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RHFAC16244K03V

STMicroelectronics

RHFAC16244K03V by STMicroelectronics

RHFAC16244K03V by STMicroelectronics is a dual 8-bit bus driver with a ceramic, metal-sealed package, ideal for military applications. It operates b/w -55 °C to 150 °C and supports supply voltages from 2V to 6V. This robust device meets MIL-PRF-38535 Class V standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,187 parts In-Stock

1+ parts

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4,187

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Vyrian

USA . 2,866 parts In-Stock

1+ parts

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2,866

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Anansix

USA . 1,710 parts In-Stock

1+ parts

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1,710

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 268 parts In-Stock

1+ parts

$3.809

100+ parts

-

1k+ parts

$3.657

10k+ parts

$3.657

268

$3.809

-

$3.657

$3.657

IDEA Electronic Components Group

UK . 2,168 parts In-Stock

1+ parts

$25.197

100+ parts

-

1k+ parts

$22.677

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2,168

$25.197

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$22.677

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MKK Technologies

India . 2,187 parts In-Stock

1+ parts

$47.381

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2,187

$47.381

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DigiPath Technology Company

USA . 2,187 parts In-Stock

1+ parts

$47.381

100+ parts

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2,187

$47.381

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Corphita

USA . 3,521 parts In-Stock

1+ parts

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3,521

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Parana Technologies

USA . 1,034 parts In-Stock

1+ parts

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100+ parts

$30.127

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1,034

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$30.127

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Overview

Experience unmatched reliability with the RHFAC16244K03V from STMicroelectronics, a leader in high-performance semiconductor solutions. Designed for demanding environments, this robust bus driver and transceiver ensures seamless data communication while thriving under extreme temperatures. Its military-grade quality guarantees longevity and durability, making it an ideal choice for aerospace, automotive, and industrial applications. Elevate your projects with the exceptional performance and peace of mind that comes from trusting STMicroelectronics.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed construction enhances reliability, making this product suitable for harsh environments.

Surface Mount: YES

Surface mount technology allows for more compact designs and efficient manufacturing processes.

No. of Functions: 2

With two functions, this device offers versatility and can perform multiple tasks, optimizing space and cost.

Screening Level: MIL-PRF-38535 Class V

This military-grade screening ensures the device meets strict performance and reliability standards, ideal for critical applications.

Package Shape: RECTANGULAR

The rectangular shape is conducive for efficient PCB layout and integration into various designs.

No. of Bits: 8

An 8-bit architecture provides a good balance between performance and power consumption for various applications.

Nominal Supply Voltage / Vsup: 3 V

Operating at a nominal voltage of 3 V ensures compatibility with a wide range of low-power systems.

No. of Terminals: 14

The 14 terminals allow for multiple connections, facilitating complex circuit designs and integration.

Package Style (Meter): FLATPACK

Flatpack design aids in space-saving while facilitating better thermal management due to its low profile.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this product can reliably operate in demanding environments.

Minimum Operating Temperature: -55 °C

The wide temperature range allows the device to function in extreme conditions, enhancing its versatility.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in connection and integration into various circuit layouts.

No. of Ports: 2

Having 2 ports allows for multi-channel communication, increasing the device's utility in networking applications.

Maximum Seated Height: 2.72 mm

A low seated height is advantageous for space-constrained applications, optimizing PCB layout.

Width: 6.345 mm

A compact width makes the device suitable for various space-sensitive applications.

Output Polarity: TRUE

True output polarity ensures integrity in signal transmission, enhancing system performance.

Minimum Supply Voltage (Vsup): 2 V

Operating at a minimum of 2 V allows for integration with low-voltage systems, improving power efficiency.

Length: 9.5 mm

A short length contributes to a compact design, making it easier to fit into tight spaces.

Temperature Grade: MILITARY

The military temperature grade guarantees consistent performance in extreme conditions, making it suitable for defense applications.

Total Dose (V): 300k Rad(Si)

With a high total radiation dose tolerance, this product is reliable for use in radiation-prone environments.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high speed, ideal for modern applications.

Terminal Form: FLAT

Flat terminals simplify soldering and improve reliability in connections, ensuring stable operation.

Packing Method: TR

Tape and reel packing method facilitates easy handling and automated assembly processes, improving production efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between ease of soldering and compact design, suitable for various applications.

Maximum Supply Voltage (Vsup): 6 V

Supporting up to 6 V supply voltage allows for greater flexibility in application design and voltage management.

Technical Specifications

Bus Driver & Transceivers RHFAC16244K03V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-CDFP-F14

Length:

9.5 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL14,.25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Translation:

N/A

Width:

6.345 mm

Trade Compliance

RHFAC16244K03V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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