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RHFAC16244K1

STMicroelectronics

RHFAC16244K1 by STMicroelectronics

RHFAC16244K1 by STMicroelectronics is a 4-bit bus driver with a 3.3V nominal voltage and operates in extreme temperatures from -55 °C to 125 °C. It features a fast propagation delay of 11.5 ns and supports dual ports with true output polarity. Ideal for military applications, it ensures reliable performance in harsh environments.

Median Price

$228.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$228.000

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-

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5

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$228.000

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Distributors (In-Stock)

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Digiode

USA . 1,660 parts In-Stock

1+ parts

$150.537

100+ parts

-

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-

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1,660

$150.537

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-

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Vyrian

USA . 2,760 parts In-Stock

1+ parts

-

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2,760

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Anansix

USA . 2,125 parts In-Stock

1+ parts

-

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2,125

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Semi Source

USA . 12 parts In-Stock

1+ parts

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 44 parts In-Stock

1+ parts

$6.411

100+ parts

-

1k+ parts

$6.155

10k+ parts

$6.155

44

$6.411

-

$6.155

$6.155

IDEA Electronic Components Group

UK . 2,217 parts In-Stock

1+ parts

$21.775

100+ parts

-

1k+ parts

$19.597

10k+ parts

-

2,217

$21.775

-

$19.597

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MKK Technologies

India . 1,071 parts In-Stock

1+ parts

$40.946

100+ parts

-

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1,071

$40.946

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DigiPath Technology Company

USA . 1,071 parts In-Stock

1+ parts

$40.946

100+ parts

-

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-

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1,071

$40.946

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Corphita

USA . 4,934 parts In-Stock

1+ parts

$142.614

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4,934

$142.614

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Parana Technologies

USA . 1,965 parts In-Stock

1+ parts

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100+ parts

$26.035

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1,965

-

$26.035

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Overview

Elevate your design with the RHFAC16244K1 from STMicroelectronics, a trusted leader in innovative solutions. This robust bus driver and transceiver is built to withstand extreme conditions, ensuring reliability for critical applications. With its compact, ceramic-sealed package and superior performance across temperatures, it enhances communication in military and industrial environments. Experience unmatched quality, efficiency, and peace of mind with STMicroelectronics—where excellence meets innovation!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This construction ensures robust protection against environmental factors, making it an ideal choice for demanding applications.

Surface Mount: YES

The surface mount capability allows for compact design and easy integration into modern circuit boards.

No. of Functions: 4

With multiple functions in a single package, it simplifies design and optimizes space utilization.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout and routing on PCB, enhancing overall design flexibility.

No. of Bits: 4

Supporting 4 bits allows for efficient data handling in diverse applications, enhancing performance.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a common voltage level ensures compatibility with many digital systems and reduces power consumption.

No. of Terminals: 48

A higher terminal count facilitates more connections and features, making it suitable for complex systems.

Package Style (Meter): FLATPACK

The flatpack style reduces profile height, making it ideal for space-constrained applications.

Propagation Delay (tpd): 11.5 ns

Low propagation delay ensures fast signal transmission, ideal for high-speed applications.

Maximum Operating Temperature: 125 °C

The high temperature rating allows operation in extreme environments, enhancing reliability.

Output Characteristics: 3-STATE

3-state outputs enable better signal management and resource optimization in digital circuits.

Minimum Operating Temperature: -55 °C

The wide temperature range suits military and industrial applications where environmental conditions can be harsh.

Terminal Position: DUAL

Dual terminal positioning can enhance soldering effectiveness and overall connectivity on PCBs.

No. of Ports: 2

Having two ports allows for more flexible data handling and communication in various systems.

Maximum Seated Height: 2.72 mm

The low seated height supports designs requiring minimal space, contributing to compact product designs.

Width: 9.65 mm

The width dimension offers a balance between space efficiency and connection accessibility.

Output Polarity: TRUE

The true output polarity supports standard digital logic, ensuring compatibility across devices.

Minimum Supply Voltage (Vsup): 2 V

A lower minimum supply voltage allows for flexibility in power supply options, accommodating various systems.

Length: 15.75 mm

The length is optimized for fitting into various devices without compromising performance.

Temperature Grade: MILITARY

Designed to meet military standards, ensuring reliability in critical applications.

Total Dose (V): 300k Rad(Si)

High radiation tolerance makes this product suitable for aerospace and high-radiation environments.

Technology: CMOS

CMOS technology offers low power consumption while providing high performance, ideal for battery-operated devices.

Terminal Form: FLAT

Flat terminals provide a stable connection, enhancing soldering and assembly processes.

Packing Method: TR

The TR packing method is convenient for automated assembly processes, streamlining production.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm accommodates compact designs while still allowing for reliable connections.

Maximum Supply Voltage (Vsup): 6 V

The higher maximum supply voltage allows for increased performance and versatility in demanding applications.

Technical Specifications

Bus Driver & Transceivers RHFAC16244K1 attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

9.65 mm

Trade Compliance

RHFAC16244K1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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