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RHFAC16244K01V

STMicroelectronics

RHFAC16244K01V by STMicroelectronics

RHFAC16244K01V by STMicroelectronics is a 4-bit bus driver with a propagation delay of just 11.5 ns, ideal for high-speed applications. It operates at a nominal voltage of 3.3V and supports military-grade screening (MIL-PRF-38535 Class V). This robust device features dual terminals and can handle temperatures from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,072 parts In-Stock

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4,072

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Anansix

USA . 2,759 parts In-Stock

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2,759

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Digiode

USA . 2,358 parts In-Stock

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2,358

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 134 parts In-Stock

1+ parts

$6.031

100+ parts

-

1k+ parts

$5.790

10k+ parts

$5.790

134

$6.031

-

$5.790

$5.790

IDEA Electronic Components Group

UK . 1,108 parts In-Stock

1+ parts

$10.275

100+ parts

-

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$9.248

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1,108

$10.275

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$9.248

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MKK Technologies

India . 2,157 parts In-Stock

1+ parts

$19.322

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2,157

$19.322

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DigiPath Technology Company

USA . 2,157 parts In-Stock

1+ parts

$19.322

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2,157

$19.322

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Ampacity Inc.

Singapore . 1,124 parts In-Stock

1+ parts

$62.000

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1,124

$62.000

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Component Stockers USA

USA . 783 parts In-Stock

1+ parts

$99.990

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783

$99.990

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Parana Technologies

USA . 1,704 parts In-Stock

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$12.286

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1,704

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$12.286

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Corphita

USA . 129 parts In-Stock

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129

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Overview

Elevate your designs with the RHFAC16244K01V from STMicroelectronics, a premier choice in bus drivers and transceivers. Renowned for their commitment to quality and reliability, STMicroelectronics ensures this robust component delivers exceptional performance in demanding environments. Ideal for military and aerospace applications, it offers superior efficiency, low propagation delay, and extensive temperature resilience, empowering your projects with unmatched reliability and precision. Experience the advantage of trusted engineering excellence!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable construction enhances reliability and protection against environmental factors, making the product suitable for harsh conditions.

Propagation Delay At Nominal Supply: 11.5 ns

A low propagation delay ensures fast signal transitions, contributing to improved overall system performance.

Surface Mount: YES

The surface mount design enables easy integration into modern PCB layouts, optimizing space and efficiency.

No. of Functions: 4

Multiple functions provide flexibility in design and application, allowing for efficient use of space and resources in circuit design.

Screening Level: MIL-PRF-38535 Class V

Meets rigorous military standards for performance and reliability, ensuring suitability for critical applications.

Package Shape: RECTANGULAR

This shape maximizes board space while ensuring optimal placement of terminals for ease of soldering.

No. of Bits: 4

A 4-bit structure allows for efficient data handling and transmission, ideal for various applications requiring parallel data processing.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal voltage of 3.3 V makes it compatible with most logic-level circuits, enhancing versatility.

Load Capacitance (CL): 50 pF

A low load capacitance helps minimize signal distortion and enhances performance in high-speed applications.

Power Supplies (V): 3.3/5

Dual supply voltage capability offers flexibility for different operational requirements and reduces design complexity.

No. of Terminals: 48

A higher terminal count allows for more connections, facilitating complex circuit designs and expanding capabilities.

Package Style (Meter): FLATPACK

Flatpack package style aids in efficient heat dissipation and provides a compact form factor, ideal for dense circuit designs.

Maximum I (ol): 24 Amp

The capability to handle high output currents makes it suitable for heavy load applications, ensuring robust performance.

Propagation Delay (tpd): 11.5 ns

Consistent low propagation delay ensures reliable and fast data communication within circuits, crucial for high-speed applications.

Maximum Operating Temperature: 125 °C

Operating at high temperatures enhances reliability in demanding environments, such as automotive and aerospace applications.

Output Characteristics: 3-STATE

3-state output configuration provides greater design flexibility, allowing multiple devices to connect to a shared bus.

Minimum Operating Temperature: -55 °C

This wide temperature range guarantees reliable performance in extreme conditions, suitable for military and aerospace standards.

Terminal Position: DUAL

Dual terminal positioning allows for efficient routing on PCBs and helps optimize space and layout.

No. of Ports: 2

Having two ports enables dual-channel communication, increasing design possibilities and enhancing throughput.

Maximum Seated Height: 2.72 mm

A low seated height is advantageous for maintaining a low profile in space-constrained designs.

Width: 9.65 mm

The compact width enhances integration into tight layouts while maintaining robust connections.

Output Polarity: TRUE

True output polarity enhances compatibility with various logic levels and simplifies design considerations.

Minimum Supply Voltage (Vsup): 2 V

This flexibility in supply voltage allows for versatility in design, accommodating a range of operational scenarios.

Length: 15.75 mm

Compact length supports space-efficient designs while ensuring adequate functionality and connectivity.

Temperature Grade: MILITARY

Designated military grade ensures the product meets stringent reliability and performance needs for critical applications.

Total Dose (V): 300k Rad(Si)

High total dose tolerance exhibits resilience against radiation, making it suitable for space or other radiation-sensitive environments.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance, making it ideal for modern electronic applications.

Terminal Form: FLAT

Flat terminal forms facilitate easy soldering and improve electrical performance, essential in high-density PCB applications.

Packing Method: TR

Taped reel (TR) packing ensures easy handling and efficient insertion during manufacturing processes.

Terminal Pitch: 0.635 mm

A fine terminal pitch allows for more compact circuit designs, enhancing the performance and capability of modern electronics.

Control Type: ENABLE LOW

Low enable control simplifies the design process and improves power management in applications requiring efficient signaling.

Maximum Supply Voltage (Vsup): 6 V

High supply voltage tolerance adds flexibility for design options and supports a wider range of operational scenarios.

Technical Specifications

Bus Driver & Transceivers RHFAC16244K01V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

9.65 mm

Trade Compliance

RHFAC16244K01V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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