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RHFAC16373K03V

STMicroelectronics

RHFAC16373K03V by STMicroelectronics

RHFAC16373K03V by STMicroelectronics is a 16-bit bus driver with a ceramic, metal-sealed package, ideal for military applications. It operates b/w -55 °C and 150 °C, supporting supply voltages from 2V to 6V. This dual-port device features unidirectional output in a compact flatpack design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,648 parts In-Stock

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2,648

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Vyrian

USA . 1,417 parts In-Stock

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1,417

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Anansix

USA . 192 parts In-Stock

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192

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,847 parts In-Stock

1+ parts

$25.558

100+ parts

-

1k+ parts

$23.002

10k+ parts

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1,847

$25.558

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$23.002

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MKK Technologies

India . 76 parts In-Stock

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$48.059

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76

$48.059

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DigiPath Technology Company

USA . 76 parts In-Stock

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$48.059

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76

$48.059

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Parana Technologies

USA . 2,311 parts In-Stock

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$30.558

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2,311

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$30.558

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Corphita

USA . 1,376 parts In-Stock

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1,376

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Overview

Unlock unparalleled performance with the RHFAC16373K03V from STMicroelectronics, a leader in high-quality semiconductor solutions. This robust 16-bit bus driver and transceiver excels in demanding environments, ensuring reliable operation across military applications. Its superior ceramic and metal-sealed design enhances durability, while its wide temperature tolerance (-55 °C to 150 °C) ensures resilience. Elevate your projects with a product that embodies innovation and reliability, offering unmatched value for your systems.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed co-fired material provides enhanced durability and protection against environmental factors, making this product suitable for demanding applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and improved assembly processes, making this device ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into various circuit layouts, promoting design flexibility.

No. of Bits: 16

With 16 bits, this bus driver offers sufficient data transmission capability for handling complex digital signals and systems.

No. of Terminals: 48

The 48 terminals provide multiple connection options, enabling comprehensive interfacing with other components in a circuit.

Package Style (Meter): FLATPACK

The flatpack style enhances space efficiency and contributes to lower profiles in modern electronic designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures that this device can function reliably in harsh thermal environments.

Output Characteristics: 3-STATE

3-state output characteristics allow for multiple devices to share a common bus, enhancing system design versatility.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, the device is suitable for use in extreme cold environments, ensuring reliability in various conditions.

Terminal Position: DUAL

Dual terminal positions provide flexible mounting options, making integration easier in a variety of applications.

No. of Ports: 2

Having 2 ports enables this device to communicate efficiently with multiple data lines, enhancing overall performance.

Maximum Seated Height: 2.72 mm

A low seated height of 2.72 mm contributes to a compact design, making it suitable for modern, space-constrained applications.

Width: 9.65 mm

Compact width ensures that this device can fit into tight PCB layouts, promoting design efficiency.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage of 2 V allows for operation with lower power systems, leading to energy-efficient designs.

Length: 15.75 mm

The length of 15.75 mm is optimal for various applications, providing a balance between performance and footprint.

Temperature Grade: MILITARY

Designed for military-grade applications, this device meets stringent reliability and performance standards required in critical systems.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed, perfect for advanced digital circuits.

Terminal Form: FLAT

Flat terminal form helps in acquiring a good solder joint and ensures stable connections, enhancing overall reliability.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for better density on the PCB, helping to maximize the integration of components.

Count Direction: UNIDIRECTIONAL

Unidirectional counting is ideal for many applications where single-direction data transfer is required, simplifying design implementation.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6 V provides the flexibility to operate in higher voltage applications, enhancing versatility.

Technical Specifications

Bus Driver & Transceivers RHFAC16373K03V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Logic IC Type:

No. of Bits:

16

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

9.65 mm

Trade Compliance

RHFAC16373K03V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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