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RHFAC16244K2

STMicroelectronics

RHFAC16244K2 by STMicroelectronics

RHFAC16244K2 by STMicroelectronics is a 4-function CMOS bus driver with a 3.3V nominal voltage and operates in extreme temperatures from -55 °C to 125 °C. It features a fast propagation delay of 11.5 ns and supports dual ports with true output polarity. Ideal for military applications, it ensures reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,891 parts In-Stock

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4,891

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Vyrian

USA . 3,826 parts In-Stock

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3,826

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Anansix

USA . 725 parts In-Stock

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725

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,000 parts In-Stock

1+ parts

$4.926

100+ parts

-

1k+ parts

$4.729

10k+ parts

$4.729

1,000

$4.926

-

$4.729

$4.729

IDEA Electronic Components Group

UK . 1,433 parts In-Stock

1+ parts

$16.807

100+ parts

-

1k+ parts

$15.127

10k+ parts

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1,433

$16.807

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$15.127

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MKK Technologies

India . 1,682 parts In-Stock

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$31.605

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1,682

$31.605

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DigiPath Technology Company

USA . 1,682 parts In-Stock

1+ parts

$31.605

100+ parts

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1,682

$31.605

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Corphita

USA . 2,307 parts In-Stock

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2,307

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Parana Technologies

USA . 655 parts In-Stock

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$20.096

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655

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$20.096

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Overview

Unlock unparalleled performance with the RHFAC16244K2 from STMicroelectronics, a leader in innovative semiconductor solutions. This robust bus driver and transceiver promises exceptional reliability across diverse applications, from aerospace to industrial automation. With a compact design and military-grade temperature resilience, it ensures seamless data transmission even under extreme conditions. Elevate your projects with ST's unmatched quality and commitment to excellence—experience efficiency like never before!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The robust ceramic and metal-sealed construction enhances durability and reliability in harsh environments.

Surface Mount: YES

Surface mount capabilities allow for easy integration into modern electronic designs, optimizing board space.

No. of Functions: 4

With four functions, this device can efficiently handle multiple tasks, increasing versatility in applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates space-efficient designs, making it suitable for compact electronic devices.

No. of Bits: 4

The 4-bit design supports efficient data handling, ideal for applications requiring parallel data processing.

Nominal Supply Voltage / Vsup: 3.3V

Works optimally with 3.3V supply, which is standard for many digital circuits, ensuring compatibility and ease of use.

No. of Terminals: 48

A high terminal count provides extensive connectivity options, making it suitable for complex circuit requirements.

Package Style (Meter): FLATPACK

Flatpack style allows for effective heat dissipation, promoting reliability under varying operational conditions.

Propagation Delay (tpd): 11.5 ns

The low propagation delay enhances performance in high-speed applications, delivering quick data transfer rates.

Maximum Operating Temperature: 125 °C

Rated for high-temperature environments, making it perfect for military-grade and high-stress applications.

Output Characteristics: 3-STATE

3-state output allows for better bus management in multi-device systems, enhancing system flexibility.

Minimum Operating Temperature: -55 °C

Can operate in extremely low temperatures, suitable for applications in harsh and cold conditions.

Terminal Position: DUAL

Dual terminal position enables easier routing and layout design in circuit board assemblies.

No. of Ports: 2

Two ports allow for dual data channels, increasing efficiency in data communication systems.

Maximum Seated Height: 2.72 mm

Low profile design enables better fit in space-constrained applications without compromising performance.

Width: 9.65 mm

The compact width makes it suitable for space-limited designs, enhancing versatility in electronic projects.

Output Polarity: TRUE

True output polarity ensures compatibility with a variety of logic levels in digital systems.

Minimum Supply Voltage (Vsup): 2V

Versatile voltage requirement allows operation with lower power supply levels, ensuring energy efficiency.

Length: 15.75 mm

The manageable length contributes to a compact footprint, suitable for modern electronic applications.

Temperature Grade: MILITARY

Built to military specifications, ensuring reliability and performance in demanding applications.

Total Dose (V): 300k Rad(Si)

High total dose rating provides confidence in radiation-prone environments, ensuring long-term reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for portable devices.

Terminal Form: FLAT

Flat terminal design aids in soldering and assembly, promoting ease of manufacturing and reliability.

Terminal Pitch: 0.635 mm

Narrow terminal pitch allows for densely packed connections, ideal for compact circuit board designs.

Maximum Supply Voltage (Vsup): 6V

High maximum voltage tolerance allows for flexibility in integration within various electronic systems.

Technical Specifications

Bus Driver & Transceivers RHFAC16244K2 attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

9.65 mm

Trade Compliance

RHFAC16244K2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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