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74V2T08STR

STMicroelectronics

74V2T08STR by STMicroelectronics

74V2T08STR by STMicroelectronics is a dual-input CMOS logic gate with an 8.5 ns propagation delay and operates at a nominal voltage of 5V. It features a compact SOIC package, ideal for space-constrained applications. This device supports military-grade temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,207 parts In-Stock

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Digiode

USA . 1,691 parts In-Stock

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1,691

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Anansix

USA . 477 parts In-Stock

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477

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Microfarads

USA . 25 parts In-Stock

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25

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Microchip USA

USA . 118 parts In-Stock

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$1.389

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118

$1.389

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AZTECH Wire

Italy . 608 parts In-Stock

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$16.830

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608

$16.830

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IDEA Electronic Components Group

UK . 1,407 parts In-Stock

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$23.815

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$21.434

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$23.815

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$21.434

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MKK Technologies

India . 1,632 parts In-Stock

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$44.783

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1,632

$44.783

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DigiPath Technology Company

USA . 1,632 parts In-Stock

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$44.783

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$44.783

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Native Components

USA . 982 parts In-Stock

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$60.952

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$58.514

982

$60.952

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$58.514

Northwest PG Solutions

USA . 287 parts In-Stock

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$67.048

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287

$67.048

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Component Stockers USA

USA . 597 parts In-Stock

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$99.990

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$99.990

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Parana Technologies

USA . 2,272 parts In-Stock

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$28.475

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Corphita

USA . 624 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Overview

Experience unparalleled reliability and performance with the 74V2T08STR from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This dual-input logic gate is designed for demanding applications, providing swift response times and exceptional thermal stability. Its compact, low-profile design ensures seamless integration into any electronic project, while ST's commitment to quality guarantees longevity and efficiency. Elevate your innovations with a component that delivers unmatched value and scalability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures excellent protection against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 8.5 ns

With a fast propagation delay, this logic gate allows for high-speed operation, making it ideal for timing-sensitive applications.

Surface Mount: YES

Being a surface-mount device, it provides ease of integration into compact circuit designs and makes automated assembly simpler.

No. of Functions: 2

The dual functionality offers versatility, allowing for the implementation of complex logic operations in a single package.

No. of Inputs: 2

With two inputs, this logic gate can be used in a variety of basic logic functions, providing flexibility in circuit design.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and space-saving in circuit designs, optimizing PCB real estate.

Nominal Supply Voltage / Vsup: 5 V

Operating at a standard supply voltage of 5V enhances compatibility with a wide range of systems and devices.

Load Capacitance (CL): 50 pF

A manageable load capacitance allows compatibility with various downstream components, ensuring stable performance.

Power Supplies (V): 5

This device operates on a common voltage, simplifying power supply requirements in electronic systems.

No. of Terminals: 8

Eight terminals provide ample connectivity options for integrating the device into various circuits.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small and low-profile design is ideal for space-constrained applications, making it suitable for portable electronics.

Maximum I (ol): 8 Amp

The ability to handle up to 8 Amps allows this logic gate to drive larger loads, expanding its range of applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this device can function reliably in harsh conditions, making it suitable for military applications.

Minimum Operating Temperature: -55 °C

Its ability to operate in extreme cold ensures reliability in various environments, especially in aerospace and military applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good solderability and corrosion resistance, leading to reliable long-term performance.

Terminal Position: DUAL

The dual terminal position supports efficient component placement on the PCB, facilitating simpler layouts.

Maximum Seated Height: 1.45 mm

The low seated height is ideal for compact designs, allowing for a slim profile in densely populated boards.

Width: 1.625 mm

A compact width enables efficient use of board space, contributing to the miniaturization of electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

The flexibility in nominal supply voltage max and min allows for adaptive use in varying circuit configurations.

Maximum Time At Peak Reflow Temperature: 30 s

A relatively safe reflow time ensures that the device is robust enough to withstand the soldering process without damage.

Peak Reflow Temperature: 260 °C

The high reflow temperature capability indicates robustness in soldering processes, enhancing manufacturing reliability.

Length: 2.9 mm

A short length assists in maintaining a compact board layout, suitable for modern, space-efficient electronics.

Temperature Grade: MILITARY

The military-grade temperature rating indicates reliability in extreme conditions, perfect for critical applications.

Technology: CMOS

CMOS technology ensures lower power consumption and higher noise immunity, contributing to energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals provide stable connections and easy handling during assembly, ensuring consistent performance.

Packing Method: TR

The tape and reel packing allows for automated placement and high-volume production, streamlining manufacturing processes.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is ideal for modern compact designs, making this device versatile for various applications.

Maximum Supply Voltage (Vsup): 5.5 V

The accommodating maximum supply voltage allows for variability in design without risking component damage.

Technical Specifications

Logic Gates 74V2T08STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

74V2T08STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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