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M58LW032D110ZA6

STMicroelectronics

M58LW032D110ZA6 by STMicroelectronics

M58LW032D110ZA6 from STMicroelectronics is a 32Mbit NOR Flash memory with a 3V nominal supply, featuring asynchronous operation and a max access time of 110 ns. It operates in industrial temperatures (-40 °C to 85 °C) and supports parallel interface. Ideal for embedded applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,906 parts In-Stock

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5,906

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Digiode

USA . 4,156 parts In-Stock

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4,156

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Anansix

USA . 2,587 parts In-Stock

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2,587

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Cyclops Electronics Ltd

UK . 184 parts In-Stock

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184

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 494 parts In-Stock

1+ parts

$2.649

100+ parts

-

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$2.384

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494

$2.649

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$2.384

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MKK Technologies

India . 1,358 parts In-Stock

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$4.981

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1,358

$4.981

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DigiPath Technology Company

USA . 1,358 parts In-Stock

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$4.981

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1,358

$4.981

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Microchip USA

USA . 479 parts In-Stock

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$12.254

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479

$12.254

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AZTECH Wire

Italy . 1,037 parts In-Stock

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$20.080

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1,037

$20.080

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Corphita

USA . 4,073 parts In-Stock

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4,073

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Parana Technologies

USA . 1,474 parts In-Stock

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$3.167

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1,474

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$3.167

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Kepictronics

USA . 400 parts In-Stock

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Overview

Unlock limitless potential with the M58LW032D110ZA6 from STMicroelectronics—a leader in quality and innovation. This versatile flash memory offers outstanding performance for industrial applications, ensuring reliability in challenging environments. With its low power consumption and efficient design, this memory solution enhances your product's capabilities while minimizing costs. Experience superior durability and efficiency that elevate your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, enhancing product longevity.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, making it easier to integrate into compact designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout efficiency on circuit boards, maximizing available space.

Operating Mode: ASYNCHRONOUS

Asynchronous operation reduces latency and improves access speeds, ensuring fast data retrieval.

Nominal Supply Voltage / Vsup (V): 3

A nominal supply voltage of 3V is standard for many electronics, ensuring compatibility across a wide range of devices.

Power Supplies (V): 3/3.3

Compatibility with both 3V and 3.3V supplies allows flexibility in usage across various applications.

No. of Terminals: 64

Having 64 terminals enables efficient data handling and connections, suitable for various complex applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE

A grid array package in a thin profile helps in reducing overall product height while maintaining high performance.

Alternate Memory Width: 8

The option for 8-bit memory width offers versatility in applications depending on data requirements.

Maximum Operating Temperature: 85 °C

Designed to operate at temperatures up to 85 °C, making it suitable for industrial applications.

Organization: 2MX16

The 2M x 16 organization provides substantial storage capacity while supporting fast data processing.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold (-40 °C) expands the product's usability in harsh environments.

No. of Sectors/Size: 32

32 sectors allow for effective data management and organization, improving the efficiency of read/write cycles.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides superior solderability and durability during installation.

Terminal Position: BOTTOM

Bottom terminal positioning aids in effective heat dissipation and improves overall device stability.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm helps achieve compact designs, ideal for modern electronics.

Width: 10 mm

A width of 10 mm is suitable for various applications, ensuring easy integration into standard circuit designs.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V allows compatibility with a wider range of power sources.

Page Size (words): 4/8

Supports flexibility in read/write operations depending on application needs, optimizing performance.

Type: NOR TYPE

NOR type memory provides ease of access and versatility in programming, ideal for embedded applications.

Common Flash Interface: YES

A common flash interface enhances compatibility with a variety of devices and systems.

Length: 13 mm

A compact length of 13 mm ensures space efficiency in product design.

Programming Voltage (V): 3

Single programming voltage simplifies system design and reduces components needed, enhancing efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in challenging operating conditions, perfect for critical applications.

Technology: CMOS

CMOS technology enables low power consumption while maintaining high speed and performance.

Parallel or Serial: PARALLEL

Parallel operation allows faster data transfer rates, enhancing overall system speed and efficiency.

Terminal Form: BALL

Ball terminal form provides excellent mechanical performance and reduces electrical resistance.

Sector Size (Words): 128K

Larger sector sizes of 128K improve efficiency in data management and programming.

Maximum Supply Current: 30 mA

A maximum supply current of 30 mA is efficient for low-power applications while supporting high performance.

No. of Words: 2097152 words

A capacity of 2,097,152 words provides substantial storage space for applications requiring high memory.

Memory Width: 16

A 16-bit memory width offers efficient data processing, ideal for a variety of digital applications.

Terminal Pitch: 1 mm

A 1 mm terminal pitch allows for dense PCB layouts, maximizing available space without sacrificing performance.

No. of Words Code: 2M

2M words indicate a substantial storage capacity, enabling complex application support.

Command User Interface: YES

A command user interface enhances ease of use and programmability, ideal for developers.

Ready or Busy: YES

Ready or busy indication allows for effective communication with the host, optimizing data operations.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a variety of power systems.

Memory Density: 33554432 bit

High memory density of 33,554,432 bits supports extensive data storage needs for advanced applications.

Memory IC Type: FLASH

Being a flash memory IC, it enables non-volatile storage of data, providing reliability and durability.

Maximum Standby Current: 0.00004 Amp

Extremely low maximum standby current ensures energy efficiency, making it suitable for battery-powered devices.

Maximum Access Time: 110 ns

A maximum access time of 110 ns provides fast read speeds, enhancing performance in time-sensitive applications.

Technical Specifications

Flash Memory M58LW032D110ZA6 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

110 ns

Alternate Memory Width:

8

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e0

Length:

13 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

32

No. of Terminals:

64

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Page Size (words):

4/8

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

128K

Maximum Standby Current:

.00004 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Toggle Bit:

NO

Type:

NOR TYPE

Width:

10 mm

Trade Compliance

M58LW032D110ZA6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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