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RHFAC16245K1

STMicroelectronics

RHFAC16245K1 by STMicroelectronics

RHFAC16245K1 by STMicroelectronics is a dual 8-bit bus driver with a ceramic, metal-sealed package. It operates b/w -55 °C to 150 °C and supports supply voltages from 2V to 6V, making it ideal for military applications requiring high reliability.

Median Price

$1,509.230

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 12 parts In-Stock

1+ parts

$306.460

100+ parts

$261.960

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-

10k+ parts

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12

$306.460

$261.960

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-

Chip1Stop

Japan . 12 parts In-Stock

1+ parts

$2,712.000

100+ parts

-

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-

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-

12

$2,712.000

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rapid Electronics

USA . 12 parts In-Stock

1+ parts

$270.290

100+ parts

-

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-

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-

12

$270.290

-

-

-

Digiode

USA . 3,553 parts In-Stock

1+ parts

$291.137

100+ parts

-

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3,553

$291.137

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Vyrian

USA . 2,831 parts In-Stock

1+ parts

-

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-

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2,831

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Anansix

USA . 2,292 parts In-Stock

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2,292

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$4.168

100+ parts

-

1k+ parts

$4.002

10k+ parts

$4.002

50

$4.168

-

$4.002

$4.002

IDEA Electronic Components Group

UK . 140 parts In-Stock

1+ parts

$16.512

100+ parts

-

1k+ parts

$14.861

10k+ parts

-

140

$16.512

-

$14.861

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MKK Technologies

India . 802 parts In-Stock

1+ parts

$31.050

100+ parts

-

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802

$31.050

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DigiPath Technology Company

USA . 802 parts In-Stock

1+ parts

$31.050

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802

$31.050

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Corphita

USA . 2,097 parts In-Stock

1+ parts

$275.814

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2,097

$275.814

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Component Stockers USA

USA . 16 parts In-Stock

1+ parts

$294.460

100+ parts

-

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16

$294.460

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-

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Parana Technologies

USA . 829 parts In-Stock

1+ parts

-

100+ parts

$19.743

1k+ parts

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10k+ parts

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829

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$19.743

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Overview

Unlock unparalleled performance and reliability with the RHFAC16245K1 from STMicroelectronics, a leader in semiconductor innovation. Designed for demanding military applications, this dual-function bus driver and transceiver excels in extreme temperatures and harsh environments. Its robust ceramic and metal-sealed packaging ensure longevity and resilience, providing peace of mind for critical systems. Elevate your projects with this high-quality solution that combines efficiency and durability—perfect for mission-critical designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed package ensures reliability and longevity, particularly in demanding environments.

Surface Mount: YES

Surface mount technology enables compact design and easy integration into modern electronic assemblies.

No. of Functions: 2

Having two functions allows for enhanced versatility, making it suitable for various applications.

Screening Level: MIL-PRF-38535 Class V

Class V screening guarantees high quality and performance, meeting stringent military specifications.

Package Shape: RECTANGULAR

Rectangular packaging optimizes space utilization on PCBs, allowing for efficient circuit design.

No. of Bits: 8

With 8 bits, this product can handle sufficient data for a wide range of applications, maintaining good performance.

Nominal Supply Voltage / Vsup (V): 3

The 3V nominal supply voltage ensures compatibility with modern low-power devices, enhancing energy efficiency.

No. of Terminals: 48

A larger number of terminals provides more connectivity options, making it adaptable for complex systems.

Package Style (Meter): FLATPACK

Flatpack style enhances the ease of surface mounting, facilitating compact and efficient designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature indicates robustness, enabling use in harsh environments.

Minimum Operating Temperature: -55 °C

The ability to function at -55 °C makes this product ideal for extreme temperature applications, particularly in military and aerospace.

Terminal Position: DUAL

Dual terminal positioning provides flexible routing options on PCBs, simplifying circuit layout.

No. of Ports: 2

The inclusion of two ports allows for multiple connections, increasing the product's versatility.

Maximum Seated Height: 2.72 mm

A low seated height contributes to a compact overall profile, crucial for space-constrained applications.

Width: 9.65 mm

A narrow width supports high-density designs, facilitating more components per PCB area.

Output Polarity: INVERTED

Inverted output polarity can be advantageous in certain applications, helping to match specific circuit requirements.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage allows for compatibility with a broader range of power sources, making it flexible for various designs.

Length: 15.75 mm

A manageable length aids in fitting within standard layouts, promoting ease of integration.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliability in extreme conditions, ideal for defense applications.

Total Dose (V): 300k Rad(Si)

A high total dose rating of 300k Rad(Si) indicates resilience to radiation exposure, making it suitable for space and defense applications.

Technology: CMOS

CMOS technology provides low power consumption while maintaining high speed, enhancing overall performance.

Terminal Form: FLAT

Flat terminals simplify the mounting process, ensuring reliable connections and minimizing assembly issues.

Packing Method: TR

Tape and reel packing method enables efficient automated assembly, reducing production time and costs.

Terminal Pitch: 0.635 mm

A tight terminal pitch is beneficial for high-density designs, allowing for compact arrangements of multiple components.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6V offers flexibility in designs, allowing users to explore various power supply options.

Technical Specifications

Bus Driver & Transceivers RHFAC16245K1 attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Translation:

N/A

Width:

9.65 mm

Trade Compliance

RHFAC16245K1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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