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RHFAC16245K01V

STMicroelectronics

RHFAC16245K01V by STMicroelectronics

STMicroelectronics RHFAC16245K01V is a MIL-PRF-38535 Class V bus driver with 8-bit functionality. It operates at -55 to 150 °C, suitable for military applications. With a supply voltage range of 2-6V, it features dual terminals in a flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,351

-

-

-

-

Anansix

USA . 1,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,940

-

-

-

-

Vyrian

USA . 1,014 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,014

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 119 parts In-Stock

1+ parts

$7.484

100+ parts

-

1k+ parts

$7.185

10k+ parts

$7.185

119

$7.484

-

$7.185

$7.185

Ampacity Inc.

Singapore . 1,220 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,220

$8.000

-

-

-

IDEA Electronic Components Group

UK . 1,381 parts In-Stock

1+ parts

$14.503

100+ parts

-

1k+ parts

$13.053

10k+ parts

-

1,381

$14.503

-

$13.053

-

MKK Technologies

India . 468 parts In-Stock

1+ parts

$27.272

100+ parts

-

1k+ parts

-

10k+ parts

-

468

$27.272

-

-

-

DigiPath Technology Company

USA . 468 parts In-Stock

1+ parts

$27.272

100+ parts

-

1k+ parts

-

10k+ parts

-

468

$27.272

-

-

-

Corphita

USA . 4,297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,297

-

-

-

-

Parana Technologies

USA . 1,951 parts In-Stock

1+ parts

-

100+ parts

$17.340

1k+ parts

-

10k+ parts

-

1,951

-

$17.340

-

-

Overview

Elevate your electronic designs with the RHFAC16245K01V by STMicroelectronics. This top-quality Bus Driver & Transceiver offers unmatched reliability and performance, thanks to its advanced technology and MILITARY-grade screening. With a compact rectangular flatpack shape and dual terminal position, this component is perfect for a wide range of applications. From industrial automation to aerospace systems, this product delivers value, efficiency, and precision. Trust STMicroelectronics to provide innovative solutions that meet and exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package material ensures durability and reliability for the bus driver & transceivers, making it suitable for use in harsh environments.

Surface Mount: YES

Being surface mountable makes the installation of this product quick and easy, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in a single component provides increased functionality and efficiency in the system where this product is used.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V ensures compatibility with a wide range of systems and devices, making it versatile in its applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this product can perform reliably in demanding conditions without overheating.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C allows this product to function effectively even in extremely cold environments.

Technical Specifications

Bus Driver & Transceivers RHFAC16245K01V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Translation:

N/A

Width:

9.65 mm

Trade Compliance

RHFAC16245K01V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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