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RHFAC16373K1

STMicroelectronics

RHFAC16373K1 by STMicroelectronics

RHFAC16373K1 by STMicroelectronics is a 16-bit bus driver with dual ports, designed for military applications. It operates b/w -55 °C and 150 °C, supporting a supply voltage of 2-6V. Its ceramic, metal-sealed flatpack package ensures durability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,794 parts In-Stock

1+ parts

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1,794

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Digiode

USA . 1,785 parts In-Stock

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1,785

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Anansix

USA . 179 parts In-Stock

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179

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,415 parts In-Stock

1+ parts

$22.569

100+ parts

-

1k+ parts

$20.312

10k+ parts

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1,415

$22.569

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$20.312

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MKK Technologies

India . 1,761 parts In-Stock

1+ parts

$42.439

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1,761

$42.439

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DigiPath Technology Company

USA . 1,761 parts In-Stock

1+ parts

$42.439

100+ parts

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1,761

$42.439

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Corphita

USA . 4,716 parts In-Stock

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4,716

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Parana Technologies

USA . 1,294 parts In-Stock

1+ parts

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100+ parts

$26.984

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1,294

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$26.984

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Overview

Unlock unmatched performance with the RHFAC16373K1 by STMicroelectronics, a pinnacle of reliability in bus drivers and transceivers. Crafted with precision in a robust ceramic, metal-sealed package, this 16-bit device excels in demanding environments, operating flawlessly between -55 °C and 150 °C. Trusted by industries worldwide, it ensures efficient data transfer while enhancing system longevity. Choose quality and innovation—experience the advantages that only STMicroelectronics can deliver.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired material enhances reliability, making this product suitable for challenging environments.

Surface Mount: YES

Surface mount capability allows for efficient use of board space and simplifies automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and design flexibility in electronic applications.

No. of Bits: 16

With 16 bits, this device can handle a wide range of data transmission needs, improving performance in various applications.

No. of Terminals: 48

The 48 terminals provide ample connection options, enhancing the versatility and functionality of the device.

Package Style (Meter): FLATPACK

Flatpack design minimizes height and facilitates easier integration into compact electronic systems.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliability in high-heat environments, suitable for military and industrial applications.

Output Characteristics: 3-STATE

3-state output characteristics allow for improved data management and reduced loading on the bus, enhancing signal integrity.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C ensures functionality in extreme cold, making it ideal for harsh conditions.

Terminal Position: DUAL

Dual terminal positioning provides flexible mounting options for efficient circuit design.

No. of Ports: 2

Having 2 ports allows for agile data handling between devices, improving connectivity options and system efficiency.

Maximum Seated Height: 2.72 mm

The low seated height fits well in compact spaces, making this product suitable for miniaturized designs.

Width: 9.65 mm

A width of 9.65 mm provides a compact form-factor, allowing easy integration into space-constrained applications.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage enables operation in battery-powered systems and promotes energy efficiency.

Length: 15.75 mm

The length is optimized for fitting into various PCBs, enhancing modularity in electronic designs.

Temperature Grade: MILITARY

MIL-STD grade ensures reliability and durability in mission-critical applications, making it suitable for military use.

Technology: CMOS

CMOS technology offers low power consumption and high performance, making it a smart choice for modern electronics.

Terminal Form: FLAT

Flat terminal forms simplify soldering processes and enhance electrical connection reliability.

Terminal Pitch: 0.635 mm

A fine terminal pitch facilitates dense layouts, making this product suitable for high-density applications.

Count Direction: UNIDIRECTIONAL

Unidirectional count direction simplifies data flow design, improving circuit clarity and performance.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6 V allows for enhanced performance in varied operational ranges, supporting robust applications.

Technical Specifications

Bus Driver & Transceivers RHFAC16373K1 attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Logic IC Type:

No. of Bits:

16

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

9.65 mm

Trade Compliance

RHFAC16373K1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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