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TIG064E8-TL-H

Onsemi

TIG064E8-TL-H by Onsemi

The Onsemi TIG064E8-TL-H is an N-CHANNEL IGBT with a max collector-emitter voltage of 400V and operating temp of 150 °C. Ideal for surface mount applications, it features a gate-emitter threshold voltage of 0.9V. Suitable for various power electronics systems requiring high-voltage switching capabilities.

Median Price

$0.973

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,177,549 parts In-Stock

1+ parts

-

100+ parts

$0.938

1k+ parts

$0.778

10k+ parts

$0.694

1,177,549

-

$0.938

$0.778

$0.694

Verical

USA . 1,153,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.973

10k+ parts

$0.868

1,153,830

-

-

$0.973

$0.868

DigiKey

USA . 44,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.170

10k+ parts

-

44,624

-

-

$1.170

-

Distributors (In-Stock)

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Digiode

USA . 2,496 parts In-Stock

1+ parts

$0.731

100+ parts

-

1k+ parts

-

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2,496

$0.731

-

-

-

Vyrian

USA . 257 parts In-Stock

1+ parts

$0.769

100+ parts

-

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-

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257

$0.769

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-

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DigiKey Marketplace

USA . 44,624 parts In-Stock

1+ parts

-

100+ parts

$0.800

1k+ parts

-

10k+ parts

-

44,624

-

$0.800

-

-

Chip Stock

USA . 17,421 parts In-Stock

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17,421

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,293 parts In-Stock

1+ parts

$0.692

100+ parts

-

1k+ parts

-

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2,293

$0.692

-

-

-

Corohmni

South Africa . 264 parts In-Stock

1+ parts

$0.769

100+ parts

-

1k+ parts

-

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264

$0.769

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-

-

Microchip USA

USA . 339 parts In-Stock

1+ parts

$4.810

100+ parts

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339

$4.810

-

-

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Continental Prestige Electronics

USA . 1,169,624 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.736

10k+ parts

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1,169,624

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-

$0.736

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TANS Electronics

Latvia . 7,080 parts In-Stock

1+ parts

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7,080

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-

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Problanco Electronics

Mexico . 6,629 parts In-Stock

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6,629

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-

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SupplyDigital Components

Austria . 6,133 parts In-Stock

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6,133

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Kulean Microsystems

USA . 5,781 parts In-Stock

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5,781

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UHIMA Technologies

Türkiye . 53 parts In-Stock

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53

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Overview

Experience superior performance with the TIG064E8-TL-H by Onsemi, a leading manufacturer in the industry. This N-CHANNEL IGBT offers reliable power control in a compact surface mount package, making it ideal for various applications. From motor drives to renewable energy systems, this transistor delivers efficiency and precision. Trust Onsemi's reputation for quality and innovation to provide you with the best solution for your power management needs. Unlock the potential of your projects with the TIG064E8-TL-H today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs offer lower conduction losses and higher efficiency compared to P-channel IGBTs, making this product a good choice for high power applications.

Surface Mount: YES

Surface mount IGBTs are more compact, easier to integrate into circuit designs, and are suitable for automated assembly processes, making this product a good choice for modern electronics manufacturing.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can handle demanding thermal environments and ensure reliable performance in a variety of conditions.

Maximum Collector-Emitter Voltage: 400 V

The high maximum collector-emitter voltage allows this IGBT to be used in high voltage applications, providing flexibility and versatility in circuit design.

Maximum Gate-Emitter Voltage: 4 V

The low maximum gate-emitter voltage provides efficient gate control and helps minimize power losses in the switching process, contributing to improved overall efficiency.

Maximum Gate-Emitter Threshold Voltage: 0.9 V

The low gate-emitter threshold voltage ensures fast switching speeds and reduced power dissipation, making this IGBT suitable for high frequency applications.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish offers good solderability and reliability, ensuring secure connections and long-term performance of the IGBT in electronic circuits.

Maximum Time At Peak Reflow Temperature (s): 30

With a short maximum time at peak reflow temperature, this IGBT can withstand reflow soldering processes without compromising its electrical characteristics, making it easy to integrate into manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance enables this IGBT to endure the harsh conditions of reflow soldering without experiencing thermal degradation, ensuring the product's reliability during manufacturing.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) TIG064E8-TL-H attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

400 V

Maximum Gate-Emitter Threshold Voltage:

.9 V

Maximum Gate-Emitter Voltage:

4 V

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TIG064E8-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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