position. Ideal for military-grade applications requiring unidirectional count direction and 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,867 parts In-Stock

1+ parts

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2,867

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Anansix

USA . 2,346 parts In-Stock

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2,346

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Digiode

USA . 89 parts In-Stock

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89

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,748 parts In-Stock

1+ parts

$29.868

100+ parts

-

1k+ parts

$26.881

10k+ parts

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1,748

$29.868

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$26.881

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MKK Technologies

India . 181 parts In-Stock

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$56.164

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181

$56.164

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DigiPath Technology Company

USA . 181 parts In-Stock

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$56.164

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181

$56.164

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Parana Technologies

USA . 1,840 parts In-Stock

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$35.712

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1,840

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$35.712

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Corphita

USA . 404 parts In-Stock

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404

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Overview

Upgrade your electronics with the RHFAC16374K01V from STMicroelectronics, a top-tier manufacturer known for quality and reliability. This bus driver & transceiver is the perfect solution for a wide range of applications, offering seamless communication and efficient data transfer. With its advanced technology and military-grade temperature grade, this product guarantees superior performance in any environment. Trust STMicroelectronics to deliver unparalleled value and benefits with every purchase.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material provides durability and reliability, making this bus driver and transceiver suitable for harsh environments.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving design in electronic circuits.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard PCB layouts and simplifies the integration of this component into various systems.

No. of Bits: 16

With 16 bits, this bus driver and transceiver can handle multiple data channels effectively, making it suitable for complex communication systems.

No. of Terminals: 48

The high number of terminals allows for versatile connectivity options, enabling this component to interface with a wide range of devices.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact form factor, making it ideal for applications where space is limited.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures reliable performance even in elevated temperature environments.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for greater flexibility in controlling the bus lines, enabling efficient data transmission.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures reliable operation in cold conditions, making this component suitable for a wide range of environments.

No. of Ports: 2

Having 2 ports allows for versatile connectivity options and the ability to transmit data to multiple devices simultaneously.

Maximum Seated Height: 2.72 mm

The low maximum seated height of 2.72 mm allows for a compact design, making it suitable for applications with space constraints.

Width: 9.65 mm

The moderate width of 9.65 mm allows for easy integration into standard PCB layouts without occupying excessive space.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage of 2 V ensures energy efficiency and compatibility with a wide range of power sources.

Length: 15.75 mm

The moderate length of 15.75 mm strikes a balance between compactness and functionality, making this component versatile in various electronic systems.

Temperature Grade: MILITARY

The MILITARY temperature grade ensures that this bus driver and transceiver meets stringent quality standards, making it suitable for mission-critical applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance and reliability of this component.

Terminal Form: FLAT

The flat terminal form simplifies assembly and ensures secure connections, making installation of this component hassle-free.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635 mm allows for high-density mounting and facilitates efficient PCB layout design.

Count Direction: UNIDIRECTIONAL

The unidirectional count direction simplifies data transmission and reception, ensuring reliable communication between connected devices.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage of 6 V provides flexibility in power source selection and ensures compatibility with various electronic systems.

Technical Specifications

Bus Driver & Transceivers RHFAC16374K01V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Logic IC Type:

No. of Bits:

16

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

9.65 mm

Trade Compliance

RHFAC16374K01V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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