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RHFAC16244K02Q

STMicroelectronics

RHFAC16244K02Q by STMicroelectronics

RHFAC16244K02Q by STMicroelectronics is a 4-function bus driver with a propagation delay of just 11.5 ns, ideal for high-speed applications. It operates at a nominal voltage of 3.3V and supports military-grade screening (MIL-PRF-38535 Class V). With a max temp of 125 °C, it's perfect for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,726 parts In-Stock

1+ parts

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4,726

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Digiode

USA . 3,122 parts In-Stock

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3,122

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Anansix

USA . 2,712 parts In-Stock

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2,712

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 22 parts In-Stock

1+ parts

$3.229

100+ parts

-

1k+ parts

$3.100

10k+ parts

$3.100

22

$3.229

-

$3.100

$3.100

IDEA Electronic Components Group

UK . 1,545 parts In-Stock

1+ parts

$25.835

100+ parts

-

1k+ parts

$23.251

10k+ parts

-

1,545

$25.835

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$23.251

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MKK Technologies

India . 1,265 parts In-Stock

1+ parts

$48.580

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1,265

$48.580

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DigiPath Technology Company

USA . 1,265 parts In-Stock

1+ parts

$48.580

100+ parts

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1,265

$48.580

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Corphita

USA . 3,021 parts In-Stock

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3,021

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Parana Technologies

USA . 1,258 parts In-Stock

1+ parts

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$30.889

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1,258

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$30.889

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Overview

Experience unparalleled reliability and performance with the RHFAC16244K02Q from STMicroelectronics, a leader in high-quality semiconductor solutions. This robust bus driver and transceiver excels in demanding environments, making it ideal for military and aerospace applications. With rapid propagation delay and exceptional thermal resilience, it ensures seamless communication and efficient power management. Elevate your projects with a trusted component engineered for excellence!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed cofired package provides durability and protection against environmental factors, enhancing reliability in harsh conditions.

Propagation Delay At Nominal Supply: 11.5 ns

A low propagation delay ensures fast switching times, making this device suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for efficient and compact board designs, facilitating easier assembly and reducing footprint.

No. of Functions: 4

With four functions integrated into one device, this product provides flexibility and saves space on the PCB.

Screening Level: MIL-PRF-38535 Class V

Class V screening guarantees high reliability and performance under military specifications, ideal for defense and aerospace applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized footprint, ensuring compatibility with a wide range of circuit layouts.

No. of Bits: 4

Supporting four bits enables efficient data handling and communication, making it a suitable choice for various digital applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V is perfect for modern low-power devices, ensuring energy efficiency.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for effective signal transmission, reducing signal degradation over longer distances.

Power Supplies (V): 3.3/5

The flexibility of supporting both 3.3V and 5V supplies makes this product versatile for various electronic designs.

No. of Terminals: 48

With 48 terminals, this device offers ample connectivity options for complex applications.

Package Style (Meter): FLATPACK

The flatpack style reduces height and makes the device suitable for applications where vertical space is limited.

Maximum I (ol): 24 Amp

A high output current of 24 Amps makes this product ideal for driving heavy loads in demanding environments.

Propagation Delay (tpd): 11.5 ns

Consistent propagation delay reflects reliability in timing, making this device a good choice for synchronous applications.

Maximum Operating Temperature: 125 °C

The maximum operating temperature of 125 °C ensures functionality in high-thermal environments, enhancing application versatility.

Output Characteristics: 3-STATE

The 3-state output capability allows for bus communication and multiple device connections without interference.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C suits extreme environments and applications requiring reliable performance in cold conditions.

Terminal Position: DUAL

Dual terminal positions facilitate easy PCB layout and can enhance routing efficiency.

No. of Ports: 2

Having two ports supports various interface applications, enhancing the versatility of the product.

Maximum Seated Height: 2.72 mm

A low maximum seated height enables integration into compact designs, making it suitable for space-constrained applications.

Width: 9.65 mm

A modest width supports dense layout designs while maintaining robust connectivity.

Output Polarity: TRUE

True output polarity simplifies design for engineers looking for straightforward integration into signal paths.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage enhances compatibility with a wide range of power sources, improving operational versatility.

Length: 15.75 mm

Compact length contributes to reduced overall device size, making it suitable for applications with limited space.

Temperature Grade: MILITARY

Military temperature grade ensures reliability in critical applications, offering peace of mind in extreme operational environments.

Total Dose (V): 300k Rad(Si)

A total dose rating of 300k Rad(Si) signifies excellent radiation hardness, making it suitable for space and nuclear applications.

Technology: CMOS

Utilizing CMOS technology, this device offers low power consumption and high noise immunity, ideal for battery-powered equipment.

Terminal Form: FLAT

Flat terminals aid in soldering and enhance thermal dissipation, promoting reliability in high-performance applications.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm helps ensure proper spacing for easy soldering and integration with various PCB designs.

Control Type: ENABLE LOW

The enable-low control type allows for straightforward activation and deactivation, simplifying control logic.

Maximum Supply Voltage (Vsup): 6 V

Supporting a maximum supply voltage of 6V adds flexibility in various circuit designs while accommodating different operational needs.

Technical Specifications

Bus Driver & Transceivers RHFAC16244K02Q attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

9.65 mm

Trade Compliance

RHFAC16244K02Q Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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